Samsung + KAIST nanostructures improve image sensors performance

Open access paper link: https://www.cell.com/iscience/fulltext/S2589-0042(26)02211-X

Yoon et al., "Angle- and polarization-adaptive aperiodic-anisotropic metasurfaces for broadband reflectance suppression" iScience (2026)

Optical reflectance at the air-silicon interface degrades CMOS image sensor (CIS) performance, causing signal loss and image artifacts. Conventional single-layer anti-reflective coatings (1-ARCs) offer CMOS-compatible simplicity, but their isotropic nature and limited spatial tunability make them poorly suited to handle angle- and polarization-dependent characteristics of incident light, particularly where the chief-ray angle varies across the sensor surface. Here, we present an aperiodic-anisotropic metasurface (AAM) composed of subwavelength TiO2 nanodisks with spatially varying geometric anisotropy, enabling broadband, angle- and polarization-resolved impedance matching tailored to local incidence conditions. Its performance was verified through unit-cell-level optimization and further validated by full-area simulations on a 20 × 20 μm2 Si substrate under Gaussian beam illumination, where the AAM achieved ∼1.40% average reflectance across 400–700 nm for both polarizations, outperforming conventional 1-ARC and double-layer anti-reflective coating (2-ARC). This offers a practical solution for CIS and other systems such as LiDAR (light detection and ranging) receivers under spatially varying illumination. 

 

Sony & Mitsubishi Electric collab

https://www.sony-semicon.com/en/news/2026/2026072201.html

Mitsubishi Electric and Sony Semiconductor Solutions Agree to Establish a Joint Venture to Build AI Vision Sensor Solutions for Manufacturing Applications
To Enhance Recognition, Decision-Making and Control in Manufacturing and Contribute to Labor Savings and Unmanned Operations 

Mitsubishi Electric Corporation (“Mitsubishi Electric”) and Sony Semiconductor Solutions Corporation (“Sony”) have entered into a definitive agreement on a strategic partnership aimed at accelerating the automation and advancement of manufacturing equipment and manual operations in the manufacturing industry. Under the partnership, the two companies will establish a newly formed joint venture (“JV”), Advanced Vision Solutions Co., Ltd., which is scheduled to begin operations in October 2026, subject to the receipt of necessary approvals and clearances from relevant authorities.

Going forward, through the JV, the companies will develop and offer vision-sensor*1  solutions leveraging cutting-edge technologies that enable AI-based analysis of visual data directly on image sensors. The solutions will precisely capture conditions and changes across a broad range of manufacturing sites that have traditionally been difficult to visualize, and connect them to decision-making and control. They will support automation and autonomous operation of a wide range of manufacturing equipment, contributing to labor savings and unmanned operations.

This partnership will enable the two companies to integrate Sony’s industry-leading image sensors and edge AI technologies with Mitsubishi Electric’s extensive expertise in FA control systems cultivated over many years. The solutions will precisely capture conditions at manufacturing sites, product quality, equipment operations, and maintenance-related information that were previously difficult to fully understand and utilize. Furthermore, it will efficiently extract the necessary information from the acquired data and connect it to appropriate decision-making and subsequent control, enabling timely and autonomous improvements tailored to equipment and operational conditions with minimal manual intervention. 
In addition to vision data, the solutions will integrate with a variety of data from manufacturing sites, contributing to the development of multimodal production systems capable of detecting changes, early signs and other conditions that cannot be fully identified from a single type of data alone. Through this initiative, the companies aim to drive the deployment of physical AI in the FA domain and provide solutions that can be used without specialized expertise in optics or AI, across broad industries seeking labor savings, autonomous operations, quality improvement, and more advanced maintenance in production environments.

*1 Vision sensor: A high-precision sensor that captures images of products and parts on manufacturing lines using a camera and detects the condition and positional information of target objects in real time. By working in conjunction with factory automation (FA) equipment, it enables automation at manufacturing sites.

“Mitsubishi Electric has long provided a wide range of FA equipment to customers, primarily in the manufacturing sector,” said Takayuki Tsuzuki, Executive Officer (Associate); Group President, Factory Automation Systems at Mitsubishi Electric Corporation. “Today, the need for labor-saving, unmanned systems and autonomous optimization at production sites is greater than ever. Through this partnership with Sony Semiconductor Solutions, we will develop AI vision sensors as a new core component and build a new FA digital solutions business by integrating vision data with our digital platform, ‘Serendie™*2.’ Furthermore, by realizing advanced autonomous control with physical AI and other applications, we aim to provide new value to customers and address social challenges such as labor shortages.”

“Sony has contributed to solving challenges and creating new value across a wide range of industries by accurately capturing real-world information through edge‑AI sensing technologies centered on image sensors,” said Shinji Sashida, President and CEO of Sony Semiconductor Solutions Corporation. “Image sensors, which serve as the ‘eyes’ that generate vision data, play an important role in enabling AI to understand on-site conditions and connect them to decision-making and control. Through this partnership with Mitsubishi Electric, which has deep expertise and a strong customer base in the FA domain, we will bring solutions that leverage our sensing technologies to the market, create value across an even broader range of industries, and further accelerate the evolution of our sensing technologies.”

Company name: Advanced Vision Solutions Co., Ltd.
Business description: Development of AI-powered vision sensors and vision-sensor solutions for factory automation (FA)
Shareholding ratio: Mitsubishi Electric 60%, Sony Semiconductor Solutions 40% 

 

Elio raises $21m for AI sensing

Elio: https://www.eliolabs.com/technology 

News Link: https://www.businesswire.com/news/home/20260723118244/en/Elio-Raises-%2421M-to-Build-Sensing-for-the-AI-Era

SILICON VALLEY, Calif.--(BUSINESS WIRE)--Elio, a company building sensors designed for artificial intelligence rather than the human eye, today announced a $21 million funding round led by Innovation Endeavors and Xora, with participation from Kevin Weil and Scribble VC. Existing investors UpWest and Resolute Ventures, who led the company's previous round, are continuing their support.

Today's sensors capture one fixed view of the world, decided in advance, shaped by what the human eye can see rather than what a machine needs. Elio is changing that: its sensors let AI decide what to capture, in real time, based on what it is trying to figure out - delivering exactly the information needed, when it's needed, instead of a fixed picture to interpret after the fact.

