Tuesday, April 21, 2009

CULV Sensor Trade-Offs

Digitimes' sources are critical of Asustek decision to adopt a 1.3MP sensor for its consumer ultra-low voltage (CULV) notebook to be launched in the second half of 2009, because the thickness of 1.3MP module, compared with a VGA one, is likely to hinder sales of CULV notebooks, marketed for their slimness. Acer and HP have adopted VGA sensor for their CULV notebooks.

2 comments:

  1. Seems like reporters these days have nothing better to write about, this is so obviously an article to fill his quota with no good facts. Why not let the market decide if Asus is successful?

    Asus is using a good sensor, MI-SOC1330. And the target module height is less than 3.8mm, only a hair thicker than the 3.5mm~3.7mm LCD w/LED backlights used nowadays. If asus decided to use an alloy outer shell, they can still achieve a very sexy 5.5mm thickness on the lid

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  2. I'm not very familiar with notebook design, but most notebooks shells have curved profile these days. The top part of the lid, where sensor is located, is usually thinner than the the LCD part. If Asus is following the curved design, there might still be a thickness limitation, as compared with VGA sensors.

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