Monday, March 04, 2024

Andes and MetaSilicon collaborate on automotive CIS

From Yahoo Finance news:

Andes Technology and MetaSilicon Collaborate to Build the World’s First Automotive-Grade CMOS Image Sensor Product Using RISC-V IP SoC

Hsinchu Taiwan, Feb. 22, 2024 (GLOBE NEWSWIRE) -- RISC-V IP vendor Andes Technology and edge computing chip provider MetaSilicon jointly announced that the MetaSilicon MAT Series is the world's first automotive-grade CMOS image sensor series using RISC-V IP SoC, using Andes' AndesCore™ N25F-SE processor. They are designed in accordance with the ISO26262 functional safety standard to achieve ASIL-B level and follow the AEC-Q100 Grade 2 to achieve a high level of safety and reliability. And by using technologies such as HDR, advanced imaging can be achieved in a simple, economical, and efficient system. They not only address the effects of high dynamic range, high sensitivity, and high color reproduction, but also meet the application requirements of ADAS decision-making.

The N25F-SE from Andes Technology is a 32-bit RISC-V CPU core that can support the standard IMACFD instruction set, which includes an efficient integer instruction set and a single/double precision floating point operation instruction set. The N25F-SE's high-efficiency five-stage pipeline achieves a good balance between high operating frequency and a streamlined design. It also has rich configurable options and flexible interface configuration, which greatly simplify the SoC development. In addition, the N25F-SE has obtained the ISO 26262 ASIL-B full compliance certification, which enables the image sensor chip to meet the vehicle-level safety requirement. For the development of MetaSilicon's automotive-grade chips, the N25F-SE and its safety package provide a good fit CPU solution and together with Andes’ technical support shorten the chip development time significantly.

MetaSilicon has first-class innovative R&D capabilities and has developed several cutting-edge technologies including LOFIC (Lateral Overflow Integration Capacitor) + DCG (Dual Conversion Gain) HDR (High-Dynamic Range), which meet the high-quality image requirements for smart car vision applications. The MAT Series 1MP CMOS image sensor chip has low power consumption and high dynamic range (HDR) characteristics. Its effective image resolution is 1280 H * 960 V, and it can support high dynamic range image output up to 60fps @120dB. The other MAT Series 3MP CIS has multiple capabilities such as low power consumption, ultra-high dynamic range (HDR), on-chip ISP, LFM, etc. Its effective image resolution is 1920 H * 1536 V, and can support up to 60fps frame rate, and the dynamic range can reach the industry-leading 140dB+. These chips can provide reliable high-quality image information for intelligent automotive applications.

"The N25F-SE provides a safety package, which includes a safety manual, safety analysis report and a development interface outline. The N25F-SE and its safety package are effective, high-performance and flexible automotive solutions. They can significantly reduce the time required to design automotive grade SoCs and to comply with the ISO 26262 standard", said Dr. Charlie Su, President and CTO of Andes Technology. "We are very pleased that N25F-SE's IP and safety package efficiently support MetaSilicon shorten the development time for its two automotive-grade chips. We also look forward to more cooperation between the two companies in the future to create more innovative products."

Jianhua Zheng, CTO of MetaSilicon said, “Among the various sensors used in automotive ADAS applications, visual image processing is particularly important. Once the image is not accurate and timely enough, it will directly lead to errors in the judgment of the back-end algorithm, so HDR performance requirements are extremely high. MetaSilicon's LOFIC+DCG HDR technology can achieve an ultra-high dynamic range of 140dB+ to meet practical application needs in the automotive ADAS field. We are honored to work closely with Andes Technology on two high-performance chips, using the world's first ISO 26262 certified RISC-V core N25F-SE that meets the functional safety standards. As a result, we can shorten the product development time and achieve functional safety goals."

