Ziptronix Announces Industry’s Lowest Distortion BSI Wafer Bonding

Business Wire: Ziptronix announced that recent collaborations with major image-sensor manufacturers have shown that the Ziptronix ZiBond direct bonding process contributes minimum distortion in BSI image sensors. Since Ziptronix bonding technology does not involve a large coefficient of thermal expansion (CTE) mismatch, it does enable very low distortion which is required for scalable color filter array overlay on the exposed photodiodes after thinning of the bonded CMOS wafer.

Distortion of the wafer introduced during the bonding process can compromise the overlay and limit pixel scaling. ZiBond’s inherent capacity for high bond strength at low temperature effectively minimizes this distortion compared to the competing bond technologies, adhesive and copper thermo-compression. This directly enables submicron pixel scaling; for example, 0.9um pixel BSI image sensors have already been fabricated and work on 0.7um pixel BSI is underway.

“In addition to confirming that the Ziptronix direct bonding technology delivers the lowest distortion of any process for manufacturing BSI image sensors, these results have tremendous bottom-line significance for image sensor makers,” said Ziptronix CEO Dan Donabedian. “Minimal distortion means pixels can be scaled smaller, and that means increased image sensor resolution, more die per wafer, improved image sensor yields and lower production costs.”