Yahoo: Cypress announced that it has partnered with InPhase Technologies in holographic data storage, to supply a CMOS image sensor solution for InPhase's Tapestry holographic data storage system.
Cypress and InPhase have collaborated since 2005 to develop a sensitive and fast CMOS image sensor to meet the high-speed reading of data recorded by InPhase's Tapestry drive. The Cypress CMOS imager features a digital interface and is sized with a pixel count of 1696 X 1710 and a pixel pitch of 8um. The imager enables data to be read at 500fps.
Holographic storage delivers high capacity by recording data throughout the volume of the recording material, and not just on the surface. With each flash of the laser, a data page of approximately 1 million bits is recorded. Each data page is located at a unique address within the material and several hundred pages of data, each with their own unique address, are recorded in the same location of the medium. Each of these collections of data pages is then referred to as a "book." This new recording technique enables more holograms to be stored in the same volume of material by overlapping not only pages, but also books of data. This dramatically increases the storage density.
Friday, June 29, 2007
OmniVision and Scalado Collaborate
Yahoo: OmniVision added a new hardware feature to its new 1.75um 3MP OV3640 CameraChip enabling cameras to take advantage of Scalado's SpeedView technology.
"Long capture and shot-to-shot times have been a constant complaint ever since the megapixel race began," said Sami Niemi, CTO for Scalado. "The WYSIWYG Capturing technology makes it possible to really capture the moment, which is the true essence of any camera phone. Add to that instant photo file maneuvering so users can find and share pictures quickly and easily, and we have addressed another major complaint cited by the majority of camera phone users."
Omnivision also announced volume shipments of OV6680 Square Graphics Array (SGA) sensor with its unique 400 x 400 array.
"Long capture and shot-to-shot times have been a constant complaint ever since the megapixel race began," said Sami Niemi, CTO for Scalado. "The WYSIWYG Capturing technology makes it possible to really capture the moment, which is the true essence of any camera phone. Add to that instant photo file maneuvering so users can find and share pictures quickly and easily, and we have addressed another major complaint cited by the majority of camera phone users."
Omnivision also announced volume shipments of OV6680 Square Graphics Array (SGA) sensor with its unique 400 x 400 array.
Micron CIS Business Improving
Micron has announced its Q2 results yesterday. SeekingAlpha conference call transcript reveals few details on image sensor business state.
Mike Sadler, VP of Worldwide Sales says:
We are seeing an improving demand for image sensors as the mobile phone supply chain has recovered from an inventory overhang dating back to last year.
Our customers in the mobile phone arena appear to have worked through inventories, and are now back to consuming Micron image senators to meet current sell-through demand. Our imaging business saw only a moderate revenue decline quarter-over-quarter, after substantially negative growth associated with the inventory correction in fiscal Q2.
The entire portfolio of sensors utilizing our advanced 1.7-micron pixel, ranging from VGA through 8-megapixel density, are being embraced by our customers. We have stacked up a number of design wins that are in the early stage of production, or moving to production throughout the balance of the year.
Peter Trigarszky- Citigroup
That is helpful. And then on image sensors, if you could talk about, I know last quarter you had lowered your loadings going into this quarter. Could you talk about how inventory could be worked down there, or how you see that potentially progressing? Also in VGA, what are your plans for competing in that space from a cost perspective? And maybe give us some sense of low end versus high end, how that mix is progressing for you?
Mike Sadler
Sure, sure. I mentioned that we brought our finished goods inventory down on image sensors. We are at about a quarters worth of finished goods inventory. We had crept up slightly higher than that as we exited fiscal Q2. We will take inventories down again in the current quarter.
So we are getting back to where we consider to be a comfortable level of finished goods inventory on image sensors. We are continuing to take more market share in the high end, our 5-megapixel sensor has been a hit in the marketplace on a couple of high end phones, and the volumes continue to increase with that particular chip.
On the low end of the market, the VGA chip, we have introduced a 1/11" VGA chip, or are in process of introducing it to the market currently, and that is basically going to be our low end cost-aggressive solution, if you will, to trying to attack the low end of the market.
Daniel Amir - WR Hambrecht & Co.
Can you comment what is your image sensor mix here on 1-megapixel and above and VGA?
