Himax announces that its Wafer Level Optics (“WLO”) laser diode collimator with integrated Diffractive Optical Element (“DOE”) has been integrated into laser projectors for next-generation structured light camera. Himax's WLO systemhas a height of less than two millimeters. The WLO component is then stacked on top of a laser diode to reduce the overall height of a coded laser projector assembly to five millimeters.
Jordan Wu, President and CEO of Himax Technologies says "We are currently collaborating with several major OEMs' product developments using our WLO as our expertise in WLO design and manufacturing enables significant size and cost reduction of coded laser projectors. For example, in an active sensing 3D camera projector, our technology can reduce the size of the incumbent laser projector module by a factor of 9, actually making it smaller than conventional camera modules. This breakthrough allows our WLO collimator to be easily integrated into next-generation smartphones, tablets, automobiles, wearable devices, IoT applications, consumer electronics accessories and several other products to enable new applications in the consumer, medical, and industrial marketplaces."
The WLO laser collimator and DOE will be manufactured by Himax’s Wafer Optics production facility in Taiwan. The first production run for 3D camera applications is scheduled for delivery and sampling by Himax's partners and select
customers in Q1 2016.
Update: GlobeNewsWire: Himax reports "higher-than-expected engineering fees from AR/VR project engagements with both current and new customers."