The technology puts computation inside the optics itself. Before light reaches the sensor, dynamic optical layers of micromirrors process it directly - acting more like a neural network than a lens - pulling out signals a conventional lens would flatten and lose. AI learns how the optics behave and corrects them live, reading objects and materials by their physical signature, not just their pixels.

As a result, a single module can do the job of many, and it keeps gaining new abilities after it's already shipped. Sensing starts to behave like software: the same unit gets more capable over time, instead of becoming outdated.

Elio can be used in any context where sensing is required. In microscopy, Elio lets researchers watch living cells respond to a drug over time without staining or fixing the sample, work that today requires destroying the sample for a single datapoint. In semiconductors, Elio enables engineers to see through a chip's stacked layers to catch buried defects without cutting the wafer apart. In robotics, Elio gives machines multiple senses in one module that self-calibrates and switches as the scene changes. In defense, Elio can detect small, fast-moving threats like drones at long range across conditions such as darkness or haze that challenge even the best conventional sensors. Across every application, Elio is expanding the universe of what sensors are meant to do - building dynamic, real-time, label-free methods that capture the complexity of the real world and allow AI to find the patterns that matter.

Elio is led by Founder and CEO Nadav Grossinger and Chief Technology Officer Nitay Romano, who have worked at the intersection of optics and AI for more than 20 years. The two previously co-built Pebbles Interfaces, acquired by Meta, then spent seven years leading the physical-sensing stack behind Meta's AR and VR headsets. Grossinger's earlier ventures include ColoRight, acquired by L'Oréal. Romano, a leading figure in diffractive optics, previously served as Chief Optical Scientist at Holo/Or, the science underpinning Elio's core technology. 

NovoViz releases variable frame rate SPAD sensor

Link: https://novoviz.com/variable-frame-rate-spad-camera/

The NVx5VFR-HW variable frame rate camera was developed for applications requiring high sensitivity and/or frame rate but with reduced output bandwidth. The camera combines the benefits of a SPAD camera, namely the single-photon resolution and fast operating speeds, with those of an event camera—low output data rates. 

Features: 

• 480 x 320 or 256 x 192 SPAD pixels
• Event-based readout
• Adjustable event threshold
• 20ns global shutter
• On-chip pixel binning
• USB 3.0  

Event camera emulation
[...] because there is a single sensor and a single acquisition, the two modalities are inherently synchronized in time and space, without genlocking, cross-sensor calibration, or timestamp drift. The SPAD sensor thus functions as a flexible substrate that can be reprocessed into multiple imaging modalities entirely in software. 

HDR Imaging
[...] photon-counting approach lets each pixel build its own exposure curve, avoiding the clipping and noise floor issues that limit standard CMOS or CCD imaging. 

Instantaneous adaptation to lighting variation
[...] photon-counting approach lets the sensor adapt instantly to drastic lighting shifts, with no exposure recalibration, no motion blur, and no saturation, capturing both the bright and near-dark scenes with equal clarity in the same brief 2ms window. 

Singular Photonics raises US$2.15mn for next-gen SPADs

Singular Photonics Lands Funding to Launch Next-Generation Image Sensors as Commercial Traction Grows

Fabless semiconductor startup appoints former Arm CTO to Board as demand for SPAD-based image sensors accelerates.

Edinburgh, UK – August 19, 2026 – Singular Photonics, a developer of SPAD-based image sensors, today announced it has closed an oversubscribed $2.15 million funding round, led by ACF Investors, with participation from Wren Capital, Cambridge Angels, Scottish Enterprise, Quantum Exponential and Old College Capital. The new capital will accelerate development of a new generation of sensors, expanding the company's product roadmap in response to demand from its growing customer base.
Singular has already doubled its full-year 2025 sales in 2026 to date, driven by customer engagements spanning multiple sectors, including a recent collaboration with instrumentation leader Renishaw. The investment will be used to scale engineering capacity and speed time-to-market for new image sensors capable of advancing new applications in markets ranging from machine vision, industrial automation and physical AI to scientific discovery and medical imaging.
 
“This has been a phenomenal year for Singular Photonics,” said CEO Shahida Imani. “We've already doubled our 2025 sales, we're approaching break-even, and our customers are telling us exactly what they want from future products. This oversubscribed round means we can respond faster – expanding our sensor portfolio and bringing new features to market on our customers’ timelines, not just our own.”
 
“Singular Photonics is an exciting addition to our portfolio, combining world-leading sensor science with genuine commercial promise,” said Tim Mills, Managing Partner at ACF Investors. “The industry is moving from capturing images to generating actionable insights directly from light itself, and Singular has both the technology and the team to lead that shift. We're delighted to back them into their next phase of growth.”
 
“Scottish Enterprise has supported Singular Photonics ambition to develop SPAD-based image sensors over several years,” said Derek Shaw, Director of Company Funding & Investment at Scottish Enterprise. “The Photonics, Quantum, Sensing and Connectivity and Semi-conductors Sector is a key opportunity area for growth for Scotland. Companies such as Singular Photonics can play a vital role in transforming our economy by scaling-up, creating high value jobs and competing internationally.” 
 
“In a strong signal of confidence in Singular’s trajectory, existing shareholders followed the new investors into the round, meeting or exceeding their pre-emption rights,” said Singular Photonics Chairman Pete Hutton. “Combined with the appetite shown by new investors, the round was met with robust demand – a clear vote of confidence in the team, the technology and the commercial momentum the company has built.”

Dipesh Patel joins Board
Singular also announced that Dipesh Patel, the former CTO of global semiconductor giant Arm, has joined the company’s board of directors. During his 25 years at Arm, Dr. Patel held a number of general and technical management positions culminating in his role as CTO where he was responsible for the Research and Digital IT functions.
 
“Singular Photonics is transforming image sensors from passive imaging devices into intelligent sensing platforms,” said Dr. Patel. “SPADs have long been viewed as highly sensitive photon-counting devices, but Singular is showing the world that a far greater opportunity is now emerging, and I’m looking forward to helping the company capitalise on that opportunity.”
 
