Sony announces new global shutter image sensor IMX908

Sensor specs: https://www.sony-semicon.com/en/products/is/security/security/IMX908.html

News: https://www.sony-semicon.com/en/news/2026/2026031701.html 

Sony Semiconductor Solutions to Release 4K Image Sensor for Security Cameras with the Industry’s Smallest 1.45 µm LOFIC Pixels
Contributing to improved recognition precision with high image quality in high-contrast environments and dark scenes

Atsugi, Japan — Sony Semiconductor Solutions Corporation (Sony) today announced the upcoming release of the IMX908, a 4K CMOS image sensor for security cameras with the industry’s smallest 1.45 µm LOFIC pixels.

The new sensor uses the newly developed LOFIC pixels to achieve 96 dB high dynamic range imaging at 4K resolution with a single exposure. Building on this, improved low-light performance delivers high-quality imaging with reduced highlight blowout, loss of shadow detail, and noise in both high contrast environments and dark locations compared to conventional products.

The new sensor will expand Sony’s lineup of products with both high-resolution and high dynamic range for security camera applications, which require high-precision image recognition in a wide range of indoor and outdoor environments, thereby contributing to a safer and more secure society.

Security cameras have been widely used not just for security surveillance, but also in broad applications including monitoring public spaces such as urban areas and other facilities. As AI-based image recognition becomes a standard feature in cameras, the demand for image sensors that can provide stable and high-quality imaging in conditions from bright to dark continues to grow.

The IMX908 employs STARVIS 3™, Sony’s proprietary LOFIC pixel technology developed for security cameras. It enables nearly 20x the amount of saturated charge as conventional products and delivers an approximately 27% improvement in low-light performance, which makes for a dynamic range of 96 dB. Not using multiple exposures, the more common method for HDR imaging, this sensor also provides high dynamic range imaging with a single exposure to deliver high-definition images with fewer artifacts, even of scenes with moving subjects. Furthermore, Sony’s original pixel design has enabled all these features to be provided at the industry’s smallest LOFIC pixel size of 1.45 µm. By offering higher-quality 4K imaging even in high-contrast scenes and dark environments, the new product will contribute to improved recognition accuracy and multifunctionality in security cameras.

 

Conference List - September 2026

IEEE 2026 International Conference on Multisensor Fusion and Integration for Intelligent Systems - 2-4 September 2026 - Pilsen, Czechia - Website

IEEE European Solid-State Electronics Research Conference - 7-10 September 2026 - Palma de Mallorca, Spain - Website

The 12th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging, PIXEL2026 - 7-11 September 2026 - Miyazaki, Japan - Website

IEEE International Conference on Image Processing - 13-17 September 2026 - Tampere, Finland - Website

SPIE Sensors + Imaging 2026 - 14-17 September 2026 - Edinburgh, Scotland, UK - Website

Sensor Expo Japan - 16-18 September 2026 - Tokyo, Japan - Website

RADiation and its Effects on Components and Systems (RADECS) - 28 September-2 October 2026 - Prague, Czech Republic - Website

12th International Conference on Sensors and Electronic Instrumentation Advances - 30 September-2 October 2026 - Granada, Spain - Website

If you know about additional local conferences, please add them as comments.

Return to Conference List index

Curved large-format IR sensor

Paper link: https://opg.optica.org/oe/fulltext.cfm?uri=oe-34-4-6880

In a recently published paper in Optics Express titled "Highly curved large-format sensors for infrared imaging", O'Masta et al of HRL Laboratories LLC write:

A curved, rather than flat, photoreceptive surface requires fewer optical elements and enhances illumination and sensitivity uniformity for wide-field vision. While such designs are common in vertebrate eyes, creating manmade curved sensing surfaces using high-performance sensors has been technologically challenging. Here, we surpassed previous practices by manipulating the strain within a die using a ductile metal layer. This enabled scalability to large-format sensors, which are valuable for capturing wide viewing angles with high resolution. We showcased this methodology using two types of III-V compound semiconductor photodetectors for mid-wave infrared (MWIR) imaging. The radiometric response of a hybridized fanout chip curved to a solid angle of 0.24 sr – over 300% beyond the limit of standard methods – was evaluated. A fully imaging focal plane array curved to 0.11 sr exhibited >97% operability. This demonstration of a spherically curved, cryogenically cooled MWIR imaging sensor highlights the feasibility of curving sensors comprised of heterogeneous semiconductor layering, which are commonly used in infrared, visible, and ultraviolet imagers. 

