EVG's GEMINI FB system is designed for integrated and automated wafer loading, alignment, bonding and unloading of bonded wafers up to 300 mm in diameter. "We continually focus on innovating our product lines with enhancements such as this latest extension to our flagship GEMINI FB platform—the industry's first field-proven 300-mm fusion wafer bonding system readily available," says Paul Lindner, executive technology director for EVG. The company reports that it has already received orders from major integrated device manufacturers for the upgraded platform, with deliveries slated for the end of this calendar year.
|EVG Gemini FB|
ElectoIQ: Phil Garrou posted a short review of Sony licensing Ziptronix wafer bonding technology together with the history of Ziptronix' lawsuits.
And relatively recent Ziptronix' Youtube video:
Update Jan 17, 2012: Another Ziptronix video has been posted emphasizing Sony design win in iPhone 4S.