Powering the SPAD revolution
Every digital camera, industrial vision system and scientific imaging instrument depends on image sensors to capture light and convert it into useful information. Over the decades, these sensors have improved, but they are now approaching the limits of how much information can be captured. The arrival of sensors based on single-photon avalanche diodes (SPADs) is changing that.
Unlike conventional image sensors, which essentially measure the intensity of light, SPAD sensors can precisely detect and time individual photons (the smallest units of light). This opens the door to an entirely new generation of imaging systems that can capture information that conventional cameras simply cannot see.
 
Singular Photonics is pioneering the development of SPAD-based image sensors that also integrate advanced on-chip computation. This allows information to be analysed at the point where light is first detected, making the company’s sensors capable of extracting meaningful information in real time. As sensors become increasingly capable of understanding the information they capture, they can enable smaller, faster and more efficient systems that meet the growing demands of edge computing and AI-driven applications.

Sony TSMC collab

Link: https://www.sony-semicon.com/en/news/2026/2026081101.html

Sony Semiconductor Solutions and TSMC Agreed to Establish Joint Venture for Next-Generation Image Sensors

Atsugi, Japan and HSINCHU, Taiwan, R.O.C., August 11, 2026 - Sony Semiconductor Solutions Corporation (“Sony”) and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) (TWSE: 2330, NYSE: TSM) today announced the execution of a legally binding definitive agreement for the establishment of Advanced Vision Semiconductor Manufacturing Corporation as a joint venture (“JV”) in Koshi City, Kumamoto Prefecture, Japan. The JV will serve as a core hub for the development and manufacturing activities required for the volume production of image sensors for smartphones utilizing advanced manufacturing process technology. The JV is expected to commence volume production in 2029.

Sony will be the sole controlling shareholder and the JV is planned to operate as a consolidated subsidiary of Sony Group Corporation. The Representative Director of the JV is planned to be appointed by Sony.

Pursuant to the definitive agreement, Sony plans to contribute approximately 465 billion yen to the JV through a combination of cash contributions and the transfer of its assets* through a company split. TSMC plans to make cash contributions of approximately 282 billion yen. These capital contributions are expected to be made in phases based on market demand and other relevant business conditions. In addition to these capital contributions by Sony and TSMC, investments required to realize the production capacity planned by the JV are being considered on the premise that they would receive support from the Japanese government.

Under the strategic partnership, Sony intends to take a leading role in the development of core image sensor technologies, as well as product planning and product design. The JV plans to leverage TSMC’s advanced process technology and manufacturing expertise to drive development and manufacturing activities required for the volume production. Through this collaboration, the companies intend to accelerate the commercialization of image sensor products driven by customer needs while advancing technological innovation and strengthening manufacturing capacity.

The establishment of the JV and completion of the transaction are subject to the receipt of required regulatory approvals and the satisfaction of other customary closing conditions. 

All other aspects of the partnership remain unchanged from the announcement by Sony and TSMC titled “Sony Semiconductor Solutions and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership” issued on May 8, 2026. 

IISS 2027 Awards Nominations Open

Call for 2027 IISS award nominations is now open. 

IISS AWARD NOMINATIONS:

    Walter Kosonocky Award: call for nomination and nomination form (Due Jan 15, 2027)
    IISS Awards: call for nomination and nomination form (Due Nov 30, 2026)

IEEE 4001 Standard announced

See also IEEE blogpost: https://standards.ieee.org/beyond-standards/how-good-is-the-camera-ieee-4001-gives-answers/ 

How good is your camera, actually? This question is addressed by the new IEEE 4001 standard, developed by a large group of people from the hyperspectral imaging community, recognizing that an improvement over current practice in this field is needed. This standard defines a set of performance characteristics that are directly comparable between cameras. It can be seen as an analog to the EMVA 1288 for image sensors, by defining a similarly comprehensive specification for complete cameras. To serve this purpose, some new characteristics have been developed for IEEE 4001. The standard also defines camera-related metadata that quantify the effects imprinted by the camera on an image. The formal scope of the standard is hyperspectral imaging, but it can be readily adapted to other imaging modalities where it also has potential to be useful. The standard can be downloaded from the IEEE XPLORE site (for free with library access, or through a $133 paywall). Here is an excerpt from the IEEE press release:


Comprehensive, yet minimal, camera characteristics

IEEE 4001 incorporates many conventional camera characteristics, but also some newly developed performance metrics, in order to arrive at a minimal (necessary and sufficient) set that includes parameters of a complete signal model, as well as measures of actual resolution and various nonidealities. Many aspects of camera performance are covered:

Spectral: Spectral range, Number of bands, Spectral peak width, Spectral sampling interval, Equivalent Band Count

Spatial: Pixel format, Field of view, Geometrical pixel field of view, Peak width, Equivalent Pixel Count, Effective spatial fill factor, Spatial distortion, Object distance

Radiometric: Effective throughput, Response nonuniformity, Read noise, Normalized read noise, Dark current, NESR at the noise floor, Saturation capacity, Linearity error, Signal to noise ratio, Dynamic range, Dark correction

Temporal: Maximum frame rate, Integration time range, Synchronization between bands, Dead time

Coregistration: Spatial coregistration error, Spectral coregistration error

Stray light: Stray light apparent reflectance

Data output: Output data level, Real time capability, Synchronization capability, Invalid data flagging

Calibration: Statement of radiometric, spectral, and geometrical accuracy

Other characteristics: Bad pixels, Polarization dependence, Detector type/temperature

Metadata enhancing image exploitation

IEEE 4001 also defines camera-related metadata describing the influence of camera properties on a given image. With IEEE 4001-compliant metadata, it is for example possible to estimate the signal-dependent physical noise amplitude in all pixels and all bands, and to estimate the local magnitude of artifacts due to coregistration error. This can enable more accurate extraction of information from imagery.

 

 

ST releases dToF sensor with 54x42 zones and 100fps

STMicroelectronics unveils new compact direct Time-of-Flight 3D LiDAR module bringing high-resolution spatial awareness to compact edge AI systems with industry-leading resolution and performance

VL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2.3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Designed to meet the evolving needs of customers and partners across diverse industries, including robotics, industrial automation, smart buildings, AR/VR, and healthcare.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today [June 23, 2026] announced the launch of the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module that sets a new benchmark in high-resolution sensing. The VL53L9 combines state-of-the-art features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across a wide range of applications across robotics, industrial automation, smart buildings, AR/VR, and healthcare.