 

Pushing the limits for spherically curving existing imaging sensors, as demonstrated with an infrared focal plane array (FPA). (a) A simple lens naturally focuses light onto a curved rather than flat image surface. (b) Cross-sectional schematic showing heterogenous layering of a cryogenically-cooled, MWIR FPA, following post-processing steps to enhance curving potential. (c) Historical [2–10] and present chip solid angle as a function of chip size. Details are provided in Supplement 1, Table S2. The dashed line represents the predicted limit for curving bare semiconductor die developed here. (d) Image of MWIR hybridized fanout chip curved to a 0.24 sr solid angle.

Mechanical failure modes when spherically curving bare semiconductor chips. Data is shown for a 37 mm side length, square Si die. (a) Image sequence of 60 µm thick Si die being curved to 0.08 sr, with the pneumatic pressure noted along top. Striped pattern is from reflection of a poster board to aid visualization of curvature. Die is imaged through a transparent Mylar film. (b) Fracture of an 80 µm thick die curved to 0.08 sr. (c) Buckling of a 40 µm thick die when curving to 0.12 sr. (d), (e) FEA simulations of the dies curved in (b) and (c), respectively. (f) Fracture (contour map) and buckling (greyed in region) predictions. Symbols show experimental values, with measured probabilities of fracture from 10 replicate specimens indicated by color. (g) Predicted maximum solid angle for square Si dies, assuming Pf = 30%.

 

Maps of the minimum thickness hcr to suppress buckling of a bare Si die. (a) Comparison of buckling criterion predictions (dashed lines) compared to FEA results (circles) for square die of side length L. Thicknesses below a given line are predicted to buckle. (b) Comparison of predictions (dashed line) to experimental values (squares) for an L = 37 mm square die.

 

A 16 megapixel, 10 µm pitch InAsSb bulk alloy based FPA curved to 0.11 sr. (a) Picture of the curved FPA after wire-bonding to the PCBA for testing. (b) Measured responsivity across the curved FPA. (c) Histogram of the responsivity.

 

eyeo opens new design center in Antwerp

Link: https://eyeo-imaging.com/eyeo-opens-new-design-center-in-antwerp/

eyeo opens new design center in Antwerp for next-generation color-splitting image sensors development

Opening March 17 at Antwerp Berchem’s MeetDistrict, the new office will house a dedicated expert design team delivering eyeo’s breakthrough color-splitting sensors to the world

Antwerp (Belgium), March 17 2026 – eyeo today announced the opening of a new office at MeetDistrict Berchem in Antwerp, Belgium. Located steps from well-connected Antwerp-Berchem train station, the new center will house a dedicated sensor design team focused on developing eyeo’s next generation of nanophotonic color-splitting image sensors, advancing the company’s mission to give all cameras perfect eyesight.

eyeo revolutionizes imaging for consumer, industrial, XR, smart city and mobile applications with color-splitting photonics technology that triples light sensitivity and breaks sensor resolution limits, unlocking picture quality, color accuracy and resolution never before possible in smartphones and beyond.

Scaling from Antwerp
Antwerp, with its vibrant sensor design ecosystem and access to exceptional engineering talent, is the natural home for eyeo’s next step: scaling its color splitting image sensors into production-ready designs for mobile, XR, smart city and other consumer applications. The new design center marks a strategic expansion as eyeo ramps up its commercialization roadmap.

Jeroen Hoet, co-founder and CEO of eyeo: “Our technology is ready to change imaging fundamentally. To deliver it at scale, eyeo is building a world-class image sensor design team in Antwerp. This is where breakthrough science will be engineered into the image sensors that power tomorrow’s cameras, impacting the 10 billion sensors sold every year.” 

 eyeo is hiring
eyeo is actively recruiting IC design and system architecture specialists to join the Antwerp team. If you are passionate about image sensing, like to work in the most advanced 3D stacked CMOS image sensor technologies and want to build the future of imaging, apply now: eyeo-imaging.com/vacancies

STMicro Nvidia collab

STMicroelectronics accelerates global adoption and market growth of Physical AI with NVIDIA
 
 STMicroelectronics to integrate ST sensors, microcontrollers, and motor control solutions with NVIDIA robotics ecosystem to help developers design, train, and deploy humanoid robots and other physical AI systems with higher efficiency, reliability, and scalability
 First steps with integration of Leopard Imaging stereo depth camera enabled by ST with the NVIDIA Holoscan Sensor Bridge, and the addition of the high-fidelity sim-to-real model of ST IMU in NVIDIA Isaac Sim ecosystem
 
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the acceleration of global development and adoption of physical AI systems, including humanoid, industrial, service and healthcare robots. ST is integrating its comprehensive portfolio for advanced robotics, into the reference set of components compatible with the NVIDIA Holoscan Sensor Bridge (HSB). In parallel, high-fidelity NVIDIA Isaac Sim models of ST components are being integrated into both companies’ robotics ecosystems to support faster, more accurate sim-to-real research and development. The first deliverables available to developers today include the integration of Leopard’s depth camera enabled by ST with the NVIDIA HSB and the high-fidelity model of an ST IMU into NVIDIA’s Isaac Sim ecosystem.
 
