Friday, June 26, 2026

Foveated imaging with optical folding

Jinwen Wei and Liangcai Cao, "Compact Neural Pancake Camera for High-Perceptual-Quality Foveated Imaging," ACS Photonics (2026).

Link: https://doi.org/10.1021/acsphotonics.6c00691 

Pancake catadioptric optics utilize optical folding to effectively reduce the optical-path thickness in virtual-reality display systems. However, limited optical throughput and optical degradation make image reconstruction for pancake cameras severely ill-posed, hindering broader imaging applications. In this article, we propose a neural pancake camera with adaptive-prior deconvolution, achieving compact, high-perceptual-quality imaging. By introducing latent-space projection, adaptive prior deconvolution alleviates the trade-off between pixel fidelity and perceptual quality and addresses the excessive smoothing inherent in conventional pixelwise optimization. The proposed neural pancake camera reduces the ratio of axial length to physical aperture diameter by 3.2 times compared with other flat cameras with high imaging quality. Experiments and ablation studies substantiate that the proposed adaptive prior deconvolution improves perceptual quality by 70%, as measured by CLIP-IQA, while also outperforming the state-of-the-art deep learning models on pixel-level fidelity. As a representative application of the proposed neural Pancake camera, this work further showcases bioinspired foveated imaging, highlighting its potential for bandwidth-efficient imaging in next-generation edge and portable devices. 

 


Figure 1. Pipeline of the proposed neural Pancake camera. (a) Conceptual illustration of the proposed compact Pancake camera scheme. (b) The inherent trade-off between perceptual quality and pixel-level quality of computational imaging. This work proposes adaptive prior deconvolution to promote the perceptual imaging quality of Pancake cameras while improving pixel fidelity. (c) Overview of the training process of the end-to-end adaptive prior deconvolution. The framework operates by optimizing the learnable deconvolution network while leveraging a latent natural-image manifold prior, anchoring the restoration output to the natural image manifold to reconcile the perceptual-pixel trade-off.

 


Figure 3. Quantitative evaluation and visualization of the adaptive-prior deconvolution. (a) Schematic illustration of the inference process based on the adaptive-manifold prior. (b) Quantitative performance profiles of averaged MUSIQ, SSIM, and PP-IQA across inference steps. (c) Visual comparisons demonstrating the effects of the low prior, the adaptively selected proper prior, and the over-prior.

 


 

Figure 4. Demonstration of neural Pancake camera-based foveated imaging. (a) Schematic illustration of foveated imaging in the human visual system. (b) Profiles of high-frequency content proportion and relative acuity versus field of view. (c) Comparison of reconstructed and raw-captured images across different fields of view. 

Thursday, June 25, 2026

IISW 2027 call for papers available, abstracts due Dec 10, 2026

Link: https://imagesensors.org/CFP2027/fcfp2027.pdf

FIRST CALL FOR PAPERS ABSTRACTS DUE Dec 10, 2026
2027 International Image Sensor Workshop
The Westin Resort & Spa, Whistler, BC, Canada
June 13-17, 2027

The 2027 International Image Sensor Workshop (IISW) provides a biennial opportunity to present innovative work in the area of solid-state image sensors and share new results with the image sensor community. The event is intended for image sensor technologists; in order to encourage attendee interaction and a shared experience, attendance is limited, with strong acceptance preference given to workshop presenters. As is its tradition, the 2027 workshop will emphasize an open exchange of information among participants in an informal, secluded setting besides Whistler, BC, Canada.

The scope of the workshop includes all aspects of electronic image sensor design and development. In addition to regular oral and flash presentation papers, the workshop will include invited talks and announcement of International Image Sensors Society (IISS) Award winners.

Image Sensor Design and Performance
CMOS imagers, CCD imagers, SPAD sensors
New and disruptive architectures
Global shutter image sensors
Low noise readout circuitry, ADC designs
Single photon sensitivity sensors
High frame rate image sensors
High dynamic range sensors
Low voltage and low power imagers
High image quality; Low noise; High sensitivity
Improved color reproduction
Non-standard color patterns with special digital processing
Imaging system-on-a-chip, On-chip image processing
Event-based image sensors

Pixels and Image Sensor Device Physics
New devices and pixel structures
Advanced materials
Ultra miniaturized pixels development, testing, and characterization
New device physics and phenomena
Electron multiplication pixels
Techniques for increasing QE, well capacity, reducing
crosstalk, and improving angular response
Front side illuminated, back side illuminated, and
stacked pixels and pixel arrays
Pixel simulation: Optical and electrical simulation, 2D and
3D, CAD for design and simulation, improved models 

