“With the fifth generation of our REAL3 chip we are once again demonstrating our leading position in the field of 3D sensors,” says Andreas Urschitz, President of the Power Management and Multimarket Division at Infineon, which also includes sensor business. “It’s robust, reliable, powerful, energy efficient and at the same time decisively small. We see great growth potential for 3D sensors, since the range of applications in the areas of security, image use and context-based interaction with the devices will steadily increase.” The 3D sensor also allows the device to be controlled via gestures, so that human-machine interaction is context-based and without touch.
The new 3D image sensor chip (IRS2887C) was developed in Graz, Dresden and Siegen and combines the expertise of Infineon’s and pmdtechnologies’ German and Austrian locations. Series production will begin in the middle of 2020. In addition, Infineon Technologies offers an optimized illumination driver (IRS9100C) that further improves performance, size and cost as a complete solution.
BusinessWire: pmdtechnologies is presenting its latest 3D ToF camera module based on the 5th generation REAL3 ToF image sensor from pmd and Infineon. The IRS2877C with VGA resolution depth data output and a newly designed 5µm pmd pixel core.
The new VGA 3D imager is the highest resolution, most flexible and robust depth sensor that has ever been developed by pmd and Infineon. "We’re passionate about setting new standards – and with the new VGA 3D camera module, which uses our IRS2877C imager, we did it again. Not only do we feature best in class performance, but we also provide the most dedicated depth sensing platform to our customers to develop their 3D application, which they can get on the market,” says Jochen Penne, Executive Board Member and Head of Business Development at pmd.
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