Imaging Conference at SEMICON Europa

SEMICON Europa is to be held in Grenoble, France on October 25-26, 2016. The Imaging Conference at the event has quite an impressive image sensor agenda:

• Drivers for Vision based Applications in the Automotive Environment
  Heinrich Gotzig, Valeo Master Expert, Valeo Schalter und Sensoren GmbH
• The direction of CMOS image sensor evolution.
  Teruo Hirayama, Corporate Executive/ Pesident of Device & Material R&D Group, Sony Corporation
• Camera module technologies and trends comprising assembly technologies, testing, and automation
  Kathrin Rieken, Design Engineer, Jabil Optics Germany GmbH
• Driving by numbers
  Richard Bramley, Safety Architect, NVIDIA
• Why image quality KPIs are a must for digital camera tuning
  Nicolas Touchard, VP Marketing, DxO Labs
• Next Generation Human Activity Sensing For Smart Buildings
  Guillaume CROZET, VP Sales & Marketing, IRLYNX
• Introducing vivaMOS - a CMOS image sensor spin-out from Rutherford Appleton Laboratory (RAL)
  Dan Cathie, CEO, vivaMOS Ltd
• Enhanced features of camera modules using ultrasonic ceramic motors
  Jean-Michel Meyer, CEO, miniswys SA
• Design strategies for low cost infrared cameras
  Guillaume DRUART, Research Scientist, ONERA
• Is there anything beyond? Terahertz imaging: potential and perspectives
  Matteo Perenzoni, Senior Researcher, FBK
• Democratization of optical spectroscopy for material analysis
  Damian Goldring, CTO, Consumer Physics Inc.
• A compact, 4 channels fluorescence imaging acquisition system with no moving parts for molecular biology applications.
  Marco Bianchessi, R&I Manager, STMicroelectronics
• Innovation in imaging on sensors, spectral filters, software and vision systems
  Maarten Willems, business director, imec
• Analogue and Digital Pixels for Time Resolved SPAD Sensors
  Robert Henderson, Professor, University of Edinburgh
• Neural Networks for Industry 4.0 : Analytics at the edge of the network
  Philippe LAMBINET, CEO, Cogito Instruments SA
• Event-Driven Sensing and Processing for Vision
  Bernabe Linares-Barranco, Reseacher, CSIC
• PRE-PROCESSING OF IMAGER DATA FOR 3D TOF IMAGING
  Beat De Coi, CEO, ESPROS Photonics AG
• A scientific HDR Multi-spectral imaging platform
  Benoit Dupont, Business Development, Pyxalis
• Optimization of CMOS image sensor utilizing Variable Temporal Multi-Sampling Partial Transfer Technique to Achieve Full-frame High Dynamic Range with Superior Low Light and Stop Motion Capability
  Salman Kabir, Systems Engineer, Imaging Division, Rambus
• Zero delay Focus with poLight TLens
  Jacques Dumarest, System Principal Engineer, poLight
• CMOS Image Sensor Scaling Enabled by Direct Bond Technology
  Paul Enquist, VP 3D R&D, Invensas
• Advanced Wafer Level Chip Scale Packaging Solution for Industrial CMOS Image Sensors.
  Jérôme VANRUMBEKE, Profesionnal Imaging Sensors Project Manager, e2v Grenoble
• High Dynamic Range (HDR) stereo camera system for applications in robotics
  Markus Strobel, Head of Department Vision Sensors, Institut für Mikroelektronik Stuttgart
• Deep submicron CMOS for novel types of smart image sensors
  Peter Seitz, Adjunct professor of optoelectronics, EPFL - Institute of Microengineering