Ziptronix published a couple of Youtube videos on its wafer to wafer bonding process. The first one shows the 1um aligning machine bonding:
The second video shows a bonding of LiTaO3 wafer to silicon wafer, seeing through the LiTaO3 wafer down to the silicon wafer, touching the two wafers in the middle which prior to bonding are separated by a very thin layer of air, starts the bond wave which terminates at the wafers edge:
Positive: This is a technology thats time has come.
ReplyDeleteNegative: This technology is nothing new.