Chipworks published a reverse engineering report on Toshiba TSV. Toshiba is the first out with a commercially available device that uses TSV technology. They call their implementation, "TCV" for Through-Chip-Via. This allows mounting and assembly of camera components at the wafer level (WLP), savings overall module size and yielding smaller design footprints.
Update, Sep. 15: Marketwire: Chipworks announced the availability of a full reverse engineering report on Toshiba's TSV technology. (The previous announcement was probably a preliminary report.) The analyzed device is an image sensor module, produced by Toshiba, and found inside a mobile phone.
According to market research company Yole Developpement, "3-D TSV wafer level encapsulation technologies have the potential to impact as much as 70% of the CMOS image sensor market for camera cell phones by 2012."
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