“VL53L9 demonstrates how far Time-of-Flight sensing has evolved, combining high-resolution depth data, up to 100 frames per second, and a fully integrated architecture in a single compact module. By simplifying integration and reducing system complexity, we enable customers to accelerate the development of applications such as robotics, smart infrastructure, and healthcare monitoring,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “This launch reflects our strategy to move beyond standalone sensors and deliver integrated sensing systems that support real-world edge AI.”

“3D sensing demand accelerates across robotics, industrial automation, XR, and intelligent consumer devices. Time-of-Flight technology is expanding beyond smartphones into applications requiring compact, affordable, and precise depth perception, from navigation and people monitoring to gesture recognition and safety. Higher resolution multizone dToF modules are now emerging as key enablers for this next wave of 3D sensing adoption,” said Anas Chalak, Market & Technology Analyst at Yole Group.

ST FlightSense™ VL53L9 is designed for multiple industry use cases:

– Robotics: enhanced small object detection, SLAM (simultaneous localization and mapping) and obstacle avoidance for autonomous navigation.

– Industrial automation: accurate volume measurement in tanks and bins, improving operational efficiency and inventory management.

– Smart buildings and homes: reliable human presence detection and people counting while preserving user privacy.

– AR/VR and consumer electronics: advanced gesture recognition, body tracking and finger skeleton for immersive user experiences.

– Healthcare: fall detection and monitoring solutions for eldercare and patient safety.

Enhancing 3D sensing with precision and efficiency

The VL53L9 offers an unprecedented 2,268 resolution zones (54×42) with a wide 54°x42° field of view, enabling detailed 3D depth mapping and precise detection of small objects, contours, and edges. Leveraging ST’s proprietary stacked BSI SPAD sensor technology and innovative metasurface optical elements (MOE), the module delivers fast and accurate ranging from less than 5 cm up to 9 meters with up to 1% accuracy and a frame rate of 100 frames per second.

All-in-one sensing data for edge AI and easy integration

The VL53L9’s dual-scan flood illumination replaces traditional dot scanning, reducing motion artifacts, eliminating dead zones, improving small-object detection, and capturing complementary 2D infrared and 3D depth images. Compared to competition, this greatly simplifies post-processing and enables a broad range of edge AI use cases to run efficiently on small MCUs with low compute requirements. The all-in-one module further integrates on-chip dToF processing, a dedicated power management IC, and is fully calibration-free, simplifying integration and reducing system cost and complexity.

Compact form factor

Measuring just 12.8 mm x 6.1 mm x 4.6 mm, the VL53L9 is a reflowable, single-component module compatible with a wide range of cover glass materials. It supports dual power supply operation (1.2 V and 3.3 V) and outputs data via MIPI or I3C interfaces, ensuring compatibility with diverse CPU architectures. The module is certified as Class 1 laser safe, providing reliable and secure operation for end users.

Availability

ST FlightSense™ VL53L9 in mass production in early July 2026 with samples and volume shipments available to customers globally. For more information, visit the VL53L9 product page: https://www.st.com/en/imaging-and-photonics-solutions/vl53l9cx.html 

Single Photon Workshop 2026 materials available

Abstracts from the recently concluded SPW2026 in Naples, Italy are now available online:

https://spw2026.org/programme

https://spw2026.org/poster-session-1

https://spw2026.org/poster-session-2 

indie / ams OSRAM deal

Link: https://www.businesswire.com/news/home/20260511959181/en/indie-to-Acquire-CMOS-Image-Sensor-Product-Line-from-ams-OSRAM

indie to Acquire CMOS Image Sensor Product Line from ams OSRAM 

ALISO VIEJO, Calif.--(BUSINESS WIRE)--indie Semiconductor (Nasdaq: INDI), an automotive solutions innovator, has announced the signing of a definitive agreement to acquire the fabless CMOS image sensor group from ams OSRAM AG for a total consideration of 40 million euros.

With primary operations in Belgium and Portugal, this product line includes intelligent, high‑performance CMOS image sensors for a broad range of industrial, automation, and physical artificial intelligence (AI) applications. This portfolio of products, IP, and designs aligns with indie’s automotive ADAS sensing solutions and further strengthens the Company’s multimodal sensing capabilities across radar, vision, LiDAR, and ultrasonic.

“By integrating ams’ CMOS imagers with our sensor‑fusion hardware and perception software, we’re able to deliver unparalleled sensing systems for next‑generation autonomous machines, including emerging applications such as humanoid robots, cobots, and AMRs,” said Mark Tyndall, executive vice president of corporate development and investor relations at indie. “This unique carve-out extends our position in sensor‑fusion technology and significantly expands our portfolio of GaN SLED light‑source solutions. Together, these technologies broaden our offerings, opens new customer opportunities, and positions indie to capture a larger share of the rapidly emerging physical AI market.”

Image sensors are a key component of sensor-rich platforms within high-performance visual applications such as humanoids, cobots, and industrial automation. As noted by Research and Markets, the image sensor market is forecasted to grow to over $40 billion by 2030. This market growth is being driven by rising autonomy, safety regulations, and increased adoption of AI-based vision ADAS systems, as well as applications that require multimodal sensing, low-latency, and high-resolution.

The consideration includes a cash payment of 35 million euros paid at closing, and a 5 million euros vendor debt note provided by ams OSRAM. The transaction is subject to customary closing conditions, including regulatory approvals. It is expected to close in the third quarter of 2026 and be immediately accretive.  

Recent earthquake disrupts Sony's image sensor fab

Yahoo news July 28, 2026 

https://www.yahoo.com/news/world/articles/sony-fujifilm-plants-evacuate-7-160448320.html

Sony, Fujifilm plants evacuate as 7.1-magnitude earthquake hits Japan's image sensor hub 

Sony press release July 31, 2026
 
https://www.sony-semicon.com/en/info/2026/2026073101.html

Status of Sony Semiconductor Solutions Group Manufacturing Operations Affected by 2026 Kumamoto Earthquakes (Second Update) 

The current status of the impact on our operations from the earthquake that occurred in the Kumamoto region on July 28, 2026, is as follows:

Sony Semiconductor Manufacturing Corporation's Kumamoto Technology Center (located in Kikuyo-machi, Kumamoto Prefecture), which temporarily was halted after the earthquake, has completed safety inspections of its buildings and facilities, and has been carrying out recovery work. As a result, the site is scheduled to resume operations in stages beginning August 4, 2026. The Kumamoto Technology Center is expected to return to its pre-earthquake operating level by mid-August 2026.