“ST is well engaged within the robotics community, providing robust support and a well-established ecosystem,” said Rino Peruzzi, Executive Vice President, Sales & Marketing, Americas & Global Key Account Organization at STMicroelectronics. “Our collaboration with NVIDIA aims to unleash the next wave of cutting-edge robotics innovation with developer and customer experience streamlined at every step, from the inception of AI algorithms to the seamless integration of sensors and actuators. This will accelerate the evolution of sophisticated AI-driven physical platforms.”
 
“Accelerating the development of next-generation autonomous systems requires high-fidelity simulation and seamless hardware integration to bridge the gap between virtual training and real-world deployment,” said Deepu Talla, Vice President of Robotics and Edge AI at NVIDIA. “The integration of STMicroelectronics’ sensor and actuator technologies with NVIDIA Isaac Sim, Holoscan Sensor Bridge and Jetson platforms provides developers with a unified foundation to build, simulate and deploy physical AI at scale.”
 
Simplifying sensor and actuator integration with the Holoscan Sensor Bridge
 
With the NVIDIA HSB, developers can unify, standardize, synchronize, and streamline data acquisition and logging from multiple ST sensors and actuators, a critical foundation for building high fidelity NVIDIA Isaac models, accelerating learning, and minimizing the sim to real gap.
 
The goal is to simplify the process of connecting ST sensors and actuators to NVIDIA Jetson platforms through pre-integrated solutions for the combination of STM32 MCUs, advanced sensors (including IMUs, imagers, and ToF devices) and motor‑control solutions, particularly for humanoid robot designs. Leopard Imaging’s stereo depth camera for robots is the perfect example. Using ST imaging, depth and motion-sensing technologies, it is expected to support a broad wave of designs across Physical AI OEMs, academic research groups and the industrial robotics community.
 
Reducing cost, complexity challenges with high-fidelity modeling for Omniverse Isaac
 
Advanced robotics developers face high development costs, in addition to modeling challenges. High‑fidelity simulations with extensive randomization demand substantial GPU and CPU resources and large datasets. Selecting which parameters to randomize, and over what ranges, requires deep domain expertise. Poor choices can result in unrealistic scenarios or inefficient training. Finally, excessive variability can confuse models, slow convergence, and degrade real‑world performance when randomization no longer reflects plausible conditions.
 
ST and NVIDIA’s objective is to provide accurate, hardware-calibrated models for the comprehensive portfolio of ST components matching the requirements of advanced robotics. Following the availability of the first model of an IMU, ST is working to bring developers models of ToF sensors, actuators and other ICs derived from benchmark data collected on real ST hardware, using ST tools to capture accurate parameters and realistic behavior, resulting in models optimized to NVIDIA’s Isaac Sim ecosystem. NVIDIA HSB is being integrated into ST’s toolchain collaboratively.
 
As a result, ST and NVIDIA envision that more accurate models will significantly improve robot learning. With models that closely mirror real-world device behavior, robots can learn from simulations that better reflect actual conditions, shortening training cycles and lowering the cost of building and refining humanoid robotics applications.

Is Huawei developing its own image sensor?

Link: https://www.huaweicentral.com/huaweis-first-1-inch-camera-sensor-is-ready-with-new-imaging-tech/

Huawei’s first 1-inch camera sensor is ready with new imaging tech

 

...

This new sensor is a 50MP camera with a 1/1.3-inch format. It uses an RYYB (Red, Yellow, Yellow, Blue) filter array that allows 40% more light to reach the sensor.

RYYB sensors enhance low-light performance with noise reduction in dark scenarios and improve the overall dynamic range to offer brighter and more detailed images even under challenging conditions.

On the flip side, the 1-inch camera sensor is paired with DCG and HDR technology. DCG refers to Dual Conversion Gain technology that boosts the image quality by capturing a single exposure with two different gains – high and low simultaneously. 

... 

Pointcloud's 4D FMCW lidar paper published in Nature

Settembrini et al from Pointcloud GmbH (Zürich, Switzerland) published a paper titled "A large-scale coherent 4D imaging sensor" in Nature magazine.

