- Due to ever increasing number of special process tweaks in modern sensor manufacturing, "CMOS Process with Imager Options" migrates towards "Imager Process, CMOS Capable".
- ST is going to use 12" Cu wafers for 1.4um pixel production.
- 3D sensor-analog front end integration gives only 30% of full well increase for 1.4um pixels, despite the added process complexity and cost.
- Same BW BSI images and graphs appear. I wonder why ST does not show its color results. It's hard to support claims on BSI superiority without bayer-patterned sensor QE graphs.
Tuesday, August 05, 2008
ST On Image Sensor Challenges
Jean-Luc Jaffard from ST imaging Division delivered a good image sensor presentation on Design Automation and Test in Europe Conference (DATE'08). Some interesting parts from the presentation:
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