Friday, November 09, 2007

3D Packaging News

I-Micronews mentioned some interesting 3D packaging news in the comments to the previous post.

Oki announced it has started a contract assembly service for W-CSP image sensors using through-hole technology (ZyCube one?). In September, OKI established a volume production line for through-hole technology based W-CSP assembly at its production site in Tokyo and started operation in October.

"Based on the through-hole W-CSP technology, manufacturers can make smaller camera modules, responding to trends such as the steadily shrinking size of mobile equipment," said Takaki Yamada, President of Silicon Microdevice Company at Oki Electric Industry. "We plan to increase the production level to 10,000 wafers per month within the fiscal year ending March 2009 and are considering increasing up to 20,000 wafers per month by the fiscal year ending March 2010".

There was also Toshiba announcement on camera modules manufacturing plans. These modules are featuring an ultra small CSCM (chip scale camera module) that will be the first camera module manufactured with TCV (Through Chip Via) technology.

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