Monday, October 20, 2008

TSV Rollercoaster

Philip Garrou from Semiconductor International anticipates a surge of activity in TSV and 3D integration in image sensors. He summarizes TSV activities by all the leading image sensor makers in his nice blog message from a month ago. A newer post paints a bigger picture where image sensor TSV adoption is just a first step of large scale TSV move.
Posted by Vladimir Koifman at 15:58

2 comments:

  1. russJuly 5, 2009 at 9:05 PM

    Why is TSV important for CIS? Doesn't BSI get the pads where they need to be with no effort?

    ReplyDelete
  2. Vladimir KoifmanJuly 5, 2009 at 10:50 PM

    BSI needs TSV even more. The pads in BSI are stacked between the two bonded wafers and there is no access to them, if not TSV.

    ReplyDelete

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