Application Specific Imagers
Image sensors and pixels for range sensing: TOF, RGBZ,
Structured light, Stereo imaging, etc.
Image sensors with enhanced spectral sensitivity (NIR, UV, IR)
Sensors for DSC, DSLR, mobile, digital video cameras and mirror-less cameras
Array imagers and sensors for multi-aperture imaging, computational imaging, and machine learning
Sensors for medical applications, microbiology, genome sequencing
High energy photon and particle sensors (X-ray, radiation)
Line arrays, TDI, Very large format imagers
Multi and hyperspectral imagers
Polarization sensitive imagers

Image sensor manufacturing and testing
New manufacturing techniques
Wafer-on-wafer and chip-on-wafer stacking technologies
Backside thinning
New characterization methods
Packaging and testing: reliability, yield, cost
Defects, noises, and leakage currents
Radiation damage and radiation hard imagers

On-chip optics
Advanced optical path, color filters, microlens, light guides
Nanotechnologies for Imaging
Wafer level cameras

Submission of abstracts:
An abstract should consist of a single page of maximum 500-words text with up to two pages of
illustrations (3 pages maximum), and include authors’ name(s) and affiliation, mailing address,
telephone and e-mail address.

The deadline for abstract submission is 11:59pm, Thursday Dec 10th, 2026 (PST).
To submit an abstract, please go to: https://cmt3.research.microsoft.com/IISW2027
Above website should be open by Aug 1st, 2026.

The first time you visit the paper submission site, you'll need to click on "Create Account". Once you create and verify your account with your email address, you will be able to submit abstracts by logging in and clicking “Create New Submission”.

Please visit http://imagesensors.org/CFP2027 for complete instructions and any updates to the
abstract and paper submission procedures.

Abstracts will be considered on the basis of originality and quality. High quality papers on work in progress are also welcome. Abstracts will be reviewed confidentially by the Technical Program
Committee.

Key Dates
Authors will be notified of the acceptance of their abstract by February 12th, 2027.
Final-form 4-page paper submission date is March 20th, 2027.
Presentation material submission date is April 30th, 2027.

Location and format:
The IISW 2027 will be held at the Westin Resort & Spa in Whistler, British Columbia in Canada.

Registration, Workshop fee and Program:
The Workshop Program and registration details will be provided in the Final Announcement of the Workshop. 

Wednesday, June 24, 2026

Canon "twisted photodiode" paper (IISW2025 special issue)

In a paper titled "Design and Optimization of a Twisted Photodiode Pixel Structure for All-Directional Phase-Detection Autofocus CMOS Image Sensors" a team from Canon write:

To achieve an all-directional and high-speed, high-accuracy autofocus (AF) function, we propose a CMOS image sensor with a Twisted Photodiode (PD) structure. The developed 3D-stacked back-side illuminated (BSI) sensor employs the Twisted PD, which enables equivalent angular response characteristics in both the horizontal and vertical directions for the two PDs integrated within a single pixel, thereby realizing AF detection for all pixels and all directions. This paper describes the Twisted PD structure that enables all-directional AF and presents an analysis of charge transfer behavior in this unique 3D configuration. In this paper, “all-directional” refers to robustness with respect to subject direction.

This paper was published in the IISW2025 special issue of Sensors. 
Link: https://www.mdpi.com/1424-8220/26/6/1758

 








 

Monday, June 22, 2026

Miscellaneous 2026 market news: Omnivision, Canon, Oculi, Sony

Omnivision is listed on HKSE https://www.reuters.com/world/asia-pacific/chinas-omnivision-open-slightly-higher-hong-kong-trading-debut-2026-01-12/ 

 
 
 
Emberion has officially become part of Exosens https://www.emberion.com/exosens-acquires-emberion/

VISSA VISible detection for Space Applications open for abstract submissions

ESA, CNES, AIRBUS DEFENCE & SPACE, ISAE-SUPAERO, OHB, SODERN, and THALES ALENIA SPACE are pleased to invite you to:

VISSA: VISible detection for Space Applications, the 9th iteration of the workshop series known as “Space & Scientific CMOS Image Sensors”

Please find attached the CALL FOR ABSTRACTS for the workshop planned for 24 and 25 November at ESA-ESTEC, The Netherlands.

This is a very popular event and has become one of the main European technical exchanges on CMOS image sensors. The aim of this workshop is to focus on latest developments in advanced image sensors for scientific and space applications targeting wavelengths shorter than 1.1 μm.

