On the way to commercialize BASF 3D imaging solution, its wholly owned subsidiary Trinamix presents "the new first bondable bare chip infrared PbS sensor: Hertzstück."
"For Hertzstück PbS detectors we have developed a new, patent pending encapsulation technique: Hertzstück is the first bare chip lead salt photoconductor that can be wire-bonded to printed circuit boards."
No comments:
Post a Comment
All comments are moderated to avoid spam and personal attacks.