Sunday, March 03, 2024

Job Postings - Week of 3 March 2024

Prophesee

Internship - R&D - Sensor Simulation

Paris, France

Link

Sandia National Laboratories

Postdoctoral Appointee Optoelectronics, HI & Quantum Device

Albuquerque, New Mexico, USA

Link

Sandia National Laboratories

Intern - Photonic & Phononic Microsystems - R&D Undergrad Summer

Albuquerque, New Mexico, USA

Link

Tesla

Engineering Technician, Camera

Palo Alto, California, USA

Link

University of London

Silicon Detector Technician

Mile End, London, England, UK

Link

Turion Space

Advanced Sensors Engineer

Irvine, California, USA

Link

SmartRay

Sensor Application Engineer

Penang, Malaysia

Link

Joint Institute for Nuclear Research

Postdoctoral Programme in Novel Cherenkov Detector Development

Dubna, Russia

Link

Friday, March 01, 2024

VPS Semi presents a 600MP image sensor

From: http://www.vpssemi.com/NewsDetail?id=72 (Translated to English with Google Translate)

New product release 
VPS800 - New large area array image sensor chip released for wide-area surveillance
 


On September 6, the 24th China International Optoelectronics Expo kicked off at the Shenzhen Baoan International Convention and Exhibition Center. At this Optoelectronic Expo, Nanjing VPS Semiconductor Technology Co., Ltd. released a new product for the wide-area monitoring field - VPS800 large area array imaging. This series of chips has a pixel count of over 600 million, a pixel size of 0.7 microns, and supports 16 ROIs (regions of interest). It can provide imaging solutions at longer distances and a wider range, expanding the new boundaries of existing wide-area monitoring solutions.

The VPS800 large area array imaging chip is based on the internally-developed vertical charge transfer imaging device (VPS) as the core. It has a single-chip pixel size of more than 600 million, which can solve the problems of complexity, large volume, and high power consumption of existing large area array camera systems. It achieves long range and large field of view while reducing size, weight, power consumption, and cost, allowing coverage of a wider range clearly while obtaining more micro details. Currently, it is mainly used in security monitoring, commercial satellites, industrial inspection, etc. 

For scenarios that require both large-scale observation and the acquisition of a large number of micro-details, the VPS800 large-area image sensor chip can support long-distance fixed-point shooting. With one imaging, large-scale observation can be achieved and the fine details of the entire image can be retained.
 
For scenarios presenting large target areas and high resolution such as commercial satellite surveillance, imaging sensors are required to be "small" and "light". The VPS800 large-area imaging chip can support a single-chip pixel size of more than 600 million without the need for splicing. It is small in size and light in weight - more in line with the demand scenarios of micro/nano satellites.
 
It is worth mentioning that the chip supports 16 ROI (Region of Interest) functions, which allows users to read sensor information from any area, thus reducing the amount of information read. The target can be continuously observed through one frame, and it can also achieve multi-target synchronous tracking. It can be used as a supplementary solution to existing security monitoring solutions, expanding the observation scope and application boundaries of existing security monitoring solutions.

Note: This startup was previously featured in a blogpost from 2022: https://image-sensors-world.blogspot.com/2022/01/vps-semiconductor-raises-100m-rmb-in.html

Thursday, February 29, 2024

STMicroelectronics announces new ToF Sensors

VD55H1 Low-Noise Low-Power iToF Sensor
-- New design feat, packing 672 x 804 sensing pixels in a tiny chip size and can map a three-dimensional surface in great detail by measuring distance to over half a million points.
-- Lanxin Technology will use the VD55H1 for intelligent obstacle avoidance and high-precision docking in mobile robots; MRDVS will enhance its 3D cameras adding high-accuracy depth-sensing. 



VL53L9 dToF 3D Lidar Module
-- New high-resolution sensor with 5cm – 9m ranging distance ensures accurate depth measurements for camera assistance, hand tracking, and gesture recognition.
-- VR systems use the VL53L9 to depict depth more accurately within 2D and 3D imaging, improving mapping for immersive gaming and other applications like 3D avatars.

The two new products announced will enhance safer mobile robots in industrial environments​ and smart homes as well as enable advanced VR applications.



The VL53L9CA is a state of the art, dToF 3D lidar (light detection and ranging) module with market leading resolution of up to 2.3k zones and accurate ranging from 5cm to 10m.


Full press release:

STMicroelectronics expands into 3D depth sensing with latest time-of-flight sensors

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with market-leading 2.3k resolution, and revealed an early design win for the world’s smallest 500k-pixel indirect Time-of-Flight (iToF) sensor.
 
“ToF sensors, which can accurately measure the distance to objects in a scene, are driving exciting new capabilities in smart devices, home appliances, and industrial automation. We have already delivered two billion sensors into the market and continue to extend our unique portfolio, which covers all types from the simplest single-zone devices up to our latest high-resolution 3D indirect and direct ToF sensors,” said Alexandre Balmefrezol, General Manager, Imaging Sub-Group at STMicroelectronics. “Our vertically integrated supply chain, covering everything from pixel and metasurface lens technology and design to fabrication, with geographically diversified in-house high-volume module assembly plants, lets us deliver extremely innovative, highly integrated, and high-performing sensors.”
 
