PR Newswire: OmniVision announces the OV16880, a 16MP sensor built on OmniVision's PureCel-S stacked die technology. The 1/3-inch OV16880 introduces a new 1um (!) pixel technology, as well as advanced features such as phase detection autofocus (PDAF).
"Industry observers expect the 1/3-inch image sensor market for 13-megapixel to 16-megapixel resolution segments to double within the next two years, driven mostly by the proliferation of higher resolution mainstream smartphones and tablets," said Kalai Chinnaveerappan, senior product marketing manager at OmniVision. "The OV16880 is the industry's first 1/3-inch 16-megapixel image sensor, putting it in the forefront of this high-growth market segment. The sensor enables slim devices to transition from a 13-megapixel to 16-megapixel camera while maintaining excellent image quality and pixel performance."
The OV16880 PureCel-S stacked die pixel array features buried color filter array (BCFA) technology, which reduces pixel crosstalk and improves SNR. The OV16880 captures 16MP images at 30fps, allowing burst photography and zero shutter lag at full resolution. Additionally, the sensor is capable of capturing 4K video at 30fps, 1080p video at 90fps, and 720p video at 120fps. The OV16880 also supports interlaced high dynamic range (iHDR) timing functionality. The sensor fits into a 8.5 mm x 8.5 mm module with a z-height of less than 5 mm.
The sensor is currently available for sampling, and is expected to enter volume production in Q3 2015.
Update: TSMC Q1 2015 earnings call transcript hints that the sensor is manufactured by TSMC: "We have developed the world's first 1.0-micron pixel size 16-megapixel CMOS image sensor, with stacked image signal processor, which was announced in March by our customer for the next-generation smartphone."