The deadline for abstract submission is 4 September 2026.

Please send a short abstract on one A4 page maximum in word or pdf format giving the
title, the author name(s) and affiliation(s), and presenting the subject of your talk, to
matthew.soman@esa.int and valerian.lalucaa@cnes.fr 

Abstracts shall preferably address one or more of the following topics:
• Pixel design (high QE, FWC, MTF optimization, low lag, …)
• Electrical design (low noise amplifiers, shutter, CDS, high speed architectures, TDI, HDR, …)
• On-chip ADC or TDC (in pixel, column, …)
• On-chip processing (smart sensors, multiple gains, summation, corrections)
• Low-light detection (electron multiplication, avalanche photodiodes, quanta image sensors, …)
• Photon counting, Time resolving detectors (gated, time-correlated single-photon counting, …)
• Hyperspectral architectures
• Materials (thin film, optical layers, dopant, high-resistivity, amorphous Si, …)
• Processes (backside thinning, hybridization, 3D stacking, anti-reflection coating, …)
• Packaging
• Optical design (micro-lenses, trench isolation, filters, …)
• Large size devices (stitching, butting, …)
• High speed interfaces
• Focal plane architectures
• CMOS image sensors with recent space heritage showing in-flight performance 

Workshop format & official language
Oral presentations shall be requested for the workshop. The official workshop language is English.
 

Slide submission
After abstract acceptance notification, the authors will be requested to prepare their presentation in pdf
or Powerpoint file format, to be presented at the workshop. Authors will also be required to provide a
version to the organizing committee along with an authorization to make it available for Workshop
attendees, and on-line for the COMET members. No proceedings will be compiled and so no detailed
manuscript needs to be submitted.
 

Registration
Registration fee : Attendees: 120 Euro // students: 60 Euro
On-line registration link will be sent at registration opening.
 

Exhibition/Sponsorship:
Booths will be available during the workshop. If you are interested to exhibit, please contact the
organizing committee. 

Friday, June 19, 2026

Sony's new X-ray image sensor IMX711

Product overview page: https://www.sony-semicon.com/en/products/is/scientific/x-ray.html

The IMX711 is an X-ray image sensor that employs a direct conversion and integration type CMOS technology, in which X-rays and electron beams are detected directly.

It uses proprietary technology to achieve both high-speed capture and low noise performance, enabling the detection of weak single-photon signals, which is difficult with conventional integration type sensors.
This technology enables measurement with a wider dynamic range than conventional methods, offering from single-photon detection under low-flux conditions to stable and high-accuracy measurement in high-flux conditions.

The image sensor can capture energy, spatial, and temporal information simultaneously, which contributes to better measurement accuracy, measurement throughput, and flexible post-processing depending on the application and use casein advanced device inspection and scientific measurements such as materials science and life sciences.


 


Thursday, June 18, 2026

400x400 pixel stacked CIS HDR sensor for AR/VR applications

In a June 2026 paper titled "A 400×400 3.24-μm 117-dB Dynamic Range Three-Layer Stacked Digital Pixel Sensor With Triple Quantization and Fixed Pattern Noise Correction" published in IEEE Trans. Electron Devices, a team from Brillnics, Meta, and SesameAI* write:

This article presents a 400×400 digital pixel sensor (DPS) with a 3.24 μm pixel pitch, fabricated using a 45/40/40 nm three-layer stacked process. The sensor achieves single-exposure high dynamic range (SEHDR) through overlapped triple quantization (3Q), fixed pattern noise correction (FPN-C), and black level correction (BLC). An on-chip image signal processor (ISP) is integrated to support defect pixel correction (DPC), SEHDR linearization, and gamma correction. Sparse transmission (ST) is incorporated to reduce transmitted data volume and, consequently, transmission power consumption. A wafer-level chip-scale package (WLCSP) with two redistribution layers (RDLs) is employed, resulting in a compact form factor of 2.47×1.85 mm^2. This work achieves a dynamic range (DR) of 117 dB while consuming 2.45 mW at 30 frames/s (fps), yielding a figure of merit (FoM) of 0.0046 e- rms  pJ, and is developed to meet the growing demands of augmented reality (AR) and virtual reality (VR) applications.

Full paper: https://doi.org/10.1109/TED.2026.3687537 

 











 

* Sesame AI (https://www.sesame.com/) is developing "conversational AI agents", with a smart glasses product slated for 2027.