Mike Sadler
Sure. Let me just do some quick math here. In the quarter that we just completed, at 1-megapixel and above, well, well over half. Probably closer to two-thirds to three-quarters of total unit shipments were 1-megapixel and above.
Eric Rubel - Miller Tabak Roberts
Could you break out the segment revenue for image sensor, and talk about the segment gross margin?
Bill Stover, CFO
The revenues for the quarter came in just above 10% of the total, and we have not been giving specific margin information.
Eric Rubel - Miller Tabak Roberts
Okay. Then if I can ask on, back in September in New York at the Analyst Day, you guys updated us on process at, I believe, 0.11 pixel size 1.75, and a wafer size of about 200-millimeter. Can you update us on how you see that playing out for fiscal 2008 for process, pixel size, and wafer? And I have one more follow-up.
Bill Stover
Well, at the leading edge, a lot of our imagers now are transitioning to the 1.75 Micron pixel technology. We previously announced the 1.4 Micron pixel but that will be a bigger part of our production, a little further out in the future. And was the other question on 200-millimeter versus 300-millimeter wafer capacity?
Eric Rubel - Miller Tabak Roberts
Yes.
Bill Stover
300-millimeter wafer capacity obviously continues to increase as a percent of the total as we ramp out Lehigh, and complete the conversion at tech. I think the way to think of it is in terms of…
Eric Rubel - Miller Tabak Roberts
I am sorry to interrupt, but I am speaking specifically with image sensor, for the image sensor segment, that all of those products were being done on 200-millimeter. Any change on that?
Steve Appleton
That is right. We continue to manufacture the image sensor on 200-millimeter. There has always been discussion around the industry thinking about running 300-millimeter, in fact I think one of our competitors has done so, I think they are primarily doing that, because they have old 300-millimeter equipment they can't really use anymore for memory.
In our particular case, when we look at the cost crossover on that, we don't think it will be cost effective for quite some time. The reason is really a pretty simple one. If you want to go out and buy a piece of a 300-millimeter equipment today then you're going to buy a piece of equipment that can run 50, 60-nanometer type capability, and frankly none of us are running our image sensors on processors that are down at 50 or 60-nanometers, nobody does.
So you are paying for the tool, but you're not utilizing it for the capability. In our particular case, I think as many of you know, we run a model where it's on a tool set that as an X minus 1 or X minus 2 generation, and that tool set has already used its life so to speak for us on the memory front, so it's very, very cost effective for us to use it, because in large part it has been depreciated, and it is a tool set that we would have sold for lower cents on the dollar, then actually get use out of it. So, from our perspective, it’s a great model that works for us. And that’s why we continue to do the 200-millimeter.
As a follow-on note, there clearly will be a time when we are in that situation for 300 millimeter equipment, and as that occurs, we’ll look at the cost effectiveness of taking 300-millimeter equipment that was running memory, and then transferring it over and running image sensors on it, much like we do today on the 200-millimeter, because we think that’s really the way to get the most cost effective part out.
Mike Sadler, VP of Worldwide Sales says:
We are seeing an improving demand for image sensors as the mobile phone supply chain has recovered from an inventory overhang dating back to last year.
Our customers in the mobile phone arena appear to have worked through inventories, and are now back to consuming Micron image senators to meet current sell-through demand. Our imaging business saw only a moderate revenue decline quarter-over-quarter, after substantially negative growth associated with the inventory correction in fiscal Q2.
The entire portfolio of sensors utilizing our advanced 1.7-micron pixel, ranging from VGA through 8-megapixel density, are being embraced by our customers. We have stacked up a number of design wins that are in the early stage of production, or moving to production throughout the balance of the year.
Peter Trigarszky- Citigroup
That is helpful. And then on image sensors, if you could talk about, I know last quarter you had lowered your loadings going into this quarter. Could you talk about how inventory could be worked down there, or how you see that potentially progressing? Also in VGA, what are your plans for competing in that space from a cost perspective? And maybe give us some sense of low end versus high end, how that mix is progressing for you?
Mike Sadler
Sure, sure. I mentioned that we brought our finished goods inventory down on image sensors. We are at about a quarters worth of finished goods inventory. We had crept up slightly higher than that as we exited fiscal Q2. We will take inventories down again in the current quarter.
