Monday, June 22, 2026

Miscellaneous 2026 market news: Omnivision, Canon, Oculi, Sony

Omnivision is listed on HKSE https://www.reuters.com/world/asia-pacific/chinas-omnivision-open-slightly-higher-hong-kong-trading-debut-2026-01-12/ 

 
 
 
Emberion has officially become part of Exosens https://www.emberion.com/exosens-acquires-emberion/

VISSA VISible detection for Space Applications open for abstract submissions

ESA, CNES, AIRBUS DEFENCE & SPACE, ISAE-SUPAERO, OHB, SODERN, and THALES ALENIA SPACE are pleased to invite you to:

VISSA: VISible detection for Space Applications, the 9th iteration of the workshop series known as “Space & Scientific CMOS Image Sensors”

Please find attached the CALL FOR ABSTRACTS for the workshop planned for 24 and 25 November at ESA-ESTEC, The Netherlands.

This is a very popular event and has become one of the main European technical exchanges on CMOS image sensors. The aim of this workshop is to focus on latest developments in advanced image sensors for scientific and space applications targeting wavelengths shorter than 1.1 μm.

The deadline for abstract submission is 4 September 2026.

Please send a short abstract on one A4 page maximum in word or pdf format giving the
title, the author name(s) and affiliation(s), and presenting the subject of your talk, to
matthew.soman@esa.int and valerian.lalucaa@cnes.fr 

Abstracts shall preferably address one or more of the following topics:
• Pixel design (high QE, FWC, MTF optimization, low lag, …)
• Electrical design (low noise amplifiers, shutter, CDS, high speed architectures, TDI, HDR, …)
• On-chip ADC or TDC (in pixel, column, …)
• On-chip processing (smart sensors, multiple gains, summation, corrections)
• Low-light detection (electron multiplication, avalanche photodiodes, quanta image sensors, …)
• Photon counting, Time resolving detectors (gated, time-correlated single-photon counting, …)
• Hyperspectral architectures
• Materials (thin film, optical layers, dopant, high-resistivity, amorphous Si, …)
• Processes (backside thinning, hybridization, 3D stacking, anti-reflection coating, …)
• Packaging
• Optical design (micro-lenses, trench isolation, filters, …)
• Large size devices (stitching, butting, …)
• High speed interfaces
• Focal plane architectures
• CMOS image sensors with recent space heritage showing in-flight performance 

Workshop format & official language
Oral presentations shall be requested for the workshop. The official workshop language is English.
 

Slide submission
After abstract acceptance notification, the authors will be requested to prepare their presentation in pdf
or Powerpoint file format, to be presented at the workshop. Authors will also be required to provide a
version to the organizing committee along with an authorization to make it available for Workshop
attendees, and on-line for the COMET members. No proceedings will be compiled and so no detailed
manuscript needs to be submitted.
 

Registration
Registration fee : Attendees: 120 Euro // students: 60 Euro
On-line registration link will be sent at registration opening.
 

Exhibition/Sponsorship:
Booths will be available during the workshop. If you are interested to exhibit, please contact the
organizing committee. 

Friday, June 19, 2026

Sony's new X-ray image sensor IMX711

Product overview page: https://www.sony-semicon.com/en/products/is/scientific/x-ray.html

The IMX711 is an X-ray image sensor that employs a direct conversion and integration type CMOS technology, in which X-rays and electron beams are detected directly.

It uses proprietary technology to achieve both high-speed capture and low noise performance, enabling the detection of weak single-photon signals, which is difficult with conventional integration type sensors.
This technology enables measurement with a wider dynamic range than conventional methods, offering from single-photon detection under low-flux conditions to stable and high-accuracy measurement in high-flux conditions.

The image sensor can capture energy, spatial, and temporal information simultaneously, which contributes to better measurement accuracy, measurement throughput, and flexible post-processing depending on the application and use casein advanced device inspection and scientific measurements such as materials science and life sciences.


