Thursday, February 06, 2014

Taiyo Yuden Develops Substrate with Cavity

Pressebox: Japan-based Taiyo Yuden announces a new type of copper-core embedded-parts multilayer wiring substrate “EOMIN” with a cavity formation technology that enables the creation of a depression in a part of the substrate:

A multilayer wiring substrate for camera modules mounted in compact mobile devices such as smartphones and wearable devices. Thinner camera modules can be realized by mounting an image sensor in the cavity.

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