So we are getting back to where we consider to be a comfortable level of finished goods inventory on image sensors. We are continuing to take more market share in the high end, our 5-megapixel sensor has been a hit in the marketplace on a couple of high end phones, and the volumes continue to increase with that particular chip.
On the low end of the market, the VGA chip, we have introduced a 1/11" VGA chip, or are in process of introducing it to the market currently, and that is basically going to be our low end cost-aggressive solution, if you will, to trying to attack the low end of the market.
Daniel Amir - WR Hambrecht & Co.
Can you comment what is your image sensor mix here on 1-megapixel and above and VGA?
Mike Sadler
Sure. Let me just do some quick math here. In the quarter that we just completed, at 1-megapixel and above, well, well over half. Probably closer to two-thirds to three-quarters of total unit shipments were 1-megapixel and above.
Eric Rubel - Miller Tabak Roberts
Could you break out the segment revenue for image sensor, and talk about the segment gross margin?
Bill Stover, CFO
The revenues for the quarter came in just above 10% of the total, and we have not been giving specific margin information.
Eric Rubel - Miller Tabak Roberts
Okay. Then if I can ask on, back in September in New York at the Analyst Day, you guys updated us on process at, I believe, 0.11 pixel size 1.75, and a wafer size of about 200-millimeter. Can you update us on how you see that playing out for fiscal 2008 for process, pixel size, and wafer? And I have one more follow-up.
Bill Stover
Well, at the leading edge, a lot of our imagers now are transitioning to the 1.75 Micron pixel technology. We previously announced the 1.4 Micron pixel but that will be a bigger part of our production, a little further out in the future. And was the other question on 200-millimeter versus 300-millimeter wafer capacity?
Eric Rubel - Miller Tabak Roberts
Yes.
Bill Stover
300-millimeter wafer capacity obviously continues to increase as a percent of the total as we ramp out Lehigh, and complete the conversion at tech. I think the way to think of it is in terms of…
Eric Rubel - Miller Tabak Roberts
I am sorry to interrupt, but I am speaking specifically with image sensor, for the image sensor segment, that all of those products were being done on 200-millimeter. Any change on that?
Steve Appleton
That is right. We continue to manufacture the image sensor on 200-millimeter. There has always been discussion around the industry thinking about running 300-millimeter, in fact I think one of our competitors has done so, I think they are primarily doing that, because they have old 300-millimeter equipment they can't really use anymore for memory.
In our particular case, when we look at the cost crossover on that, we don't think it will be cost effective for quite some time. The reason is really a pretty simple one. If you want to go out and buy a piece of a 300-millimeter equipment today then you're going to buy a piece of equipment that can run 50, 60-nanometer type capability, and frankly none of us are running our image sensors on processors that are down at 50 or 60-nanometers, nobody does.
So you are paying for the tool, but you're not utilizing it for the capability. In our particular case, I think as many of you know, we run a model where it's on a tool set that as an X minus 1 or X minus 2 generation, and that tool set has already used its life so to speak for us on the memory front, so it's very, very cost effective for us to use it, because in large part it has been depreciated, and it is a tool set that we would have sold for lower cents on the dollar, then actually get use out of it. So, from our perspective, it’s a great model that works for us. And that’s why we continue to do the 200-millimeter.
As a follow-on note, there clearly will be a time when we are in that situation for 300 millimeter equipment, and as that occurs, we’ll look at the cost effectiveness of taking 300-millimeter equipment that was running memory, and then transferring it over and running image sensors on it, much like we do today on the 200-millimeter, because we think that’s really the way to get the most cost effective part out.
Wednesday, June 27, 2007
NEC Develops 8MP ISP for Camera Phones
Tech-On: NEC announced that it has started to ship samples of CE131, an ISP for use in phonecams that can process image data of up to 8MP. Volume production is schedule for October 2007. The company reportedly expects the monthly production of 1M units.
Friday, June 15, 2007
Color Filter Array Ideas Paper
In lieu of all the buzz around the "new" Kodak color filter technology, here is a good article by John Savard summarizing the history and different ideas on color filters design.
There used to be a great Fillfactory paper on the same subject, but I can not find it on-line anymore.
Update: As someone mentions in comments, the old Fillfactory article is archived on Wayback Machine: RGB FAQ. Thanks for the link!
There used to be a great Fillfactory paper on the same subject, but I can not find it on-line anymore.