Further updates will be provided promptly should any new information become available.

Digital Camera World July 31, 2026 

https://www.digitalcameraworld.com/cameras/an-earthquake-has-halted-production-at-the-worlds-largest-camera-sensor-hub-sony-confirms-could-camera-shipments-be-delayed

The largest image sensor plant from Sony – the world’s biggest manufacturer of image sensors – has halted production after an earthquake hit Japan’s Kumamoto Prefecture on July 28. As of July 31, production still has not resumed, Sony said during an earnings report. 

Sony and Samsung 200MP sensors compared

 

 

200MP camera sensors are everywhere on modern smartphones, but are all 200MP cameras the same?

In this video, we explain why smartphone manufacturers keep adopting 200MP sensors, then run blind camera tests featuring Samsung HP3, HP5, HP9 series, Sony LYTIA 901 and SmartSens SCC80XS. We compare official specifications with real-world daylight and low-light lab samples to reveal how sensor hardware, ISP tuning and optical modules affect image quality.

A larger sensor does not always produce better photos. Final imaging performance depends on the entire camera system instead of sensor specs alone. Let’s check the actual gaps between these mainstream 200MP sensors.

Video on CMOS image sensor basics

iDS published a YouTube video on CMOS image sensor basics:

 

This video provides a comprehensive introduction to modern CMOS sensor technology and explains how hardware innovations have transformed image quality, efficiency, and performance. You’ll learn why pixel sizes continue to shrink, how this impacts imaging results, and which techniques manufacturers use to compensate for these limitations.

The presentation covers key advancements such as microlenses, backside illumination, deep trench isolation, wafer stacking, and smart features like event‑based imaging and sensor‑level AI (Artifcial Intelligence). You’ll also gain insights into image pipelines, FPGA (Field  Programmable Gate Array) versus ISP (Internet Service Provider) (Image Signal Processor) processing, and why system‑level design decisions matter for real‑world machine vision applications. This is essential knowledge for anyone evaluating sensor performance or designing imaging systems that require reliability, speed, and high‑quality results.

Topics covered

    Trends driving pixel size reduction and sensor scaling
    Hardware innovations such as BSI, micro lenses, and deep trench isolation
    Improvements in quantum efficiency and dynamic range
    Image pipelines with FPGA, ISP, and host‑based processing
    Smart sensor features including event‑based imaging and AI at the edge
    Cost, yield, and design considerations for modern CMOS sensors

eyeo raises €40M series A

[News from May 2026]

https://eyeo-imaging.com/knowledge/news/eyeo-raises-e40-million-to-fix-the-flaw-that-has-kept-every-camera-70-blind/ 

eyeo raises €40 million to fix the flaw that has kept every camera 70% blind

 Eindhoven (Netherlands), May 11, 2026 – eyeo today announced it has raised €40 million in Series A funding, bringing eyeo’s total funding to €55 million. The round is led by Innovation Industries, with participation from existing investors imec.xpand, Invest-NL Deep Tech Fund, QBIC fund, High-Tech Gründerfonds (HTGF) and Brabant Development Agency (BOM).

eyeo has developed the world’s most advanced nanophotonic color-splitting technology, redefining imaging for consumer, industrial, XR, smart city and mobile applications with color-splitting photonics technology that triples light sensitivity and breaks sensor resolution limits, delivering unprecedented picture quality, color accuracy and resolution.

The fresh funding will accelerate eyeo’s sensor design capabilities, deepen its OEM partner ecosystem, and drive commercial deployment across a $30 billion global imaging market.

A new era for imaging

All seven billion image sensors sold each year, across smartphones, autonomous vehicles, XR devices, industrial machines, smart cities and more, share a fundamental flaw: color filters work by rejection, blocking red, green and blue light in turn and discarding 70% of the light in the process.

eyeo’s Nanophotonic Color Splitting (NCOS®) technology platform works differently. Instead of filtering light, it splits it: separating light into its colors and guiding every photon directly to the pixel where it belongs. Backed by 26 patents, the NCOS® platform triples light sensitivity and breaks resolution limits. This breakthrough approach unlocks picture quality, color accuracy, resolution, and cost efficiency, which was never-before possible.

Compatible with existing CMOS sensor platforms, eyeo’s technology unlocks sub-micron pixels with 3x the light for ultra-compact, high-performance imaging, removing the trade-off between image quality and sensor size that has constrained product design for decades.

From breakthrough science to production-ready sensors

This Series A round marks a decisive step forward in eyeo’s commercialization journey. Building on the foundation established and proven at imec over the last seven years, multiple tier one customer engagements, and successful process integration at a commercial foundry, eyeo is now investing in the full in-house engineering capability required to deliver sensors to customers at volume scale. The funding will be deployed across three strategic priorities:

•     Building a world-class IC and system architecture design team at the Antwerp sensor design center opened earlier this year
•     Developing and releasing next-generation color-splitting image sensors in 3D-stacked CMOS technology
•     Growing sensor sales and commercial partnerships with OEM customers across smart city, industrial, XR and mobile markets worldwide

 

Videos: Galaxycore, Emberion

 

 
Transforming Infrared Imaging with Emberion’s Cutting-Edge Sensors 

 

 

 Galaxycore: What Is LOFIC? The HDR Technology Behind Advanced Image Sensors  

 

Prophesee raises €20 Million

Link: https://www.prophesee.ai/2026/06/15/prophesee-launches-mantara-event-based-drone-detection/

Prophesee raises €20 million and launches Mantara, the first fully integrated drone detection system built on event-based vision and AI 

PARIS, June 15, 2026 – As Eurosatory and Vivatech open their doors this week in Paris, Prophesee – inventor and world leader in event-based perception – announces the launch of Mantara®: the first integrated system built natively event-based for drone detection and tracking. Mantara runs on Hearth®, a new software platform with built-in AI processing.

