Military and Aerospace: SiOnyx is to develop low-cost "black silicon"-based SWIR imagers for U.S. Naval Surface Warfare Center Dahlgren Division in Dahlgren, Va. Navy researchers say that using the SiOnyx Black Silicon process could increase the IR QE over standard silicon, and lead to a low cost, enhanced SWIR detector.
Thursday, May 31, 2012
Sony Announces HD CMOS Sensors, Promises Stacked Products Soon
Sony Cx-News vol. 68 has few image sensor announcements.
IMX104LQJ CMOS image sensor for industrial applications has 1.37MP resolution and 3.75um pixels. Its frame rate is 120fps at 10b ADC resolution or 60fps at 12b resolution. The sensor is said to provide 12dB higher SNR than existing Sony products. Its low light sensitivity is better, in comparison with IMX035LQR
with slightly smaller 3.63um pixels:
IMX136LQJ (color) and the IMX136LLJ (black and white) industrial CMOS image sensors feature that same 120fps/10b and 60fps/12b speed but at 2.38MP resolution. The pixel size is 2.8um to maintain almost the same 1/3-inch optical format. They also support the multiple frame HDR mode. In this mode, separate
exposure time and gain can be set in advance for 4 or 2 consecutive frames and sets of 4 or 2 frames can be set as a shooting condition to automatically output consecutive images:
Sony also talks more about its image sensor stacking technology: "Sony's Stacked CMOS Image Sensor Solves All Existing Problems in One Stroke".
"Digital still cameras mainly use Type 1/2.3 CMOS image sensors. If the 45 nm process rule can be used for the circuit section, it will become possible to implement signal processing circuits that equal the DSPs used in high-end digital still cameras. And even the 65 nm rule will make possible signal processing for middle class digital still cameras.
Type 1/3.2 image sensor processed according to the 65 nm rule could be incorporated in a surveillance camera. And if the 45 nm rule were used, it would enable integration of a signal processing circuit large enough for middle class digital still cameras.
Secondly, how can the surface area be reduced by completely separating the pixel section from the circuit section?
Sony's Type 1/4 CMOS image sensors can then be reduced by 30% and SoC CMOS image sensors for mobile phones with camera signal processing capability can be reduced by 40%. Although CMOS sensors are generally thought to be larger than CCD image sensors, stacked CMOS image sensors do not need any registers and can therefore be 20% smaller. The configuration of the sensor makes it ideal for use in medical cameras and other industrial applications."
Stacked image sensor products with RGB-W CFA and HDR functions are planned for shipment:
The stacked CMOS image sensor with RGB-W and HDR functions do not require to change the signal processing of the in system, meaning the stacked processor translates output signals to some standard format.
IMX104LQJ CMOS image sensor for industrial applications has 1.37MP resolution and 3.75um pixels. Its frame rate is 120fps at 10b ADC resolution or 60fps at 12b resolution. The sensor is said to provide 12dB higher SNR than existing Sony products. Its low light sensitivity is better, in comparison with IMX035LQR
with slightly smaller 3.63um pixels:
| Low-light Picture Quality (in all-pixel scan and 12-bit A/D conversion mode, 30fps, 0.1 lx, 42dB with built-in PGA +12dB in rear end, at F2.0) |
IMX136LQJ (color) and the IMX136LLJ (black and white) industrial CMOS image sensors feature that same 120fps/10b and 60fps/12b speed but at 2.38MP resolution. The pixel size is 2.8um to maintain almost the same 1/3-inch optical format. They also support the multiple frame HDR mode. In this mode, separate
exposure time and gain can be set in advance for 4 or 2 consecutive frames and sets of 4 or 2 frames can be set as a shooting condition to automatically output consecutive images:
Sony also talks more about its image sensor stacking technology: "Sony's Stacked CMOS Image Sensor Solves All Existing Problems in One Stroke".
"Digital still cameras mainly use Type 1/2.3 CMOS image sensors. If the 45 nm process rule can be used for the circuit section, it will become possible to implement signal processing circuits that equal the DSPs used in high-end digital still cameras. And even the 65 nm rule will make possible signal processing for middle class digital still cameras.
Type 1/3.2 image sensor processed according to the 65 nm rule could be incorporated in a surveillance camera. And if the 45 nm rule were used, it would enable integration of a signal processing circuit large enough for middle class digital still cameras.
Secondly, how can the surface area be reduced by completely separating the pixel section from the circuit section?
Sony's Type 1/4 CMOS image sensors can then be reduced by 30% and SoC CMOS image sensors for mobile phones with camera signal processing capability can be reduced by 40%. Although CMOS sensors are generally thought to be larger than CCD image sensors, stacked CMOS image sensors do not need any registers and can therefore be 20% smaller. The configuration of the sensor makes it ideal for use in medical cameras and other industrial applications."