 


Thursday, June 18, 2026

400x400 pixel stacked CIS HDR sensor for AR/VR applications

In a June 2026 paper titled "A 400×400 3.24-μm 117-dB Dynamic Range Three-Layer Stacked Digital Pixel Sensor With Triple Quantization and Fixed Pattern Noise Correction" published in IEEE Trans. Electron Devices, a team from Brillnics, Meta, and SesameAI* write:

This article presents a 400×400 digital pixel sensor (DPS) with a 3.24 μm pixel pitch, fabricated using a 45/40/40 nm three-layer stacked process. The sensor achieves single-exposure high dynamic range (SEHDR) through overlapped triple quantization (3Q), fixed pattern noise correction (FPN-C), and black level correction (BLC). An on-chip image signal processor (ISP) is integrated to support defect pixel correction (DPC), SEHDR linearization, and gamma correction. Sparse transmission (ST) is incorporated to reduce transmitted data volume and, consequently, transmission power consumption. A wafer-level chip-scale package (WLCSP) with two redistribution layers (RDLs) is employed, resulting in a compact form factor of 2.47×1.85 mm^2. This work achieves a dynamic range (DR) of 117 dB while consuming 2.45 mW at 30 frames/s (fps), yielding a figure of merit (FoM) of 0.0046 e- rms  pJ, and is developed to meet the growing demands of augmented reality (AR) and virtual reality (VR) applications.

Full paper: https://doi.org/10.1109/TED.2026.3687537 

 











 

* Sesame AI (https://www.sesame.com/) is developing "conversational AI agents", with a smart glasses product slated for 2027.

Saturday, June 06, 2026

Conference List November 2026

IEEE Nuclear Science Symposium, Medical Imaging Conference, and Room-Temperature Semiconductor Detectors Symposium - 7-14 November 2026 - Granada, Spain - Website

SPIE Future Sensing Technologies 2026 - 9-12 November 2026 - Yokohama, Japan - Website - (co-located with SPIE Asia-Pacific Remote Sensing and Photonics Innovation)

Sensing with Quantum Light (SQL26) - 9-13 November 2026 - Cologne, Germany - Website

electronica - 10-13 November 2026- Munich Germany - Website

Compamed - 16-19 November 2026 - Dusseldorf, Germany - Website

Sensors 2026 - 19-21 November 2026 - Osaka, Japan - Website

18th Symposium Sensor Data Fusion: Trends, Solutions and Applications - Bonn, Germany - 23-25 November 2026 - Website

9th VISSA: Visible Detection for Space Applications - 24-25 November 2026 - Noordwijk, the Netherlands - Website

RSNA 2026 - 29 November-3 December 2026 - Chicago, Illinois, USA - Website


If you know about additional local conferences, please add them as comments.

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Sunday, May 03, 2026

Low-cost ultra-high-speed imager using spatio-temporal encoding

In a preprint titled "Low-cost passive single-shot ultrafast imaging at 685 Gfps" Eşlik et al write: 

Capturing ultrafast transient phenomena conventionally requires streak cameras or computational imaging based on compressed sensing, which lead to complex and costly systems. In this Letter, we demonstrate, to the best of our knowledge, the first fully passive single-shot ultrafast imaging architecture assembled entirely from off-the-shelf, low-cost components. A commercial microlens array combined with a stack of standard microscope cover glasses maps temporal information into multiple spatial channels, and a consumer-grade CMOS image sensor records all delayed replicas within a single camera exposure. The proposed system has a total hardware cost below US$500 and captures the evolution of a picosecond laser pulse with a temporal sampling interval of 1.46 ps, an effective frame rate of 685 Gfps, and a sequence depth of ten frames. The temporal fidelity of the system is verified by recovering the expected Gaussian pulse profile, and the spatial resolution is characterized through a point-source measurement with a point spread function of 1.86 and 1.62 pixels full width at half maximum along the horizontal and vertical directions, respectively. The proposed architecture presents an alternative approach to single-shot ultrafast imaging with a simple, low-cost, computation-free, and fully passive design.

