Update: Chipworks already has 3 reports in its collection of 1.4um pixel reverse engineering. Other than Omnivision BSI, it has Samsung 8MP S5K3H1G and Aptina MT9P111 5MP SOC reports.
Sunday, February 21, 2010
OmniBSI Package Analysis by Chipworks
Yole's February issue of 3D Packaging newsletter publishes Chipworks' Ray Fontaine article analyzing Xintec package design for 5MP OmniBSI OV5642 sensor. The article is illustrated by the reverse engineering pictures:
Update: Chipworks already has 3 reports in its collection of 1.4um pixel reverse engineering. Other than Omnivision BSI, it has Samsung 8MP S5K3H1G and Aptina MT9P111 5MP SOC reports.
Update: Chipworks already has 3 reports in its collection of 1.4um pixel reverse engineering. Other than Omnivision BSI, it has Samsung 8MP S5K3H1G and Aptina MT9P111 5MP SOC reports.
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So no microlens used in this CSP version ??
ReplyDeleteThe scale of the pictures is too small to see the microlens.
ReplyDeleteshould be, so there is an air gap between the cover glass and the BSI sensor ?
ReplyDeleteYes, it should be.
ReplyDeleteHow long will it take to over come these problem?
ReplyDeleteWhat problem are you talking about? The air gap seems to be there, microlens too. What's the problem?
ReplyDeleteInteresting that they have not yet migrated to TSVs.
ReplyDeleteHow the active wafer bonded to the carrier wafer ?
ReplyDeleteAny one can explain ?
I was told that they were bonded by Van der Waals force only; don't know the details though.
ReplyDelete