Stacked image sensor products with RGB-W CFA and HDR functions are planned for shipment:
- Type 1/3.06 stacked CMOS image sensor with approx. 13.0M effective pixels
Sample shipments planned for June, 2012 - Type 1/4 stacked CMOS image sensor with approx. 8.0M effective pixels
Sample shipments planned for August, 2012
The stacked CMOS image sensor with RGB-W and HDR functions do not require to change the signal processing of the in system, meaning the stacked processor translates output signals to some standard format.
Wednesday, May 30, 2012
Omnivision Announces 1.1um OmniBSI-2 12.7MP Sensor, VGA CameraCube
PR Newswire: OmniVision announces the OV12830, a 12.7MP sensor for high-end smartphones and tablets. The 1/3.2-inch OV12830 utilizes 1.1um pixel OmniBSI-2 architecture to capture 1080p/60fps HD video, and full resolution 12MP high-speed photography at 24fps to dramatically reduce shutter lag. The chief ray angle is 30.3deg. non-linear.
"We are bringing this sensor to market at a time when next-generation smartphone and tablet cameras are moving beyond the 8-megapixel threshold," said Devang Patel, senior product marketing manager at OmniVision. "The OV12830 marks OmniVision's highest resolution 1/3.2-inch optical format offering for mobile devices to date, and fits into the industry-standard module size of 8.5 x 8.5 mm."
An on-chip RAW scaler allows the sensor to record video at 30fps while maintaining full field of view. Additionally, the OV12830 is capable of capturing full 1080p/60fps HD video with additional pixels for EIS. The sensor provides alternate row output from full-resolution at two different exposures, enabling HDR still or video recording. The OV12830 comes in die format with 4-lane MIPI interface.
It is currently available for sampling, and is expected to enter volume production in the fourth quarter of 2012.
Another Omnivision's announcement is 1/9-inch VGA CameraCube, the OVM7675, having a
size of 2.9 x 2.9 x 2.3 mm. The CameraCubeChip is built on 2.5um OmniPixel3-HS technology, which delivers sensitivity of 1800 mV/lux-sec. The OVM7675 is currently sampling and is expected to enter volume production in Q4 2012.
"We are bringing this sensor to market at a time when next-generation smartphone and tablet cameras are moving beyond the 8-megapixel threshold," said Devang Patel, senior product marketing manager at OmniVision. "The OV12830 marks OmniVision's highest resolution 1/3.2-inch optical format offering for mobile devices to date, and fits into the industry-standard module size of 8.5 x 8.5 mm."
An on-chip RAW scaler allows the sensor to record video at 30fps while maintaining full field of view. Additionally, the OV12830 is capable of capturing full 1080p/60fps HD video with additional pixels for EIS. The sensor provides alternate row output from full-resolution at two different exposures, enabling HDR still or video recording. The OV12830 comes in die format with 4-lane MIPI interface.
It is currently available for sampling, and is expected to enter volume production in the fourth quarter of 2012.
Another Omnivision's announcement is 1/9-inch VGA CameraCube, the OVM7675, having a
size of 2.9 x 2.9 x 2.3 mm. The CameraCubeChip is built on 2.5um OmniPixel3-HS technology, which delivers sensitivity of 1800 mV/lux-sec. The OVM7675 is currently sampling and is expected to enter volume production in Q4 2012.
Tuesday, May 29, 2012
Omron Announces Gesture Recognition Software for Mobile Apps
Omron announces that it has developed an embedded hand gesture recognition technology capable of simultaneously recognizing the position, shape, and motion of a person's hand or finger by referencing a camera-recorded image. The technology features:
The gesture recognition joins OKAO line of other licenseable image processing routines for mobile applications:
- Trigger motion is not necessary by facial image sensing technology.
- Hand or finger position, shape and movements can be recognized simultaneously.
- Hand gesture detection ranges from very near (about 10cm) to far (several meters).
- High-speed recognition is enabled on smartphones and tablets.
- Small program size makes it possible to embed the technology in a diverse range of devices.
- Recognizable size of hand: 40 pixels or higher
- Recognition start: By hand-waving or automatic via combination of face and hand recognition
- Recognition speed: 30fps at 1.0GHz Snapdragon
- Compatible operating systems: Windows XP/7, Android OS, iOS, etc.
