Sunday, September 24, 2017

FLIR Boson Teardown

SystemPlus publishes a reverse engineering report on FLIR Boson low-cost LWIR camera module:

"The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320×256 pixel microbolometer and an advanced processor. The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time.

The thermal camera uses 12┬Ám pixels based on a vanadium oxide technology microbolometer, the ISC1406L, which features a 320×256 resolution and wafer-level packaging (WLP) to achieve a very compact design. The die is half the size of the one in the oldest ISC0901 model, but gives the same definition.
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