Friday, May 12, 2017

Embedded Vision Summit Presentations

Embedded Vision Alliance opens access to the presentations of the Embedded Vision Summit held on May 1-3, 2017 in Santa Clara, CA (free registration and 207MB of hard disk space for presentations are required). Few interesting bits from various presentations:

Intel previews its 300m long range RealSense depth camera:

By now, Intel depth cameras lineup is probably the broadest in the industry:

Fotonation shows that camera and image processing are by far the most power consuming parts of a smartphone:

Fotonation proposes its HW accelerators to reduce power:

Microsoft keynote talks about the Hololens sensor architecture:

Sony plans to leverage its future image sensors speed and lower power:

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