The VL53L9, announced today, is a new direct ToF 3D LiDAR device with a resolution of up to 2.3k zones. Integrating a dual scan flood illumination, unique in the market, the LiDAR can detect small objects and edges and captures both 2D infrared (IR) images and 3D depth map information. It comes as a ready-to-use low power module with its on-chip dToF processing, requiring no extra external components or calibration. Additionally, the device delivers state-of-the-art ranging performance from 5cm to 10 meters.
 
VL53L9’s suite of features elevates camera-assist performance, supporting macro up to telephoto photography. It enables features such as laser autofocus, bokeh, and cinematic effects for still and video at 60fps (frame per second). Virtual reality (VR) systems can leverage accurate depth and 2D images to enhance spatial mapping for more immersive gaming and other VR experiences like virtual visits or 3D avatars. In addition, the sensor’s ability to detect the edges of small objects at short and ultra-long ranges makes it suitable for applications such as virtual reality or SLAM (simultaneous localization and mapping).
 
ST is also announcing news of its VD55H1 ToF sensor, including the start of volume production and an early design win with Lanxin Technology, a China-based company focusing on mobile-robot deep-vision systems. MRDVS, a subsidiary company, has chosen the VD55H1 to add high-accuracy depth-sensing to its 3D cameras. The high-performance, ultra-compact cameras with ST’s sensor inside combine the power of 3D vision and edge AI, delivering intelligent obstacle avoidance and high-precision docking in mobile robots.

In addition to machine vision, the VD55H1 is ideal for 3D webcams and PC applications, 3D reconstruction for VR headsets, people counting and activity detection in smart homes and buildings. It packs 672 x 804 sensing pixels in a tiny chip size and can accurately map a three-dimensional surface by measuring distance to over half a million points. ST’s stacked-wafer manufacturing process with backside illumination enables unparalleled resolution with smaller die size and lower power consumption than alternative iToF sensors in the market. These characteristics give the sensors their excellent credentials in 3D content creation for webcams and VR applications including virtual avatars, hand modeling and gaming.

First samples of the VL53L9 are already available for lead customers and mass production is scheduled for early 2025. The VD55H1 is in full production now.

Pricing information and sample requests are available at local ST sales offices. ST will showcase a range of ToF sensors including the VL53L9 and explain more about its technologies at Mobile World Congress 2024, in Barcelona, February 26-29, at booth 7A61.
 

Wednesday, February 28, 2024

Five Jobs from Omnivision in Norway and Belgium

 Omnivision has sent us the following list of openings in their CMOS sensor development teams -

In Oslo, Norway:

Analog Characterization Engineer   Link

Functional Safety Verification Engineer   Link

Sr. Digital Design Engineer   Link

Staff Digital Design Engineer   Link

In Mechelen, Belgium:

Staff Characterization Engineer   Link

Jobs Submitted by Employers

onsemi (11 Feb 2024)   Link 

Sony (7 Feb 2024)    Link

Qurv (3 Feb 2024)   Link 

Photonis - (31 Jan 2024)   Link 

Sony Semiconductor Solutions - America (25 Jan 2024)   Link

CEA Leti (23 Jan 2024)   Link 

ISAE SUPAERO (23 Jan 2024)   Link  

Transformative Optics (20 Jan 2024)   Link

Teledyne (13 Dec 2023)   Link

Sunday, February 25, 2024

Job Postings - Week of 25 February 2024

Sony UK Technology Centre

Industrial Engineer

Penceod, Wales, UK

Link

Apple

Image Quality Analyst

San Diego, California, USA

Link

Jenoptik

Imaging Engineer

Camberley, England, UK

Link

NASA

Postdoc - Materials and Process Development for Ultraviolet Detector Technologies (apply by 1 Mar 2024)

Pasadena, California, USA

Link

ASML

Research Group Lead Sensor Modelling and Computational Imaging

Veldhoven, Netherlands

Link

Brookhaven National Laboratory

Deputy Director-Instrumentation Division

Upton, New York, USA

Link

Axon

Principal Systems Engineer (Remote)

