The Imaging forum is split into two parts, divided over two days:
- The basic required knowledge to understand the robustness of CMOS integrated circuits. This first part of the forum will include physics, state-of-the-art CMOS processes and related design issues,
- The robustness of advanced CMOS integrated circuits. The second part of the forum includes:
Signal integrity issues: cross talk, signal propagation, interference between ICs, current peaks, supply noise, substrate and ground bounce, on-chip decoupling capacitors and design consequences,
Variability issues: difference between random variations and systematic variations, causes of process parameter spread, proximity effects, random dopant fluctuations, transistor matching and design consequences,
Reliability issues and topics: electro-migration, latch-up, hot-carrier effect, NBTI, soft-errors (by cosmic rays and alpha-particles), electro-static discharge, etc.