News and discussions about image sensors
BeSang's 3D IC technology can be used for variety fields of products, such as DRAM, NAND Flash, ASIC, FPGA etc, and SK Hynyx focuses on memory-based business . So, just by readng the news article of their license agreement, it is quite early to conclude that SK Hynix will develop 3D CIS.
Agree. In fact, my post does not say conclusively that Hynix will develop 3D CIS.
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