Austrian mixed-signal foundry AMS invests over €25m to create an in-house production capacity for 3D ICs, including stacked sensor, among other 3D integrated chips. "The AMS 3D IC process also enables the production of stacked-die devices. Two die produced in different processes (such as a photodiode die and a silicon signal-processing die) are bonded back-to-back to produce a monolithic stacked-die device."
The new equipment line, which will be fully operational by the end of 2013, will be available for production of 3D ICs for any AMS product or full-service foundry customer. Initially the line will produce devices for customers in the medical imaging and mobile phone markets.
Thanks to PD for the link!