Schematic of the proposed low-cost passive spatially multiplexed ultrafast imaging system. A microlens array generates replicated image channels, each of which experiences a different optical delay introduced by a stack of standard microscope cover glasses. Temporally delayed replicas are simultaneously recorded within a single camera exposure using a consumer-grade CMOS sensor. 

Single-shot reconstruction of the temporal evolution of a picosecond laser pulse. Each sub-image corresponds to a different optical delay introduced by the proposed spatial multiplexing architecture. The sequence is recovered from a single camera exposure with a temporal spacing of 1.46 ps between the frames.
 

Normalized total intensity extracted from reconstructed frames as a function of relative temporal delay. The measured temporal profile follows a Gaussian distribution (dashed curve), which confirms the accurate preservation of the pulse dynamics.
 

Sunday, April 26, 2026

ICCP 2026 posts call for posters & demos, registrations open


Submission deadline: June 1, 2026, 11:59pm AoE 

ICCP 2026 brings together researchers and practitioners from the multiple fields that computational imaging intersects: computational photography, computational optics, computational sensing, computational displays, computer vision, computer graphics, art, and design. We invite you to present your work to this broad audience during the ICCP poster and demo session. Whereas ICCP papers must describe original research, ICCP posters and demos give an opportunity to showcase previously-published or yet-to-be-published work to a broader community.

The poster track is non-exclusive. All papers accepted at ICCP will have a poster reserved for them. The list of accepted and presented posters and demos will be announced on our conference website, which serves as a record of the presentation.

We are now accepting submissions in the following categories:

Posters:
- Recent research broadly related to computational imaging, previously published in another venue (conference or journal). This is your chance to present your work in person to a cross-section of the computational imaging community.
- Late-breaking technical results and research, including, but not limited to, progress in computational algorithms, optical system design, and innovative applications.

Demos:
Demos of working computational imaging prototypes, computational displays, tools, software platforms, and/or imaging instrumentation utilizing computational imaging techniques, including both research and commercial systems.


ICCP 2026 registration site is openhttps://iccp2026.iccp-conference.org/#registration
Early discounted rates available until June 11.

ICCP 2026 discounted hotel roomshttps://iccp2026.iccp-conference.org/#lodging

Friday, April 24, 2026

Gpixel IPO on HKSE

Link: https://www.caproasia.com/2026/04/11/china-image-sensor-company-gpixel-changchun-microelectronics-hong-kong-ipo-to-raise-332-million-at-1-5-billion-valuation-with-expected-ipo-listing-on-17th-april-2026-founded-in-2012-by-xinyang-wang/

China Image Sensor Company Gpixel Changchun Microelectronics Hong Kong IPO to Raise $332 Million at $1.5 Billion Valuation with Expected IPO Listing on 17th April 2026, Founded in 2012 by Xinyang Wang

China image sensor company Gpixel Changchun Microelectronics Hong Kong IPO is raising $332 million at $1.5 billion valuation, with expected IPO listing on 17th April 2026.  Gpixel Changchun Microelectronics was founded in 2012 by Xinyang Wang. Gpixel Changchun Microelectronics – Gpixel is a turn key supplier of advanced off-the-shelf, customized and full custom CMOS image sensors for industrial, professional, medical and scientific applications. Our seasoned, multi-disciplinary team of image sensor experts work from our offices in Changchun and Hangzhou, China, Tokyo, Japan and Antwerp, Belgium to serve the worldwide market for specialty image sensors.

