Wednesday, August 13, 2014

Image Sensor Americas Interviews

Image Sensor Americas conference publishes tow new interviews on its site. Forza Silicon CTO Daniel Van Blerkom talks about image sensor design:

"Backside illuminated technology (BSI) is now becoming standard, even in custom sensors. This, coupled with 3D packaging with dense interconnects, is creating an exciting opportunity in stacked sensors. We are currently working on projects utilizing pixel level interconnects in 3D stacked devices."

"Forza Silicon team is in the process of developing a compact, low-power 3D sensor technology that can enable a wide range of smart applications in the programmable world (otherwise know as the "Internet of Things")."

IMEC image sensor group manager Piet De Moor too talks about stacked sensor technology:

"I expect a big impact of stacked image sensors, not so much on the image sensing quality but rather at the system integration level, which will enable smart and very compact imagers for both consumer (e.g. mobile phone) as industrial inspection and security imaging systems."

"The additional functionality offered by stacking is the potential of an area distributed pixel readout right underneath the pixel area, which allows a very fast or high dynamic range readout, a local analog-to-digital conversion, local image processing or combinations of above."

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