Analog Devices unveils what appears to be the first fruit of cooperation with Microsoft ToF group (former Canesta). The ADSD3100 sensor targets smartphones, AR/VR systems, and machine vision applications in logistics, inventory, industrial, and consumer fields.
The new sensor features:
- 1024 (horizonal) × 1024 (vertical) pixel array
- 3.5 μm × 3.5 μm square pixels
- 1/3.6 inch optical format
- BSI
- Depth and intensity imaging
- 4-wire SPI or 2-wire I2C serial interface
- Die size: 5.364 mm × 9.799 mm
- MIPI CSI-2 Tx interface with support for 1, 2, or 4 data lanes, programmable up to 1.5 Gbps per lane
- Dual, 3.3 V and 1.27 V external supplies, 1.8 V I/O section
For comparison, below are the figures from Microsoft ISSCC 2018 presentation:
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