Thursday, October 31, 2013

BeSang Licenses its 3D IC Technology to Hynix

PR Newswire: BeSang announces a patent license agreement with SK hynix. The license agreement covers a broad range of 3D IC products offered by SK hynix Inc. One of BeSang's 3D technologies covers image sensors:


  1. BeSang's 3D IC technology can be used for variety fields of products, such as DRAM, NAND Flash, ASIC, FPGA etc, and SK Hynyx focuses on memory-based business . So, just by readng the news article of their license agreement, it is quite early to conclude that SK Hynix will develop 3D CIS.

    1. Agree. In fact, my post does not say conclusively that Hynix will develop 3D CIS.


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