Update: As someone mentions in comments, the old Fillfactory article is archived on Wayback Machine: RGB FAQ. Thanks for the link!
Thursday, June 14, 2007
Omnivision Announces Its First 1.7um Pixel Product
Yahoo: Omnivision launched the OV3640, the first fully integrated 3MP sensor in a 1/4-inch format, based on its new 1.75um pixel. The sensor fits the standard 8 x 8 mm sockets. It features 2-lane MIPI interface. The new sensor incorporates ISP and onboard JPEG compression.
OV3640 also incorporates advanced image stabilization functionality. It's not clear how it works. The PR says only that the "sensor will automatically sense the slightest camera shake and activate the image stabilization function to help prevent image blur and produce sharper images." To me this sounds like just boosting ISO upon camera shake detection.
The sensor also has integrated AF control for 8.5 x 8.5 mm AF camera modules. Talking about spec, there are two numbers announced: improved dynamic range of up to 65dB and ultra low dark current of 30 e/sec at unspecified temperature. In fact, this is the second time that Omnivision states 1.75um pixel dark current at unknown temperature. This brings a suspicion that it's measured at room temperature. If so, the number is not that good.
Anyway, Omnivision joins a small club of companies owning 1.75um pixel technology. I hope it will close the performance gap with Samsung and Micron in this pixel generation.
OV3640 also incorporates advanced image stabilization functionality. It's not clear how it works. The PR says only that the "sensor will automatically sense the slightest camera shake and activate the image stabilization function to help prevent image blur and produce sharper images." To me this sounds like just boosting ISO upon camera shake detection.
The sensor also has integrated AF control for 8.5 x 8.5 mm AF camera modules. Talking about spec, there are two numbers announced: improved dynamic range of up to 65dB and ultra low dark current of 30 e/sec at unspecified temperature. In fact, this is the second time that Omnivision states 1.75um pixel dark current at unknown temperature. This brings a suspicion that it's measured at room temperature. If so, the number is not that good.
Anyway, Omnivision joins a small club of companies owning 1.75um pixel technology. I hope it will close the performance gap with Samsung and Micron in this pixel generation.
Kodak Develops New Color Filter Technology?
Yahoo: Kodak said it has developed a color-filter technology that at least doubles the sensitivity to light of the image sensor in every digital camera.
"We're talking about a 2-to-4-times improvement in (light) sensitivity" - said Chris McNiffe, general manager of the photography company's image sensor business.
Reuters: Kodak's new proprietary technology adds "clear" pixels to the red, green, and blue elements that form the image sensor array, collecting a higher proportion of the light striking the sensor.
Manufacturing customers interested in the design will likely get a chance to sample it in early 2008, but McNiffe was unsure when devices using the technology would be in stores. The technology could be used at first in devices such as cell phones and eventually products made for industrial and scientific imaging.
IDC's Chute said Kodak would probably use the technology for its own cameras, hoping to gain a competitive edge. "The potential (for its success) is always there, but it's a wait-and-see thing," he said.
CNET too published an extended article with many pictures on the Kodak color filter technology.
I wonder how Kodak can claim it's new, if the idea is known for decades already. Hopefully Kodak found a way to overcome the huge crosstalk coming from the "white" pixel.
Update: EETimes, PC World, DPReview, Imaging Resource and San Jose Mercury News each published its own version of the Kodak announcement. Imaging Resource's version is the most comprehensive.
"We're talking about a 2-to-4-times improvement in (light) sensitivity" - said Chris McNiffe, general manager of the photography company's image sensor business.
Reuters: Kodak's new proprietary technology adds "clear" pixels to the red, green, and blue elements that form the image sensor array, collecting a higher proportion of the light striking the sensor.
Manufacturing customers interested in the design will likely get a chance to sample it in early 2008, but McNiffe was unsure when devices using the technology would be in stores. The technology could be used at first in devices such as cell phones and eventually products made for industrial and scientific imaging.
IDC's Chute said Kodak would probably use the technology for its own cameras, hoping to gain a competitive edge. "The potential (for its success) is always there, but it's a wait-and-see thing," he said.
CNET too published an extended article with many pictures on the Kodak color filter technology.
I wonder how Kodak can claim it's new, if the idea is known for decades already. Hopefully Kodak found a way to overcome the huge crosstalk coming from the "white" pixel.