Field-validated in June 2026, Mantara is powered by Hearth, the platform succeeding OpenEB and the Metavision SDK. These announcements coincide with a €20 million capital raise led by French fund Critical Path Ventures, with participation from existing shareholders. Prophesee is now held by a substantial majority of French shareholders.

Mantara is a camera whose performance rests on integrated sensors that do not capture images but motion and events. Each pixel responds independently, in microseconds, the instant movement occurs. Fast, erratic targets that blur or vanish between frames on a conventional camera remain perfectly visible and fully characterizable by Mantara: in low light, in backlit conditions, against cluttered backgrounds. Low latency is the heart of its edge: in the time a conventional system takes to capture, transfer, and process a single frame, Mantara has already detected a drone, characterized it, and triggered a response or initiated tracking.

This capability is rooted in a bio-mimetic design inspired by the human visual system. The eye does not record the world in full. Instead, it captures sparse, essential signals, and the brain reconstructs and interprets what matters. If Mantara is the eye, Hearth is the brain.

Hearth is built with cybersecurity requirements, GDPR compliance, and AI governance standards baked in. It enables sensor fusion and will ensure backward compatibility across successive generations of Prophesee sensors. Applications built on Metavision and OpenEB will migrate to Hearth seamlessly.

Recent conflicts have put drones at the center of modern warfare, and the threat is moving fast beyond the battlefield: airports, power plants, critical infrastructure, public gatherings. Drones fly low, change direction sharply, and increasingly carry a near-zero signature: minimal electromagnetic emissions, little acoustic output, little thermal trace. They arrive faster, and in greater numbers, with coordinated swarms capable of overwhelming defenses built to track a single target.

Mantara emits nothing. It cannot be detected or jammed. And it learns: Hearth delivers regular updates that allow every deployed unit to adapt to shifts in threat behavior. Ukraine has made this clear: tactics evolve far faster than traditional development cycles can follow.
 

Civil and Military Missions

Mantara serves both civil and defense use cases. Airports, stadiums, energy and industrial sites, prisons, and ports can integrate it into existing security infrastructure for continuous, automated airspace monitoring. Governments and defense organizations have access to the same system for force protection and counter-UAS operations.

For civil operators, Mantara also offers a compelling privacy advantage: because the sensors detect motion events rather than recording images, Mantara can track moving objects without ever producing footage that could identify individuals. This is a decisive asset for deployment over public spaces and for GDPR compliance.

Hearth: the Reference Platform for the Event-based Ecosystem

Mantara is part of a broader strategic shift encompassing Prophesee’s entire product line.

Hearth will give the event-based ecosystem a trusted reference environment for building scalable, production-grade modules and applications. It will manage sensor updates, backward compatibility, and unlock capabilities that were previously out of reach for developers and integrators working with Prophesee’s patented technology.

As part of this transition, Prophesee announces the end of life of OpenEB, its open-source framework, and of the standalone Metavision SDK. Hearth is the path forward for the developer community. Prophesee will support the migration.

Prophesee’s partners and customers have built a wide range of applications – from eye trackers and ADAS (Advanced Driver Assistance Systems) to ultra-fast cameras for smartphones, ping-pong playing robots, industrial inspection systems, and drone and satellite tracking and targeting solutions. Event-based vision is reaching an inflection point. The market is maturing rapidly and demanding solutions that are robust, secure, and production-ready. With around a hundred patents and multiple sensors to its name, Prophesee has industrialized event-based technology and now intends to structure the broader application ecosystem by making Hearth widely available.

Built with a Network of European Industrial Partners

Mantara benefits from Prophesee’s partnership with IDS Imaging Development Systems GmbH, a leading industrial camera manufacturer. Building on the commercial success of the IDS uEye EVS camera line – based on Prophesee sensors – the two companies expanded their partnership in March 2026 with an agreement signed at Embedded World in Nuremberg to co-develop next-generation industrial vision systems.

Prophesee and Exosens have entered an MoU, paving the way for a long-term partnership to extend bio-mimetic technology beyond the visible spectrum, combining Prophesee’s event-based vision with Exosens’ detection and imaging technologies.

A €20 Million Raise to Anchor Prophesee in France

Prophesee announces a €20 million capital raise led by Critical Path Ventures, a new investor. The team has been reinforced with talent from Google, Microsoft, BCG, Thales, and companies working in drone, robotics, and quantum technologies, as well as from the armed forces. The funds will support the commercial scale-up of Mantara, the development of embedded intelligence within sensors, and the launch of Hearth. 

UV SPAD review article

"Ultraviolet Photon Detection in CMOS Single-Photon Avalanche Diodes: A Review" by Wang et al. in IEEE Sensors Journal (vol 26 no 12 June 2026)

DOI: 10.1109/JSEN.2026.3690120 

Abstract
Ultraviolet (UV) imaging is enabling a growing range of applications in industrial inspection, biomedicine, and aerospace. Single-photon avalanche diodes (SPADs), known for their exceptional sensitivity and fast timing resolution, have achieved remarkable success in visible and near-infrared (NIR) applications, e.g., in light detection and ranging (LiDAR). However, there remains a significant gap
in the development and deployment of UV SPAD detectors. This review presents the latest progress, challenges, and application potential of SPAD technologies in deep-UV (DUV) and near-UV (NUV) ranges. It reviews the challenges in UV detection and the currently reported NUV SPADs, including wide bandgap semiconductors (WBSs), avalanche photodiodes (APDs), silicon-based SPADs with front-side illumination (FSI) and back-side illumination (BSI), and silicon photomultipliers (SiPMs). By linking UV
imaging with single-photon detection, this review aims to support future silicon-based complementary metal-oxide-semiconductor (CMOS) high-speed, large-format UV SPAD arrays, and their integration into next-generation imaging systems. 

