Sunday, February 21, 2010

OmniBSI Package Analysis by Chipworks

Yole's February issue of 3D Packaging newsletter publishes Chipworks' Ray Fontaine article analyzing Xintec package design for 5MP OmniBSI OV5642 sensor. The article is illustrated by the reverse engineering pictures:


Update: Chipworks already has 3 reports in its collection of 1.4um pixel reverse engineering. Other than Omnivision BSI, it has Samsung 8MP S5K3H1G and Aptina MT9P111 5MP SOC reports.

9 comments:

  1. So no microlens used in this CSP version ??

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  2. The scale of the pictures is too small to see the microlens.

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  3. should be, so there is an air gap between the cover glass and the BSI sensor ?

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  4. How long will it take to over come these problem?

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  5. What problem are you talking about? The air gap seems to be there, microlens too. What's the problem?

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  6. Interesting that they have not yet migrated to TSVs.

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  7. How the active wafer bonded to the carrier wafer ?
    Any one can explain ?

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  8. I was told that they were bonded by Van der Waals force only; don't know the details though.

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