IEEE SENSORS 2024 --- image sensor topics announced

The list of topics and the authors for the following two events related to image sensor technology have been finalized for the IEEE SENSORS 2024 Conference. The conference will be held in Kobe, Japan, from 20-23 October 2024. It will provide the opportunity to hear world class speakers in the field of image sensors and to sample the sensor ecosystem that extends beyond to see how imaging fits in.

Workshop: “From Imaging to Sensing: Latest and Future Trends of CMOS Image Sensors” [Sunday, 20 October]

Organizers: Sozo Yokogawa (Sony Semiconductor Solutions corp.) • Erez Tadmor (onsemi)

“Trends and Developments in State-of-the-Art CMOS Image Sensors”, Daniel McGrath, TechInsights
“CMOS Image Sensor Technology: what we have solved, what are to be solved”, Eiichi Funatsu, OMNIVISION
“Automotive Imaging: Beyond human Vision”, Vladi Korobov, onsemi
“Recent Evolution of CMOS Image Sensor Pixel Technology”, Bumsuk Kim et al., Samsung Electronics
“High precision ToF image sensor and system for 3D scanning application”, Keita Yasutomi, Shizuoka University
“High-definition SPAD image sensors for computer vision applications”, Kazuhiro Morimoto, Canon Inc.
“Single Photon Avalanche Diode Sensor Technologies for Pixel Size Shrinkage, Photon Detection Efficiency Enhancement and 3.36-pm-pitch Photon-counting Architecture”, Jun Ogi, Sony Semiconductor Solutions Corp.
“SWIR Single-Photon Detection with Ge-on-Si Technology”, Neil Na, Artilux Inc.
“From SPADs to smart sensors: ToF system innovation and AI enable endless application”, Laurent Plaza & Olivier Lemarchand, STMicroelectronics
“Depth Sensing Technologies, Cameras and Sensors for VR and AR”, Harish Venkataraman, Meta Inc.
 
Focus session: Overview of The Focus Sensor on Stacking in Image Sensor, [Monday, 21 October]

Orgainizer: S-G. Wu, Brillnics

Co-chairs: DN Yaung, TSMC; John McCarten, L3 Harris

Over the past decade, 3-dimensional (3D) wafer level stacked backside Illuminated (BSI) CMOS image sensors (CIS) have achieved the rapid progress in mass production. This focus session on stacking in image sensors will have 4 invited papers to explore the sensor stack technology evolution from process development, circuit architecture to AI/edge computing in system integration.

“The Productization of Stacking in Image Sensors”, Daniel McGrath, TechInsights
“Evolution of Image Sensing and Computing Architectures with Stacking Device Technologies”, BC Hseih, Qualcomm
“Event-based vision sensor”, Christoph Posch, Prophesee
“Evolution of digital pixel sensor (DPS) and advancement by stacking technologies”, Ikeno Rimon, Brillnics