Tuesday, December 11, 2012

Primesense to Unveil New, More Compact 3D Camera

PR Newswire: Primesense announces its next generation embedded 3D sensor, Capri, demonstrating a small form factor and low cost. The new reference design utilizes Capri - PrimeSense's next-generation of depth acquisition SoC, with improved algorithms including multi-modal 3D sensing techniques. Its thin form factor is aimed to embedding in consumer electronics devices such as PCs, All –in-One PCs, tablets, laptops, mobile phones, TVs, consumer robotics and more.

"Using cutting-edge technologies, our newest generation of sensors is robust, accurate and affordable," said Inon Beracha, CEO, PrimeSense. "With a mind-blowing size reduction, Capri's size is about x10 smaller than the PrimeSense's current generation of 3D sensors and it is certainly the smallest 3D sensor in the world. Capri is small enough to fit into today's most popular Smartphones while still providing the highest depth performance (short and long range). We see Capri adding depth sensing and Natural Interaction to numerous devices and markets, revolutionizing the user experience and usability in ways that no one could imagine until now".

Samples for development and integration for OEMs will be available by mid-2013.

4 comments:

  1. Is power consumption 10 times lower?
    A phones battery is very limited.

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  2. There have been many other gesture-sensing announcements in the past few months; any idea how this compares?

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  3. If they can use a CMOS micro-camera from wafer-level and also this same technique for their laser projector, they can indeed make a very tiny module. If it is for close use, the laser power can be considerably reduced.

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  4. How about this chip's wafer foundry? 200mm or 300mm wafer?
    I think Apple will adopt this fancy technology in new products.

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