Additional news coverage:
https://www.forbes.com/sites/zinnialee/2026/04/21/chinas-newest-tech-billionaire-made-his-fortune-from-developing-image-sensor-chips-for-robotics/
https://www.marketscreener.com/news/gpixel-changchun-microelectronics-nets-hk-2-5-billion-in-hong-kong-ipo-ahead-of-debut-ce7e50d2da8af624

Thursday, April 23, 2026

Gpixel Leica collaboration

Link: https://www.gpixel.com/en/details_236.html

New Era of Imaging: Leica Camera AG and Gpixel Announce Strategic Partnership for Next-Generation Image Sensor Development

Wetzlar, Germany & Changchun, China, 20 April 2026 Today, Leica Camera AG and Gpixel, a leading global provider of advanced CMOS image sensors, announce a strategic partnership. Both partners agreed to combine their core competencies in the area of innovative imaging technologies to

co-develop a new high performance imaging sensor tailored for next-generation Leica cameras. This collaboration brings together Leica’s long-standing expertise in premium imaging and Gpixel’s cutting-edge sensor design capabilities to push the boundaries of what is technically possible in digital photography.

The partnership focuses on jointly engineering a bespoke image sensor optimized for Leica’s rigorous imaging standards, enabling unprecedented levels of image quality, dynamic range, color fidelity, and low-light performance across future Leica products.

 

Dr. Andreas Kaufmann, Chairman of the Supervisory Board and majority shareholder Leica Camera AG said: „I am really happy and proud that our long-term cooperation with Gpixel will result in a true Leica sensor, incorporating the best ingredients of engineering between Wetzlar, Antwerp and Changchun.”

 

“At Gpixel, we have always admired Leica’s uncompromising approach to craftsmanship and image performance,” said Xinyang Wang, CEO of Gpixel. “Collaborating with Leica gives us the opportunity to combine our sensor-engineering strengths with their legendary imaging heritage. This partnership allows us to co-create a new generation of sensors that will empower photographers with extraordinary image-making capabilities.”

 

The jointly developed sensor will be purpose-engineered to meet the highest performance requirements in color reproduction, noise optimization, dynamic range, and detail rendering. The collaboration also includes close cooperation in validation, image tuning, and production readiness.


About Gpixel

Gpixel is a global leader in advanced CMOS image sensor solutions, serving industrial, professional, and scientific imaging markets. Known for delivering state-of-the-art performance across a broad portfolio of sensor technologies—from high-resolution and high-speed imaging to low-noise and specialized sensor architectures—Gpixel helps partners across the world bring next-generation imaging products to life.

 

About Leica Camera

Leica Camera AG is an international, premium manufacturer of cameras, lenses and sports optics. As part of its growth strategy, the company has expanded its portfolio to include mobile imaging (smartphones) and the manufacture of high-quality spectacle lenses and watches, and is also represented in the home cinema segment with its own projectors. 

Leica Camera AG, having its headquarters in Wetzlar, Germany, and a second production site in Vila Nova de Famalicão, Portugal, operates a global network of its own distribution companies with around 120 Leica Stores worldwide. 

The Leica brand stands for excellence in quality, German craftsmanship and industrial design, combined with innovative technologies. An integral aspect of the brand culture is the promotion of the culture of photography, with around 30 Leica Galleries worldwide, the Leica Akademie and international awards such as the Leica Hall of Fame Award and the Leica Oskar Barnack Award (LOBA). 



Tuesday, April 21, 2026

Conference List - October 2026

VISION - 6-8 October 2026 - Stuttgart, Germany - Website

Photonics Spectra Sensing Technologies Summit 2026 - 7 October 2026 - Online - Website

Optica Laser Congress and Exhibition - 11-15 October 2026 - Vilnius, Lithuania - Website

ASNT Annual Conference - 12-15 October 2026 - Columbus, Ohio, USA - Website

CPAD 2026 (Coordinating Panel for Advanced Detectors) - 20-23 October 2026 - Seattle, Washington, USA - Website

SPIE/COS Photonics Asia - 24-26 October 2026 - Nantong, Jiangsu, China - Website

IEEE Sensors Conference - 25-28 October 2026 - Rotterdam, The Netherlands, -  Website

Image Sensors Asia - 28-29 October 2026 - Seoul, South Korea/Hybrid - Website


If you know about additional local conferences, please add them as comments.

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