With respect to process technology the project will focus on:
- 3D integration technology with through-silicon vias, allowing a separation of the photodetectors on the one hand and the pixel read-out electronics on the other hand into 2 separate layers.
- Technologies for more sensitive pixels
- Pixel sensitivity for wavelengths outside the visual light spectrum.
- Microlenses that are optimized for NIR and UV as well as visual light and that offer additional functionalities
Thanks to P.R. for sending me the link!