Trendforce Consulting reports that Galaxycore IPO at Shanghai Stock Exchange has been approved. Most of the raised investment, 6.8B yuan (about $1.056B) goes into the company's own BSI processing 12-inch fab with capacity of 20,000 wafers per month. The new fab will be responsible for backthinning, wafer bonding, and and other BSI manufacturing steps.
The fab is supposed to provide most of the capacity for Galaxycore's low-end and mid-range sensors. The company also plans to penetrate a higher resolution sensors market.
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