TSMC Tells about its TSVs for CIS Process

Semiconductor International: TSMC revealed its TSV plans on the 2009 Technical Symposium in San Jose in April. The current TSMC roadmap shows that PT140 (backside TSV for CIS) is available on 140 µm pitch now, and 60 µm pitch will be available later this year. It looks like i-T30 and i-T17 — vias “middle” (before BEOL) — at 40 and then 17 µm pitch will be available starting in Q2 2011.