The gesture recognition joins OKAO line of other licenseable image processing routines for mobile applications:
Lfoundry Announces 110nm Process with Imaging Option
PRWeb, EETimes: Rousset, France-based LFoundry announces PDK 110 for ots 110nm Aluminum process. The PDK includes several advanced technology options, especially an embedded Flash which is proposed in 90nm resolution.
"This PDK is particularly well adapted for key applications such as... CMOS imagery," commented Jean-Pierre Delesse, President, LFoundry Rousset. It's not clear if flash memory processing module can be combined with the CIS one.
LFoundry Rousset is a former Atmel fab sold to Germany LFoundry GmbH in 2009. The German LFoundry fab was shut down in 2011.
"This PDK is particularly well adapted for key applications such as... CMOS imagery," commented Jean-Pierre Delesse, President, LFoundry Rousset. It's not clear if flash memory processing module can be combined with the CIS one.
LFoundry Rousset is a former Atmel fab sold to Germany LFoundry GmbH in 2009. The German LFoundry fab was shut down in 2011.
Digitimes: Omnivision Expands TSMC, Testing Houses Orders
Digitimes: Taiwan packaging and testing houses King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries reportedly have landed new orders for CMOS sensors from OmniVision, with shipments slated to kick off in Q3 2012, according to newspaper's sources.
KYEC and Tong Hsing both said they do not comment on customer status and orders.
OmniVision is believed to have secured orders for Apple's next-generation iPhone and iPad series. KYEC and Tong Hsing previously cut into the supply chain for Apple's iPhone 4S through supplying services to OmniVision, Digitimes' sources report (probably for VGA front camera). Also, OmniVision's wafer starts at TSMC for the second quarter are expected to jump significantly from the prior quarter's levels, the sources pointed out.
KYEC and Tong Hsing both said they do not comment on customer status and orders.
OmniVision is believed to have secured orders for Apple's next-generation iPhone and iPad series. KYEC and Tong Hsing previously cut into the supply chain for Apple's iPhone 4S through supplying services to OmniVision, Digitimes' sources report (probably for VGA front camera). Also, OmniVision's wafer starts at TSMC for the second quarter are expected to jump significantly from the prior quarter's levels, the sources pointed out.
Omnivision Announces 1/6-inch Native 1080p OmniBSI+ Sensor
PR Newswire: OmniVision announces the OV2722, the second-generation native 1080p CMOS sensor, designed for ultra-portable applications such as smartphone, tablet and Ultrabook. Based on 1.4um OmniBSI+ pixel, the OV2722 can be housed in a module height of less than 3 mm. The 1.4um OmniBSI+ pixel offers significant performance improvements over the first generation OmniBSI, including a 60% increase in full-well capacity, a 10% increase in QE and a 10% improvement in low-light performance.
The OV2722 is currently in volume production.
Update: Digitimes reports that ultrabooks will require camera modules height be reduced to 2.0-3.0mm which is lower than 4.0-5.0mm specified for regular notebooks. This will prevent ASPs for webcams from falling in 2012, according to the newspaper's sources.
The OV2722 is currently in volume production.
Update: Digitimes reports that ultrabooks will require camera modules height be reduced to 2.0-3.0mm which is lower than 4.0-5.0mm specified for regular notebooks. This will prevent ASPs for webcams from falling in 2012, according to the newspaper's sources.
Monday, May 28, 2012
Samsung Gesture Recognition TV Commercial
Samsung presents its "motion-control" TV technology on Youtube:
Other than English, there are also Italian, Serbian, Colombian, Ukrainian and, probably, other versions of this commercial.
Other than English, there are also Italian, Serbian, Colombian, Ukrainian and, probably, other versions of this commercial.
Friday, May 25, 2012
Brandywine's 1 Gigapixel Hyperspectral CMOS Sensor
It was brought to my attention that Brandywine Photonics sells a special sensor said to be optimized for multispectral imaging, the FBX-2. The sensor has a number of interesting features. While the main version has 2056 x 256 resolution with 15um pixel pitch, it's said to be available in HDTV, 25MP, 1 GigaPixel(!), and butt-able array formats. The broad spectrum QE looks very good, especially 30% at 1000nm:
The read noise is said to be <10e-, and the "well depth" is 300K (not sure what are the units of this one).
Thanks to OSP for the link!
The read noise is said to be <10e-, and the "well depth" is 300K (not sure what are the units of this one).
Thanks to OSP for the link!
Engadget Tests Leap Motion Gesture Recognition Device
Engadget published an interview with David Holz and Michael Buckwald, the two men behind Leap Motion's gesture recognition device. While David and Michael refused to explain how it works, they only mentioned it's based on IR LEDs and cameras. The demo looks nice, albeit the window curtain is too dense for my taste:
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