2024 SEMI MEMS and Imaging Summit program announced

SEMI MEMS & Imaging Sensors Summit 2024 will take place November 14-15 at the International Conference Center Munich (ICM), Messe Münich in Germany.

Thursday, 14^th November 2024 

Session 1: Market Dynamics: Landscape and Growth Strategies

09:00  Welcome Remarks
Laith Altimime, President, SEMI Europe

09:20  Opening Remarks by MEMS and Imaging Committee Chair
Philippe Monnoyer, VTT Technical Research Center of Finland Ltd

09:25  Keynote: Smart Sensors for Smart Life – How Advanced Sensor Technologies Enable Life-Changing Use Cases
Stefan Finkbeiner, General Manager, Bosch Sensortec

09:45  Keynote: Sensing the World: Innovating for a More Sustainable Future
Simone Ferri, APMS Group Vice President, MEMS sub-group General Manager, STMicroelectronics

10:05  Reserved for Yole Development

10:25  Key Takeaways by MEMS and Imaging Committee Chair
Philippe Monnoyer, VTT Technical Research Center of Finland Ltd

10:30  Networking Coffee Break

Session 2: Sustainable Supply Chain Capabilities

11:10  Opening Remarks by Session Chair
Pawel Malinowski, Program Manager and Researcher, imec

11:15  A Paradigm Shift From Imaging to Vision: Oculi Enables 600x Reduction in Latency-Energy Factor for Visual Edge Applications
Charbel Rizk, Founder & CEO, Oculi

11:35  Reserved for Comet Yxlon

11:55  Key Takeaways by Session Chair
Pawel Malinowski, Program Manager and Researcher, imec

12:00  Networking Lunch

Session 3: MEMS - Exploring Future Trends for Technologies and Device Manufacturing

13:20  Opening Remarks by Session Chair
Pierre Damien Berger, MEMS Industrial Partnerships Manager, CEA LETI

13:25  Unlocking Novel Opportunities: How 300mm-capable MEMS Foundries Will Change the Game
Jessica Gomez, CEO, Rogue Valley Microdevices

13:45  Trends in Emerging MEMS
Alissa Fitzgerald, CEO, A.M. Fitzgerald & Associates, LLC

14:05  The Most Common Antistiction Films are PFAS, Now What?
David Springer, Product Manager, MVD and Release Etch Products, KLA Corporation

14:25  Reserved for Infineon

14:45  Latest Innovations in MEMS Wafer Bonding
Thomas Uhrmann, Director of Business Development, EV Group

15:05  Key Takeaways by Session Chair
Pierre Damien Berger, MEMS Industrial Partnerships Manager, CEA LETI

Session 4: Imaging - Exploring Future Trends for Technologies and Device Manufacturing

15:10  Opening Remarks by Session Chair
Stefano Guerrieri, Engineering Fellow and Key Expert Imager & Sensor Components, ams OSRAM

15:15  Topic Coming Soon
Avi Bakal, CEO & Co-founder, TriEye

15:35  Active Hyperspectral Imaging Using Extremely Fast Tunable SWIR Light Source
Jussi Soukkamaki, Lead, Hyperspectral & Imaging Technologies, VTT Technical Research Centre of Finland Ltd

15:55  Networking Coffee Break

16:40  Reserved

17:00  Reserved for CEA-Leti

17:20  Reserved for STMicroelectronics

17:40  Key Takeaways by Session Chair
Stefano Guerrieri, Engineering Fellow and Key Expert Imager & Sensor Components, ams OSRAM

Friday, 15th November 2024 

Session 5: MEMS and Imaging Young Talent

09:00  Opening Remarks by Session Chair
Dimitrios Damianos, Project Manager, Yole Group

09:05  Unlocking Infrared Multispectral Imaging with Pixelated Metasurface Technology
Charles Altuzarra, Chief Executive Officer & Co-founder, Metahelios

09:10  Electrically Tunable Dual-Band VIS/SWIR Imaging and Sensing
Andrea Ballabio, CEO, EYE4NIR

09:15  FMCW Chip-Scale LiDARs Scale Up for Large Volume Markets Thanks to Silicon Photonics Technology
Simoens François, CEO, SteerLight

09:20  ShadowChrome: A Novel Approach to an Old Problem
Geoff Rhoads, Chief Technology Officer, Transformative Optics Corporation

09:25  Feasibility Investigation of Spherically Bent Image Sensors
Amit Pandey, PhD Student, Technische Hochschule Ingolstadt

09:30  Intelligence Through Vision
Stijn Goossens, CTO, Qurv

09:35  Next Generation Quantum Dot SWIR Sensors
Artem Shulga, CEO & Founder, QDI Systems

09:40  Closing Remarks by Session Chair
Dimitrios Damianos, Project Manager, Yole Group

09:45  Networking Coffee Break

Session 6: Innovations for Next-Gen Applications: Smart Mobility

10:35  Opening Remarks by Session Chair
Bernd Dielacher, Business Development Manager MEMS, EVG

10:40  Reserved

11:00  New Topology for MEMS Advances Performance and Speeds Manufacturing
Eric Aguilar, CEO, Omnitron Sensors, Inc.

11:20  Key Takeaways by Session Chair
Bernd Dielacher, Business Development Manager MEMS, EVG

Session 7: Innovations for Next-Gen Applications: Health

11:25  Opening Remarks by Session Chair
Ran Ruby YAN, Director of HMI & HealthTech Business Line, GLOBALFOUNDRIES

11:30  Reserved

11:50  Sensors for Monitoring Vital Signs in Wearable Devices
Markus Arzberger, Senior Director, ams-OSRAM International GmbH

12:10  Pioneering Non-Invasive Wearable MIR Spectrometry for Key Health Biomarkers Analysis
Jan F. Kischkat, CEO, Quantune Technologies GmbH

12:30  Key Takeaways by Session Chair
Ran Ruby YAN, Director of HMI & HealthTech Business Line, GLOBALFOUNDRIES

12:35  End of Conference Reflections by MEMS and Imaging Committee Chair
Philippe Monnoyer, VTT Technical Research Center of Finland Ltd

12:45  Closing Remarks
Laith Altimime, President, SEMI Europe

12:50  Networking Lunch