Link: https://www.nature.com/articles/s41586-026-10183-6 

Abstract: Detailed and accurate 3D mapping of dynamic environments is essential for machines to interface with their surroundings and for human–machine interaction. Although considerable effort has been made to create the equivalent of the complementary metal–oxide–semiconductor (CMOS) image sensor for the 3D world, scalable, high-performance, reliable solutions have proven elusive. Focal plane array (FPA) sensors using frequency-modulated continuous-wave (FMCW) light detection and ranging (LiDAR) have shown potential to meet all of these requirements and also provide direct measurement of radial velocity as a fourth dimension. Previous demonstrations, although promising, have not achieved the simultaneous scale and performance required by commercial applications. Here we present a large-scale, coherent LiDAR FPA enabled by comprehensive chip-scale optoelectronic integration. A 4D imaging camera is built around the FPA and used to acquire point clouds. At the core is a 352 × 176-pixel 2D FMCW LiDAR FPA comprising more than 0.6 million photonic components, all integrated on-chip together with their associated electronics. This represents a five times increase in pixel count with respect to previous demonstrations. The pixel architecture combines the outbound and inbound optical paths within the pixel in a monostatic configuration, together with coherent detectors and electronics. Frequency-modulated light is directed sequentially to groups of pixels by in-plane thermo-optic switches with integrated electronics for driving and calibration. An integrated serial digital interface controls both optical switching and readout synchronously. Point clouds of objects ranging from 4 to 65 m with per-pixel integration time compatible with frame rates from 3 to 15 frames per second (fps) are shown. This result demonstrates the capabilities of FMCW LiDAR FPA sensors as enablers of ubiquitous, low-cost, compact coherent 4D imaging cameras. 

a, The architecture contains an imaging chip that simultaneously functions as both transmitter and receiver. The light path from the chip to target (owl) is determined by the optical lens system. b, Microscope image of the chip, showing the active optical area and thermo-optical switching network. c, Schematic of the light path selection process on the imaging chip. *Some of the outputs of the first-level switches are not connected.
 

a, Schematic representation of the coherent FPA block. The modulated light is routed to a single 8-pixel row, illuminating a subsection of the scene. The in-plane rotation and emission angle of each grating coupler pair are adjusted to enhance detection efficiency. b, Schematic image of a single coherent pixel, including grating coupler pairs, balanced germanium photodetectors and an integrated TIA. c, Schematic image of a single element of the concave microlens array deposited on-chip to increase light-coupling efficiency.

 

  

 

a, Point cloud of an office scene (6–11 m) obtained by a single acquisition using the entire imaging array with a f = 35 mm focal length lens. b, Point cloud from two buildings located 20–65 m away, obtained by coherently averaging four acquisitions with a f = 50 mm focal length lens. c, Velocity-annotated point cloud of the disc that is rotating about its vertical axis, obtained using a single acquisition with a f = 35 mm focal length lens. d–f, Photographs of the scenes in a–c. Red rectangles denote the regions of interest.

 

a, Distribution of optical power levels arriving at each pixel, measured by integrated monitor photodiodes. b, Distribution of the measured shot-noise to amplifier-noise magnitude ratio κ over the array. The mean value of κ is 0.62. c, SNR loss as a function of the shot-noise to amplifier-noise ratio. Operating at κ = 0.62 results in a SNR loss of −5.6 dB below a shot-noise-limited system. d, Point cloud obtained with coherent averaging of three frames from the stationary calibrated targets at 7.2 m and photograph of the three calibrated targets with known Lambertian reflectivities and a retroreflector (‘Retro’). e, Photograph of the entire system. SOA, semiconductor optical amplifier. f,g, Distribution of distance (f) and velocity (g) measurement errors.

Paper on FSI vs BSI for SPADs

In a paper titled "" Eom et al. from Yonsei University, EPFL, Sungkyunkwan University and TruPixel, Inc. write:

This paper presents a process-controlled study of illumination engineering in single-photon avalanche diodes (SPADs) fabricated in a 110 nm standard CMOS image sensor (CIS) technology. Front-illuminated (FI) and back-illuminated (BI) SPADs were implemented with identical front-end-of-line (FEOL) structures, including the junction and guard-ring configurations, enabling the isolation of the effects of illumination direction and back-end-of-line (BEOL) configuration without modifying the junction structure. Through TCAD simulations and comprehensive experimental characterizations, including current–voltage, light-emission, dark count rate (DCR), photon detection probability (PDP), and timing-jitter measurements, we systematically analyze the performance trade-offs introduced by the BI configuration. The BI SPAD exhibits enhanced near-infrared PDP and a broader spectral response due to its deeper absorption region and the incorporation of a metal reflector, while maintaining identical avalanche characteristics, as evidenced by an unchanged 72 ps full-width-at-half-maximum (FWHM) timing jitter. However, the backside illumination increases the diffusion tail, indicating a trade-off between near-infrared sensitivity and diffusion-related timing performance. These results provide design guidelines for optimizing SPAD performance through illumination-direction and BEOL engineering while preserving the FEOL design and demonstrate a useful approach for SPAD integration in standard CMOS technology. 

