Friday, September 08, 2017

SEMI European Imaging & Sensors Summit 2017

SEMI European Imaging & Sensors Summit 2017 is to be held on September 20-22 in Grenoble, France. The summit agenda has many interesting presentations:

  • Sensor as a solution
    Chae Lee, Senior VP, LG Electonics
  • In the era of mixed reality and augmented environment sensing, what does innovation mean? What is Leti’s vision?
    Marie Noelle Semeria, CEO, Cea-Leti
  • 3D Time-of-Flight Cameras in Industrial Applications
    Thomas Kuhnke, Senior Electronics Design Engineer, 3D Business, Basler AG
  • Hybrid semiconductor direct conversion CMOS x-ray imaging detectors with application examples
    Tuomas Pantsar, Chief Technology Officer / Charge Integration, Oy Ajat
  • CMOS based microdisplays, imager and sensors enhanced by OLED/OPD integration
    Philipp Wartenberg, IC Design Engineer and Project Manager / Deputy head of department IC and System Design, Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP
  • TSMC Imaging Technology to Enable Innovation in AR/VR Applications
    Tripti Bhanti, Senior Technical Manager, TSMC Europe BV
  • Fusion Bonding Enabler for Backside Illuminated Image Sensors - What’s Next
    Thomas Uhrmann, Director of Business Development, EVG
  • Technological Trends in Thermal Image Sensors
    Christel-loic Tisse, Technical & Innovation Director, ULIS
  • Packaging of Image Sensors and Devices
    Lutz Mattheier, Manager Assembly Technology Development, First Sensor Microelectronic Packaging GmbH
  • Image Fusion: How to Best Utilize Dual Cameras
    Roy Fridman, Director of Product Marketing, Corephotonics
  • High Performance CMOS Integrated Graphene Photodetectors
    Tapani Ryhänen, CEO, Emberion
  • CMOS image sensor for bio-medical and scientific applications
    Renato Turchetta, CEO, IMASENIC
  • New developments in logarithmic pixels and sensors
    Yang Ni, Founder & CTO, NIT
  • Colour X-ray Imaging Solutions for Non-Destructive Testing based on Photon Counting Technology
    Juha Kalliopuska, Chief Executive Officer and Co-founder, ADVACAM
  • High resolution global shutter image sensors for machine vision and 8K video
    Guy Meynants, Engineering Fellow, ams/CMOSIS
  • VTT’s hyperspectral imaging technology - from high-performance applications towards volume scalability
    Anna Rissanen, Research Team Leader, VTT
  • Image Sensors for Future VR
    Yiwan Wong, Partnership Lead, Oculus Research
  • Ambient Sensing – New ways how intelligent devices can cope with the environment
    Roland Helm, Segment Head Sensors, Infineon Technologies AG

1 comment:

  1. The tite of IMASENIC presentation will change to:
    Custom CMOS Image Sensors.


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