Friday, November 26, 2010

Yole and Chipworks Analyse Omnivision BSI Packaging in iPhone 4

November issue of Yole Développement's Packaging Magazine has an article on iPhone BSI sensor packaging. The 5 Mp iPhone camera module is said to be assembled by LG Innotek. The module dimensions are 9.2 mm x 9.2 mm x 6.2 mm thick:

One interesting discovery was that gold studs are used to connect the die bond pads instead of TSV. This type of packaging for a CIS application has typically only been seen in some DSLR camera sensors. While OmniVision/TSMC do have a TSV process for BSI parts, the back bonding scheme has provided what is likely a higher yielding alternative that satisfied Apple’s specification:

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