Thursday, May 24, 2012

UMC Develops BSI CIS Process on 12-inch Wafers

UMC CEO Shih-Wei Sun said at groundbreaking ceremony for its 300mm Fab 12A (Phase 5 & 6) at Tainan, south Taiwan fab complex: "UMC... cooperates closely with customers on 300mm specialty technologies such as... BSI CMOS image sensor... and 3D IC TSV to provide a truly comprehensive, leading foundry technology platform".

6 comments:

  1. Who is UMC's major client for these BSI image sensors?

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  2. That is THE good question!

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  3. Maybe STM, UMC is the second source of STM for image sensors via its Singapoor Fab.

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  4. This comment has been removed by the author.

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