Scottsdale, Arizona, USA

Link

Rochester Institute of Technology

Tenure Track Faculty – Center for Imaging Science

Rochester, New York, USA

Link

Science and Technology Facilities Council – Rutherford Appleton

Detector Scientist Industrial Placement

Didcot, Oxfordshire, England, UK

Link


Saturday, February 24, 2024

Conference List - August 2024

International Symposium on Sensor Science - 1-4 Aug 2024 - Singapore - Website

Quantum Structure Infrared Photodetector (QSIP)  International Conference - 12-16 Aug 2024 - Santa Barbara, California, USA - Website

SPIE Optics & Photonics - 18-22 Aug 2024 - San Diego, California, USA - Website

International Conference on Sensors and Sensing Technology - 29-31 August 2024 - Valencia, Spain - Website

If you know about additional local conferences, please add them as comments.

Return to Conference List index

 

Friday, February 23, 2024

Teledyne acquires Adimec

From Metrology News: https://metrology.news/teledyne-to-acquire-high-performance-camera-specialist-adimec/

Teledyne to Acquire High-Performance Camera Specialist Adimec

Teledyne Technologies has announced that it has entered into an agreement to acquire Adimec Holding B.V. and its subsidiaries (Adimec). Adimec, founded in 1992 and headquartered in Eindhoven, Netherlands, develops customized high-performance industrial and scientific cameras for applications where image quality is of paramount importance.

​“Adimec possesses uniquely complementary technology, products and customers in the shared strategic focus areas of healthcare, global defense, and semiconductor and electronics inspection,” said Edwin Roks, Chief Executive Officer of Teledyne. “For decades and from our own X-ray imaging business headquartered in Eindhoven, I have watched Adimec grow to become a leader in niche applications requiring truly accurate images for precise decision making in time-critical processes.”

Joost van Kuijk, Adimec’s Chief Executive Officer, commented, “It is with great pleasure that we are able to announce publicly that Adimec will become part of Teledyne. Adimec’s success has always been built on ensuring imaging excellence in demanding applications through an unwavering focus on individual customer requirements by our expert engineers and designers.”

Adimec co- Chief Executive Officer, Alex de Boer added, “As a leader in advanced imaging technologies for industrial and scientific markets, Teledyne is the perfect company to build further on the strong foundation the founders and management have established over the past three decades. The entire Adimec team is looking forward to contributing to an exciting future with Teledyne while extending technical boundaries to support our customers with cameras – perfectly optimized to their application needs.”

Wednesday, February 21, 2024

Computational Imaging Photon by Photon



Arizona Optical Sciences Colloquium: Andreas Velten, "Computational Imaging Photon by Photon"

Abstract
Our cameras usually measure light as an analog flux that varies as a function of space and time. This approximation ignores the quantum nature of light which is actually made of discrete photons each of which is collected at a sensor pixel at an instant in time. Single photon cameras have pixels that can detect photons and the timing of their arrival resulting in cameras with unprecedented capabilities. Concepts like motion blur, exposure time, and dynamic range that are essential to conventional cameras do not really apply to single photon sensors. In this presentation I will cover computational imaging capabilities enabled by single photon cameras and their applications.

The extreme time resolution of single photon cameras enables time of flight measurements we use for Non-Line-of-Sight (NLOS) Imaging. NLOS systems reconstruct images of scene using indirect light from reflections off a diffuse relay surface. After illuminating the relay surface with short pulses, the returning light is detected with high time resolution single photon cameras. We thereby capture video of the light propagation in the visible scene and reconstruct images of hidden parts of the scene.

Over the past decade NLOS imaging has seen rapid progress and we can now capture and reconstruct hidden scenes in real time and with high image quality. In this presentation I will give an overview over the imaging using single photon avalanche diodes, reconstruction methods, and applications driving NLOS imaging and provide an outlook for future development.

Bio
Andreas Velten is Associate Professor at the Department of Biostatistics and Medical Informatics and the Department of Electrical and Computer Engineering at the University of Wisconsin-Madison and directs the Computational Optics Group. He obtained his PhD with Prof. Jean-Claude Diels in Physics at the University of New Mexico in Albuquerque and was a postdoctoral associate of the Camera Culture Group at the MIT Media Lab. He has included in the MIT TR35 list of the world's top innovators under the age of 35 and is a senior member of NAI, OSA, and SPIE as well as a member of Sigma Xi. He is co-Founder of Onlume, a company that develops surgical imaging systems, and Ubicept, a company developing single photon imaging solutions.