One interesting discovery was that gold studs are used to connect the die bond pads instead of TSV. This type of packaging for a CIS application has typically only been seen in some DSLR camera sensors. While OmniVision/TSMC do have a TSV process for BSI parts, the back bonding scheme has provided what is likely a higher yielding alternative that satisfied Apple’s specification:
No comments:
Post a Comment
All comments are moderated to avoid spam and personal attacks.