 

 

 

HESAI color lidar

Press release (April 2026): https://www.hesaitech.com/hesai-unveils-picasso-6d-full-color-spad-soc-next-gen-etx-and-innovations-in-spatial-intelligence-and-physical-ai/

Hesai Unveils Picasso 6D Full-Color SPAD-SoC, Next-Gen ETX, and Innovations in Spatial Intelligence and Physical AI

Hesai Technology (Nasdaq: HSAI; HKEX: 2525), a global leader in intelligent technology and 3D perception, hosted its 2026 Technology Open Day on April 17, showcasing its latest generation of lidar technologies spanning full-color perception, ultra-high-resolution imaging, and spatial intelligence applications.

A key highlight was Picasso, the world’s first 6D full-color ultra-sensitive lidar SPAD-SoC, enabling native fusion of spatial and color perception at the ASIC level. Built on this platform, Hesai’s ETX lidar series has been upgraded to support up to 4320 channels and is expected to enter mass production in the second half of 2026. The company also previewed Kosmo, a new spatial intelligence AI hardware product, and outlined a new direction in robotic actuation modules for physical AI systems. 

At the core of today’s announcement is Picasso, Hesai’s fifth-generation 6D full-color ultra-sensitive lidar ASIC platform, designed to enable vehicles to see both geometry and color natively on a single chip.

Unlike conventional lidar systems that capture only geometric information such as XYZ, Picasso integrates RGB sensing and time-of-flight (ToF) ranging at the chip-level, enabling the direct generation of colorized point clouds without the need for complex sensor fusion. This 6D full-color capability delivers precise spatial and temporal alignment, resulting in richer environmental understanding and significantly enhancing the perception capabilities of next-generation autonomous systems. 

With photon detection efficiency (PDE) exceeding 40%, Picasso delivers industry-leading sensitivity, enabling stronger long-range performance, better detection of small objects, and improved performance in low-light environments within the same power envelope.

Rather than simply combining camera imagery with lidar point clouds, Picasso enables true ASIC-level fusion, with each point inherently carrying color information. This allows autonomous systems to move from spatial perception to real-time understanding of the driving environment, improving performance in different scenarios such as traffic signals, lane markings, and construction zones. 

The introduction of Picasso marks a major step in lidar development, moving beyond incremental improvements in resolution toward a new generation of full-color perception. This breakthrough is supported by Hesai’s long-term vertical integration strategy and in-house development across core lidar technologies. Following the launch of Fermi C500, a RISC-V-based high-performance lidar controller SoC that integrates MCU, FPGA functions, and ADC into a single chip, the company has established full-stack in-house ASIC development capabilities. This technology foundation has already translated into large-scale commercialization, with Hesai’s upgraded ATX lidar achieving full-scale mass production and securing over 6 million units in orders from leading OEMs.

 

ETX is expected to enter mass production in the second half of 2026, with planned deployment across multiple flagship vehicle models, supporting the large-scale adoption of L3 autonomous driving systems. 

Sony TSMC partnership

Link: https://www.sony-semicon.com/en/news/2026/2026050801.html

Sony Semiconductor Solutions and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership 

Atsugi, Japan — Sony Semiconductor Solutions Corporation (“Sony”) and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) (TWSE: 2330, NYSE: TSM) today announced the signing of a non-binding memorandum of understanding (“MOU”) to form a strategic partnership for the development and manufacturing of next-generation image sensors.

Under the proposed partnership, Sony and TSMC intend to establish a joint venture (“JV”), with Sony being the majority and controlling shareholder,to set up development and production lines in Sony’s newly constructed fab in Koshi City, Kumamoto Prefecture. Through the JV, both companies expect to leverage Sony's expertise in sensor design alongside TSMC’s strengths in process technology and manufacturing excellence as part of a broader collaboration aimed at enhancing image sensor performance.

With the MOU signed, Sony and TSMC are discussing potential investments by the JV. These investments, along with new capital investment by Sony in its existing plant in Nagasaki, are being considered on the premise that they would be implemented in phases based on market demand, and that they would receive support from the Japanese government.

This partnership also seeks to explore and address emerging opportunities in physical AI applications, such as automotive and robotics, paving the way for future innovations and expanded technological advancements. The establishment of the JV remains subject to the execution of a definitive legally binding agreement regarding the partnership and the satisfaction of customary closing conditions. 

“Building on the trust cultivated through our long-standing collaboration with TSMC, I am delighted that we have reached an agreement to advance our partnership to a new stage,” said Shinji Sashida, President and CEO of Sony Semiconductor Solutions Corporation.“This JV is a significant initiative that brings together the strengths of both companies and aims to drive further advancement in technology and business within the next-generation image sensor field. Building on this JV, Sony intends to further strengthen its business operations with a focus on creating high added value. Rooted in the Sony Spirit that has guided us since our founding, we intend to continue to take on the challenge of creating new markets through unprecedented ideas and distinctive technologies.”

“Sony has been our long-time partner in the CMOS image sensor business. We are excited to elevate our collaboration to the next level, which represents a key step forward in driving future sensing technology in the AI era,” said TSMC Senior Vice President and Deputy Co-COO, Dr. Kevin Zhang. “This partnership underscores our shared commitment and mutual vision of leveraging cutting-edge technologies and innovative solutions to deliver leading sensing technology and products. We look forward to working closely together to achieve impactful results and create lasting value for all stakeholders.” 

Soliciting volunteer blog maintainers

Image Sensors Blog is soliciting 1-2 volunteers to help me maintain our weekly posting schedule. We have a large readership spanning industry and academia. This is a great opportunity esp. for an early-career academic (graduate student/postdoc) to provide valuable service to the image sensors community. Please email me (see contact listed in the "Blog Authors" sidebar) with a short introduction and how you see yourself contributing to the blog.

Many thanks to Dave Gilblom who is now retiring from his role as one of the blog maintainers. Thanks, Dave, for the countless hours of hard work poring over image sensor documentation, and for spearheading the Job Postings and Conference List features on the blog! 

