Omnivision Announces 1/18-inch Wafer Level Module for Endoscopic Applications

PRNewswire: OmniVision announces the OVM6946, its first wafer-level camera module for medical applications. With a compact size of 1.05 mm x 1.05 mm, a z-height height of 2.27 mm, 120-deg FOV and an extended focusing range of 3 mm to infinity, the 1/18-inch 400x400 1.75um pixel OVM6946 is suited for minimally-invasive endoscopes. Built on OmniVision's OmniBSI+T pixel architecture, the OVM6946 is said to be the industry's most cost-effective single-chip imaging solution for single-use endoscopes.

"Cross-contamination risks, downtime inefficiencies, and high costs associated with repairs, pre-procedure testing, and sterilization of reusable endoscopes are fueling market interests in disposable endoscopes," said Aaron Chiang, director of marketing at OmniVision. "As a cost-effective and compact camera module with excellent image quality, we view the OVM6946 as an ideal solution for next-generation single-use endoscopes."

The OVM6946 is currently available for sampling, and is expected to enter volume production in Q1 2017.