ST Imaging Update

STM has held an 2013 Investors & Analysts Day on May 16, presenting few updates on its image sensor business.

The CIS production seems to take a good chunk of the Crolles 300mm fab's capacity:

ST develops 1.1um and 0.9um pixel process, apparently cooperating with 2 foundries. So far, only cooperation with UMC has been announced:

0.9um pixel is scheduled to appear in 2014:

In recent years ST has introduced a lot of CIS process extensions:

The Imaging Division presentation talks about the achievements and strategies:

The progress in camera phones sensors includes:

• Ramp-up of BSI process one quarter ahead of schedule for smartphone maker flagship device
• Including brand new technology concept
• High Performance Pixel: DTI, Vertical Diode, large pixel, HDR, low dark optimization
• Investment of color capacity into Crolles 300mm ready in 3Q13 (+100%)
• 65nm Back Side Illumination process development with UMC under execution as planned