Systemplus published reverse engineering report of Nemotek WLC featuring Tessera technology. The wafer-level packaging of the CIS uses Shellcase MVP process with TSVs to connect the bond pads on the die and the BGA interface on the rear face of the package. The wafer-level optics is a single lens
element, reflow compatible, manufactured in OptiML WL-Optics process. The wafer-level camera is entirely assembled by Nemotek Technologie in Morocco.
Meanwhile Tessera-DOC published a nice promotional video on Dropbox (no embedding allowed).