Workshop on CMOS Active Pixel Sensors for Particle Tracking

University of Bonn, Germany conducts Workshop on CMOS Active Pixel Sensors for Particle Tracking (CPIX14) on Sep. 15-17, 2014. Although the workshop is fully booked, the organizers offer a live broadcast over the Internet for the presenters who agree - the world's first for an image sensor event.

The workshop's agenda:

Technology and design I

• Overview Technology Offers
  Tomasz Hemperek (Universitaet Bonn (DE))
• Design and process development of CMOS image sensors with TowerJazz
  Renato Turchetta (STFC - Rutherford Appleton Lab. (GB))
• APSEL Deep n-well and Deep p-well CMOS Sensors with ST and TowerJazz Technologies
  Gianluca Traversi (University of Bergamo)

Technology and design II

• Deep n-well CMOS Sensors with 3D Integration of Global Foundries Wafers
  Valerio Re (INFN)
• DMAPS Design in XFAB Technology
  Tetsuichi Kishishita (University of Bonn)
• Development of DMAPS Sensors in ESPROS Technology
  Miroslav Havranek (Acad. of Sciences of the Czech Rep. (CZ))

Industrial technology offerings

• ESPROS technology
  Martin Popp (Espros Photonics)
• LFoundry Technology
  Gerhard Spitzelsperger (LFoundry)
• TowerJazz Technology
  Avi Strum (TowerJazz)

CMOS sensors: industry developments

• Design detail and performance of Fully Depleted Backside Illuminated CMOS Sensors
  Stefan Lauxtermann (Sensor Creations)
• AMS High Performance CIS Modules
  Ingrid JONAK-AUER (AMS)
• Rad-hard design in CMOS [image] sensors
  Bart Dierickx (Caeleste)
• Image Sensor Design and Technology Development at Fraunhofer IMS
  Sasha WEYERS (Fraunhofer IMS)

Technology and design III

• PERCIVAL: CMOS Image Sensors for Low Energy X-Ray Detection
  Iain Sedgwick (STFC)
• AMS Designs: CLICPix/CCPD/Mu3e
  Ivan Peric (Ruprecht-Karls-Universitaet Heidelberg (DE))
• CCPD Design: from AMS to GF technology
  M. Patrick Pangaud (Centre National de la Recherche Scientifique (FR))

Technology and design IV

• Design of CMOS Pixels Sensor for the STAR Experiment
  Christine Hu (IPHC/IN2P3)
• STAR MAPS Developments and Experiences
  Leo Greiner (Lawrence Berkeley National Laboratory)
• Alice Designs: Mistral, Astral, Alpide
  Marc Winter (Institut Pluridisciplinaire Hubert Curien (FR))

Electron microscopy

• CMOS pixels for electron microscopy: requirements and R&D results at TEAM
  Marco Battaglia (University of California,Santa Cruz (US))
• Radiation hard MAPS developments for electron microscopy
  Peter Denes (LBNL)
• CMOS APS for TEM
  Nicola Carlo Guerrini (STFC - RAL)

3D integration and interconnection technologies

• MAPS are for amateurs, professionals do 3D
  Grzegorz Deptuch (Fermi National Accelerator Lab. (US))
• Advances in Bonding technologies (chip to wafer and wafer to wafer)
  Ray Yarema (FNAL)

Technology and design V

• Experience with IBM 130 nm Process for Active CMOS Pixels
  Dario Gnani (LBNL)
• Fully depleted MAPS: Pegasus and Mimosa 33
  Maciej KACHEL (IPHC)
• SLAC Developments in CMOS Sensors
  Julie Segal (SLAC)

Technology and design VI

• X-ray image sensors for SACLA and future Ultimate Storage Ring Light Sources
  Nobukazu Teranishi (University of Hyogo)
• Lapis SOI Technology and Designs
  Yasuo Arai (High Energy Accelerator Research Organization (JP))

Detector characterization and performance I

• Characterization of CCPDV3 HV-CMOS sensors capacitively coupled to CLICpix 65 nm CMOS readout ASICs
  Mathieu Benoit (CERN LCD)
• CMOS MAPS in Planar and 3D Technologies: TID Effects and Bulk Damage Study
  Lodovico Ratti (University of Pavia)
• Radiation Hardness of the Tower/Jazz 0.18 µm Imaging CMOS Process
  Michael Deveaux (Johann-Wolfgang-Goethe Univ. (DE))

Detector characterization and performance II

• Design and Characterization of a High-Speed Multi-frame Hybrid CMOS Sensor
  John Porter (Sandia National Laboratories)
• ESPROS DMAPS: Results and Radiation Hardness
  Theresa Obermann (Universitaet Bonn (DE))