Thursday, January 19, 2017

Forza on CIS Trends

Semiconductor Packaging News posts Forza Silicon President Barmak Mansoorian view on the image sensor market trends:

"This year we celebrate Forza Silicon's 16th anniversary in the business of delivering innovative custom CMOS image sensor (CIS) and IC design solutions.

Technological advancements in devices and architectures are still remarkable in the CIS marketplace. Stacked sensor design technology was once a new concept and is now a viable option in high volume applications.

Forza has been working on stacked CIS for several years and we believe it will dominate advances in the CIS marketplace for the next 3-5 years. While stacking has its challenges, Forza is developing custom stacking flows involving intelligent design choices and good product engineering to help our customers take advantage of enhanced technology options.

Additionally, while the cellphone camera has taken center stage with its upgrades we expect a strong response from the DSLR/digital still camera with high-speed 4K video and higher dynamic range. Its performance might also challenge the incumbents in the digital cinema and broadcast markets.

Lastly, as more devices get connected everyday, the Internet of Things (IoT) will remain an important application for the growing network of sensors. At Forza, we continue to look at ways to leverage the stacked chip technology for our customers while still focusing on power, pixel performance, yield, noise and other specific application requirements.


  1. Are you using copper bump bonding for your stacked sensors? Do you have any published papers referencing what you do?

  2. What are the latest technological inflections in the CIS industry?
    What are the key challenges in manufacturing?

    I am asking this from the equipment manufacturer point-of-view. For example, what challenges do I expect if I am ion implanter supplier?


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