The OV12890 can fit into 10 x 10 mm modules with a z-height of 6 mm. The sensor is currently available for sampling and is expected to enter volume production in Q4 2016.
"As cameras for premium smartphones continue to improve, we see the resolution race slowing down and increasing emphasis placed on pixel performance and image sensor size as key to ever-higher quality mobile images and video," said James Liu, senior technical marketing manager at OmniVision. "The OV12890 is our newest big-pixel stacked die image sensor for the mobile market, and represents one of our strongest offerings for premium smartphones. The feature-rich OV12890 captures exceptional images and video in a compact package, making it a top-flight imaging solution for flagship mobile devices."
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