Digitimes reports that image sensor packaging companies Tong Hsing (Kingpak acquirer) and Xintec are expanding capacity to satisfy growing demand for multi-camera smartphones. Both companies have seen their production lines run at full capacity in most of the Q1 of 2020 despite the fact that the ongoing coronavirus pandemic will drag down global handset shipments in 2020, according to Digitimes sources.
Taipei Times quotes Tong Hsing president Heinz Ru saying that the COVID-19 pandemic has not negatively affected CIS demand and he expects revenue to grow by a double-digit percentage year-on-year this quarter. To cope with strong demand for CIS services, Tong Hsing plans to more than double its monthly capacity to 160,000 wafers at its plant in Taoyuan’s Longtan District, Ru said.
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