Thursday, September 08, 2011

Wafer Bonding News

PR Newswire: EV Group (EVG) announced that it is launching a new flagship model in its field-proven GEMINI FB fusion wafer bonding family that increases system throughput to up to 20 wafers per hour (up to 14 wafers per hour as stated on EVG site). The upgrade includes enhanced automation capabilities to enable customers to achieve higher levels of manufacturing efficiency for such applications as BSI image sensors and 3D integration of CMOS image sensors.

EVG's GEMINI FB system is designed for integrated and automated wafer loading, alignment, bonding and unloading of bonded wafers up to 300 mm in diameter. "We continually focus on innovating our product lines with enhancements such as this latest extension to our flagship GEMINI FB platform—the industry's first field-proven 300-mm fusion wafer bonding system readily available," says Paul Lindner, executive technology director for EVG. The company reports that it has already received orders from major integrated device manufacturers for the upgraded platform, with deliveries slated for the end of this calendar year.

EVG Gemini FB

ElectoIQ: Phil Garrou posted a short review of Sony licensing Ziptronix wafer bonding technology together with the history of Ziptronix' lawsuits.

And relatively recent Ziptronix' Youtube video:



Update Jan 17, 2012: Another Ziptronix video has been posted emphasizing Sony design win in iPhone 4S.

2 comments:

  1. thanks for putting this together vlad. you're the best.

    EK

    ReplyDelete
  2. When does Aptina practice bsi technology?

    ReplyDelete

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