Each fully tested quarter wafer is supplied with a minimum number of guaranteed good die. A full data pack that includes a GUI-based clickable wafer map is also furnished. The wafer map provides color-coded grade information for each die along with a top-level summary (die yield, results of each individual test, and final grade). Clicking any die on the map displays a detailed test summary plot that contains test images, histograms for the test images, pixelwise differences used to reject bad pixels with pass/fail thresholds indicated, bad pixel map image and a bar graph showing the measured supply currents in the screen test state.
To further simplify the evaluation and development experience using the Oxygen RD0092, Senseeker offers an evaluation kit that can be used for cooled or uncooled lab testing. The evaluation kit comes complete with software and is easily connected to a host PC with a frame grabber card for image display.
"We are focused on making it as inexpensive and easy as possible for customers to get up-and-running with Senseeker's commercial readout products," said Kenton Veeder, President at Senseeker Engineering. "Our goal is to lower the barriers-to-entry of using advanced digital readout ICs by making them available off-the-shelf in lower quantities than a full wafer. We also believe that it is critical to provide the whole ecosystem of tools that are required to expedite the development process."
PizzaHurt business model?
ReplyDeleteJust like a pizza, you can now purchase DROIC wafers by the slice! 😁
DeleteTakeout or delivery?
ReplyDeleteSenseeker offer full service including delivery!
DeleteThe intention is that a producer of compound semiconductor FPA like MCT or Ingaas bonds the FPA on top of the ROIC, right? What is the interface on top of the ROIC in terms of electrical contact? Is there a pad with 8u pitch for every pixel? Is there a electrical "standard" for the signal of a FPA pixel? I suppose 8u is no longer possible with microbumps, so I suppose the connection has to be done with hybrid bonding, right? Are there companies out there that are yet capable to produce a FPA that works with a 8u ROIC?
ReplyDeleteYou mean like Sony 5µm ROIC for InGaAs ? ;)
DeleteNo, i wasnt thinking about sony, im just curious in general... what is the interface of such a roic to the photodiode layer?
Deletethinking of it again... are there only the photodiodes in the FPA layer? so one one side there might be a global ground for all photodiodes and the interface to the ROIC in each pixel is then the kathode of the photodiode. Is this correct?
DeleteI think you are mistaking PDA (InGaAs photodiodes for example) with FPA (PDA+ROIC). Most of InGaAs is done with Indium micro-bumps. It becomes complicated (i.e. low yield, etc) below 10-15µm. People like Sony are using copper for the hybridization. Other people uses other material and techniques, but I cannot tell you more here :D
ReplyDeleteIt is not that complicated to make PDA with a pitch below 10µm. 8µm is definitely doable. I went to 7.5 myself. With some work and the good tools, 5µm is "not so hard".
Yes, it is mainly the photodiodes on the PDA side.
Thanks Simon, well... I should have googled before asking here ;-) it seems that 'direct injection' does refer to the kathode of the photodiode in the PDA being connected to the ROIC like in the schematic here: https://www.researchgate.net/figure/fig3_266734109. of course you find a lot of interesting infos once you start searching. also for example about bolometers, where resistors are connected to the ROIC: https://www.researchgate.net/figure/Electrical-schematic-of-the-FPA-and-ROIC_fig4_46133365
Deletei was using cmos sensors a bit (not an expert at all, just a user), find it interesting how other types of sensors work. I never thought how this layered mct or ingaas sensors worked internally...