Link: https://www.mdpi.com/1424-8220/26/5/1664

Figure 1. Cross-sections of the SPADs with different illumination configurations: (a) FI SPAD; (b) BI SPAD.

 Figure 5. LET results of the SPADs at Vex = 3 V, visualizing avalanche emission across the active area: (a) FI SPAD; (b) BI SPAD.

 

Figure 9. PDP spectra of the FI and BI SPADs at Vex = 3 V, together with the optical penetration depths of different wavelengths in silicon: (a) PDP spectra from 400 to 950 nm. (b) Optical penetration depths in silicon.
 

Figure 10. Wavelength-dependent PDP enhancement of the BI SPAD over the FI SPAD.

 

Teledyne e2v announces camera with angle-sensitive pixels

From globalnewswire: https://www.globenewswire.com/news-release/2026/03/05/3249875/0/en/Teledyne-e2v-Introduces-Perciva-5D-Camera-Occlusion-free-3D-Vision-for-Industrial-Retail-and-Robotic-Imaging.html

Teledyne e2v Introduces Perciva™ 5D Camera: Occlusion-free 3D Vision for Industrial, Retail, and Robotic Imaging

GRENOBLE, France, March 05, 2026 (GLOBE NEWSWIRE) -- Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces the launch of the Perciva™ 5D camera, a breakthrough imaging innovation designed to make high-quality short-range 3D vision cost-effective, reliable, and easy to integrate.

Most industrial cameras only capture 2D images, yet many applications increasingly require depth perception at close and very-close distances. Perciva 5D delivers this capability through a unique Angular Sensitive Pixel technology and advanced on-board processing, enabling real-time 2D and 3D image fusion at the calibrated working distance range. Perciva 5D also features a powerful Neural Processing Unit (NPU), enabling Artificial Intelligence models to run on-device and be customized to each customer’s specific requirements.

Perciva 5D generates 2D and 3D data from a single CMOS sensor, free from optical occlusion, producing time-aligned 2D frames alongside pixel-aligned 3D depth maps. With comprehensive 3D processing built directly into the camera, users benefit from immediate depth maps or point-cloud outputs. Perciva 5D operates using ambient light, indoors or outdoors, eliminating the need for an external NIR source while maintaining reliable performance and minimizing overall system costs. Designed for challenging environments, it offers plug-and-play integration through its GenICam-compliant, GigE Vision interface and robust IP6x-rated housing with industrial M12 connectors.

Factory calibrated and weighing just 230 grams, Perciva 5D operates at less than 5 W, and is ideal for robotics (arms, cobots and humanoids), retail self-checkout solutions, and 3D industrial process monitoring. It supports user-adjustable frame rates or triggered acquisition and multiple power options. Using GenDC / GenTL the camera integrates seamlessly with Teledyne’s Spinnaker® 4 API and SpinView® for 2D / 3D visualisation, as well as leading machine-vision software platforms.
Perciva 5D will be showcased during Embedded World, Nuremberg, Germany, from 10-12 March 2026. Visit Teledyne at stand 2-541 in Hall 2 or contact us online for more information.

Documentation, samples, and software for evaluation or development are available upon request. 

New Leadership at Bharat Semi

Dr Boyd Fowler has joined as the Chief Technology Officer at Bharat Semi, an Indian sensor/semiconductor startup.

Here's some text from their recent post:

One of the world's foremost leaders in sensors, Boyd brings deep expertise in CMOS and infrared image sensors, semiconductor architecture, and large-scale engineering strategy. He played a foundational role in developing the technology that enabled commercial image sensors. Additionally, he helped develop the first pinned photodiodes at the world's largest fab.  Before joining Bharat Semi, Boyd served as CTO at OMNIVISION Technologies and held senior technology leadership roles at Google, Fairchild Imaging, and BAE Systems. He is known for defining long-term technology vision and leading complex engineering organizations where discipline, scale, and execution are critical.

Link: https://www.bsemis.com/ 

PS: Bharat Semi should not be confused with Bharath Semiconductors, Bharat Semitech, or Bharat Semiconductor Society.