Monday, June 01, 2015

Sony IMX278 Reverse Engineering

Chipworks was quick to analyse the new 13MP stacked Sony sensor with 1.12um RGBW pixels from Huawei P8 smartphone. The reverse engineering revealed a new TSV process and a backside DTI for better crosstalk:

Posted by Vladimir Koifman at 23:19

1 comment:

  1. AnonymousJune 2, 2015 at 4:29 PM

    It looks like that the DTI forms also a light pipe ...

    ReplyDelete

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