Tuesday, March 27, 2012

Himax Expands Wafer-Level Optics Capacity

PR Newswire: Himax has placed a repeat order for EV Group's (EVG) IQ Aligner UV nanoimprint lithography (UV-NIL) system. The IQ Aligner will be used to support Himax's capacity increase in the production of wafer-level cameras for mobile phones, notebooks and other consumer electronic devices, as well as to support the increasingly stringent manufacturing requirements for wafer-level cameras demanded by Himax's customer base. The IQ Aligner will be shipped and installed at Himax's manufacturing facility in Tainan, Taiwan.

"This repeat order from Himax further extends our market and technology leadership in lens molding, with nearly every major wafer-level optics manufacturer having adopted our suite of solutions," stated Paul Lindner, executive technology director, EV Group.

"This adds to our already advanced manufacturing capabilities for CMOS image sensors, and provides us with a key competitive edge by enabling us to offer a complete manufacturing solution to the mobile handset market", said HC Chen, fab director at Himax.

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