It came to my attention that Hynix Newsletter regularly updates its readers about the company CIS development progress.
The January 2009 issue reports that 1.4um pixel development schedule has been pulled-in to meet the market demand. Hynix plans to launch 1.4um pixel 2M/3M/5M products in the second half of 2009. The newsletter also presents the updated Hynix CIS roadmap"
The February 2009 issue reports about the development of 1/5-inch 2MP sensor based on 1.75um pixels with improved low-light performance.
April 2009 issue of the newsletter announces new 1/10-inch VGA sensor YACBAC1S optimized for low light and demonstrating better sensitivity than the old one named YACBAA0S.
The May issue reports that 1/10-inch VGA sensor with 2.25um pixels "successfully entered the Taiwan notebook market, targeting NetBook applications". There is also 1.3MP sensor with 2.2um pixels "under scheduling".
The June newsletter announces 3MP 1.75um pixel YACE4A1SBDBS imager with integrated ISP samples available with mass production start in September 2009. Hynix also plans to pass Mediatek validation by Spetember.
The July issue reports of progress with major notebook makers where VGA "products performance and image quality are tested through a strict evaluation process". The development of 1.0MP and 1.3MP products for notebooks is under way.
Hynix also announces "No-Focus Adjustment Module" using "NeoPAC" plate between a sensor and a lens. I'd guess it works by improving the module assembly precision.