This investment is intended to provide for new wafer processing equipment for stacked CMOS image sensors, and to increase and transform wafer lines capable of manufacturing CMOS image sensors. With this development, Sony plans to increase total production capacity for CCD and CMOS image sensors to approximately 60,000 of 300mm wafers per month by the end of September 2013.
The investment amount is approximately 80 billion yen ($997M), of which, the amount to be invested in the current fiscal year ending March 31, 2013 (approximately 45 billion yen) was included in the forecast of the capital expenditures for semiconductors in the current fiscal year announced at the annual earnings release on May 10, 2012. In addition, Sony will utilize a governmental subsidy in its investment plan which will be provided by the Ministry of Economy, Trade and Industry in Japan, through the "Subsidy for Domestic Location Promotion Projects" program.
|Sony Nagasaki Technology Center|