Update: EETimes, PC World, DPReview, Imaging Resource and San Jose Mercury News each published its own version of the Kodak announcement. Imaging Resource's version is the most comprehensive.
Wednesday, June 13, 2007
Strategies Unlimited Market Report
Solid-State Technology: The image sensor market is projected to grow 14% in 2007, following 30% growth in 2006 to roughly $6 billion, and will slow through the next several years, according to a report from Strategies Unlimited.
Micron is now the top supplier of CMOS sensors, with strong gains also enjoyed by STMicroelectronics and Samsung. Top five suppliers still hold about two-thirds of overall image sensor market share, with Sony and Micron each approaching $1 billion in annual revenues. 50 or so image sensor suppliers are about twice what the market supported a decade ago, though that number hasn't changed in the past few years -- suggesting that for every Atmel and ESS Technology that gets out of the image sensor business, there's a Planet82 or a ProMOS Technologies that comes in to take their place.
Micron is now the top supplier of CMOS sensors, with strong gains also enjoyed by STMicroelectronics and Samsung. Top five suppliers still hold about two-thirds of overall image sensor market share, with Sony and Micron each approaching $1 billion in annual revenues. 50 or so image sensor suppliers are about twice what the market supported a decade ago, though that number hasn't changed in the past few years -- suggesting that for every Atmel and ESS Technology that gets out of the image sensor business, there's a Planet82 or a ProMOS Technologies that comes in to take their place.
Monday, June 11, 2007
ST Licenses Varioptic Lens
Varioptic, the liquid lens company, announced the signature of a licensing agreement with STMicroelectronics. Under the terms of the agreement, STMicroelectronics will use Varioptic’s liquid lens technology to add auto-focus capability to a family of camera phone modules. Additionally, ST will also be able to manufacture liquid lenses in its own facilities. Varioptic’s liquid lens products include the current Arctic series (Arctic 320 and 416) as well as new thinner versions to be launched in the coming months.
Eric Aussedat, General Manager of ST’s Imaging Division, commented: “By combining Varioptic’s latest liquid lenses with our industry-leading 1.75-micron sensor technology, we believe we can break current performance-cost frontiers and dramatically increase the adoption of autofocus in phones.”
Eric Aussedat, General Manager of ST’s Imaging Division, commented: “By combining Varioptic’s latest liquid lenses with our industry-leading 1.75-micron sensor technology, we believe we can break current performance-cost frontiers and dramatically increase the adoption of autofocus in phones.”
Tessera Wafer Level Camera
After many years in development Tessera finally announced a new wafer-level camera technology OptiML WLC (also known as OptiuL WLC).
Using OptiML WLC technology, thousands of lenses are manufactured simultaneously on a wafer, and then bonded at the wafer level to create the optical element of the camera. The result is simplified assembly, up to 30% cost savings for the optical component of the camera module and up to 50% size reductions over conventional camera phone modules. Tessera's recently acquired Eyesquad technology can be easily integrated into the OptiML WLC solution, providing advanced auto-focus and digital optical zoom without the use of moving parts.
Update: EETimes too published the announcemnet. Tessera claims the "Z" dimension for the OptiML WLC's VGA implementation comes in at 2.5 mm. Eyesquad's digital focus technology becomes crucial when wafer-level cameras need 2-megapixel resolution or better.
The first working-prototype module made to custom specs using OptiML WLC will emerge at the end of next quarter. Wafer-level cameras will be incorporated in handsets by the end of 2008.
Using OptiML WLC technology, thousands of lenses are manufactured simultaneously on a wafer, and then bonded at the wafer level to create the optical element of the camera. The result is simplified assembly, up to 30% cost savings for the optical component of the camera module and up to 50% size reductions over conventional camera phone modules. Tessera's recently acquired Eyesquad technology can be easily integrated into the OptiML WLC solution, providing advanced auto-focus and digital optical zoom without the use of moving parts.
Update: EETimes too published the announcemnet. Tessera claims the "Z" dimension for the OptiML WLC's VGA implementation comes in at 2.5 mm. Eyesquad's digital focus technology becomes crucial when wafer-level cameras need 2-megapixel resolution or better.
The first working-prototype module made to custom specs using OptiML WLC will emerge at the end of next quarter. Wafer-level cameras will be incorporated in handsets by the end of 2008.
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