Saturday, June 06, 2026

Conference List November 2026

IEEE Nuclear Science Symposium, Medical Imaging Conference, and Room-Temperature Semiconductor Detectors Symposium - 7-14 November 2026 - Granada, Spain - Website

SPIE Future Sensing Technologies 2026 - 9-12 November 2026 - Yokohama, Japan - Website - (co-located with SPIE Asia-Pacific Remote Sensing and Photonics Innovation)

Sensing with Quantum Light (SQL26) - 9-13 November 2026 - Cologne, Germany - Website

electronica - 10-13 November 2026- Munich Germany - Website

Compamed - 16-19 November 2026 - Dusseldorf, Germany - Website

Sensors 2026 - 19-21 November 2026 - Osaka, Japan - Website

18th Symposium Sensor Data Fusion: Trends, Solutions and Applications - Bonn, Germany - 23-25 November 2026 - Website

9th VISSA: Visible Detection for Space Applications - 24-25 November 2026 - Noordwijk, the Netherlands - Website

RSNA 2026 - 29 November-3 December 2026 - Chicago, Illinois, USA - Website


If you know about additional local conferences, please add them as comments.

Return to Conference List index

Sunday, May 03, 2026

Low-cost ultra-high-speed imager using spatio-temporal encoding

In a preprint titled "Low-cost passive single-shot ultrafast imaging at 685 Gfps" Eşlik et al write: 

Capturing ultrafast transient phenomena conventionally requires streak cameras or computational imaging based on compressed sensing, which lead to complex and costly systems. In this Letter, we demonstrate, to the best of our knowledge, the first fully passive single-shot ultrafast imaging architecture assembled entirely from off-the-shelf, low-cost components. A commercial microlens array combined with a stack of standard microscope cover glasses maps temporal information into multiple spatial channels, and a consumer-grade CMOS image sensor records all delayed replicas within a single camera exposure. The proposed system has a total hardware cost below US$500 and captures the evolution of a picosecond laser pulse with a temporal sampling interval of 1.46 ps, an effective frame rate of 685 Gfps, and a sequence depth of ten frames. The temporal fidelity of the system is verified by recovering the expected Gaussian pulse profile, and the spatial resolution is characterized through a point-source measurement with a point spread function of 1.86 and 1.62 pixels full width at half maximum along the horizontal and vertical directions, respectively. The proposed architecture presents an alternative approach to single-shot ultrafast imaging with a simple, low-cost, computation-free, and fully passive design.

Schematic of the proposed low-cost passive spatially multiplexed ultrafast imaging system. A microlens array generates replicated image channels, each of which experiences a different optical delay introduced by a stack of standard microscope cover glasses. Temporally delayed replicas are simultaneously recorded within a single camera exposure using a consumer-grade CMOS sensor. 

Single-shot reconstruction of the temporal evolution of a picosecond laser pulse. Each sub-image corresponds to a different optical delay introduced by the proposed spatial multiplexing architecture. The sequence is recovered from a single camera exposure with a temporal spacing of 1.46 ps between the frames.
 

Normalized total intensity extracted from reconstructed frames as a function of relative temporal delay. The measured temporal profile follows a Gaussian distribution (dashed curve), which confirms the accurate preservation of the pulse dynamics.
 

Sunday, April 26, 2026

ICCP 2026 posts call for posters & demos, registrations open


Submission deadline: June 1, 2026, 11:59pm AoE 

ICCP 2026 brings together researchers and practitioners from the multiple fields that computational imaging intersects: computational photography, computational optics, computational sensing, computational displays, computer vision, computer graphics, art, and design. We invite you to present your work to this broad audience during the ICCP poster and demo session. Whereas ICCP papers must describe original research, ICCP posters and demos give an opportunity to showcase previously-published or yet-to-be-published work to a broader community.

The poster track is non-exclusive. All papers accepted at ICCP will have a poster reserved for them. The list of accepted and presented posters and demos will be announced on our conference website, which serves as a record of the presentation.

We are now accepting submissions in the following categories:

Posters:
- Recent research broadly related to computational imaging, previously published in another venue (conference or journal). This is your chance to present your work in person to a cross-section of the computational imaging community.
- Late-breaking technical results and research, including, but not limited to, progress in computational algorithms, optical system design, and innovative applications.

Demos:
Demos of working computational imaging prototypes, computational displays, tools, software platforms, and/or imaging instrumentation utilizing computational imaging techniques, including both research and commercial systems.


ICCP 2026 registration site is openhttps://iccp2026.iccp-conference.org/#registration
Early discounted rates available until June 11.

ICCP 2026 discounted hotel roomshttps://iccp2026.iccp-conference.org/#lodging