Harvest Imaging Forum 2026 Nov 5-6, Registrations Open

Advanced Packaging and Multi-Dimensional Systems Integration for Image Sensors

November 5 & 6, 2026
Antwerp, Belgium

Abstract
Packaging technology for image sensors is an underappreciated issue in the systems integration process, greatly affecting performance, scalability, physical area, and cost. The multi-dimensional package as well as the underlying technology can greatly affect the overall electrical, optical, mechanical, and thermal characteristics of the integrated system. These systems have become multi-dimensional in nature, composed of several interacting layers and multiple sensors with the imagers vertically integrated within the overall system. Now that image sensors are driven more than ever to extreme performance capabilities, novel packaging options and technologies have become increasingly important. An important trend to support large scale sensors integrated into systems are the widely applied stacking and chiplet technologies in which several layers of active silicon are placed above each other. In this way, highly compact, high performance imaging systems are becoming possible. Packaging of systems including image sensors has become much more than placing a single silicon die into a package and attaching some wires.

The landscape of image sensor applications is widening at an accelerating rate, requiring new and different packaging solutions. This forum will review this key issue as well as include a series of highly related topics. This year’s Harvest Imaging Forum is focusing on the existing field of multi-dimensional packaging technology for image sensors. Related topics such as on-chip interconnect, power delivery, synchronization, network communication, thermal behavior, and heterogeneous integration will also be discussed. The focus will be on both current and near term capabilities. These next generation technologies are now becoming available, allowing the development and integration of large scale systems composed of multiple layers and chiplets to produce large scale systems operating at increasingly higher levels of performance. 

https://harvestimaging.com/forum_registration_2026.php 

ST low-power global shutter CIS

[ST Press Release from April 2026.]

STMicroelectronics brings always-on vision to next-generation personal electronics with new ultralow-power image sensors

VD55G4 and VD65G4 extend the ST BrightSense portfolio with compact, ultralow-power, microcontroller-compatible sensors for wearables, AR/VR, and smart devices

These new global-shutter image sensors can consume up to 10x less, in operating mode at around 800×700 resolution and 10 frames per second

Geneva, Switzerland — April 28, 2026 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, introduces a new generation of ultralow-power global-shutter image sensors that deliver high-quality, always-on vision to compact devices operating on batteries or harvested energy. The VD55G4 (monochrome) and VD65G4 (RGB color) sensors, part of the ST BrightSense portfolio, are now available to early adopters, enabling customers to start designing their next generation of smart, ultralow-power vision devices today.
Designed for the next wave of personal electronics and smart devices, the new sensors serve applications including wearables, AR/VR and XR headsets, smart home appliances and medical devices. They are engineered to deliver rich visual context and AI-ready data under tight constraints on power, size, and cost. The sensors combine an ultralow-power detect-and-wake architecture with a very small global-shutter optical format and interfaces optimized for low-power microcontrollers and cost-effective systems on chips (SoCs).

“Always‑on vision is becoming essential for the next generation of personal electronics, from smart glasses and AR/VR headsets to intelligent home appliances and medical devices. With VD55G4 and VD65G4, we are bringing this capability to smaller, lighter products that must run for a long time on a tiny battery. These new sensors help our customers create more intuitive and responsive experiences, extend battery life, and bring embedded vision and edge AI into everyday devices,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics.

From wearables and AR/VR to smart appliances
VD55G4 and VD65G4 bring always‑on vision to products that must stay small, light, and extremely power‑efficient. Building on the ST BrightSense family, they add a color option, faster response for interactive use cases, and simple connectivity to low‑power microcontrollers, making it easier to add vision to space‑ and cost‑constrained designs.

In wearables, the sensors enable all‑day, always‑aware features such as glance detection, presence sensing, and contextual alerts, while fitting into very compact designs and working directly with microcontroller‑based platforms.

For AR/VR and XR headsets, they combine low power and high‑quality capture to support accurate tracking and spatial awareness, helping extend battery life without compromising comfort.

In smart home appliances, IoT devices, and medical products, the sensors allow more intelligence to run locally on the device itself, reducing cloud dependence and standby power. Their tiny size and energy efficiency also make them well suited to solar‑ or energy‑harvesting‑powered vision nodes.

Ultralow‑power design that consumes up to 10x less
Thanks to an optimized sensor architecture and dedicated always‑on mode, VD55G4 and VD65G4 can consume up to 10 times less power than conventional global‑shutter sensors. They can watch for changes in a scene and wake up the main processor only when needed, shifting from continuous streaming to event‑driven operation. This enables all‑day, always‑on experiences, longer battery life, and practical vision systems powered by small batteries or energy harvesting.

Their very small footprint and integrated image processing simplify design and reduce system cost, while supporting responsive, AI‑ready vision features in a wide range of edge devices. 

Ex-Samsung CTO founds image sensor startup

Link: https://it.chosun.com/news/articleView.html?idxno=2023092160385 

"Lee Je-seok, Vice President and Chief Technology Officer (CTO) of the Sensor Business Team, also resigned recently after 32 years at the company. Lee is considered a "living witness" of Samsung’s image sensor brand, ISOCELL, and is credited with leading the development of the world's first 100-megapixel and 200-megapixel sensors, as well as securing a spot in Apple’s supply chain.

Following his resignation, Lee is reportedly preparing to launch an image sensor startup. On social media, he posted an image signaling a "stealth mode" startup with global experts, stating he would "redefine the future of imaging in January 2027." Industry observers are closely watching as a key designer of Samsung's proprietary technology could emerge as a potential competitor."

Conference List - December 2026

18th International Conference on Sensing Technology (ICST2026) - 7-9 December 2026 - Sydney, Australia - Website

International Technical Exhibition on Image Technology and Equipment (ITE) - 2-4 December 2026 - Yokohama, Japan - Website

IEEE International Electron Devices Meeting - 12-16 December 2026 - San Francisco, CA, USA - Website

If you know about additional local conferences, please add them as comments.

Return to Conference List index

Canon MS-510 low light camera

Press release: https://www.usa.canon.com/newsroom/2026/20260415-camera

Canon U.S.A. Sets New Standard in Low-Light Imaging with the Launch of the MS-510 Multi-Purpose Camera at NAB 2026

Featuring a new Canon 1-inch SPAD sensor, the MS-510 delivers impressive low-light and long-range performance for ultra-low-light environments 

MELVILLE, N.Y., April 15, 2026 – Canon U.S.A., Inc., a leader in digital imaging solutions, today announced the release of the MS-510, an innovative multi-purpose camera engineered to meet the rigorous demands of ultra-low-light full-color video shooting. Building on the success of the MS-500, the new MS-510 is designed to deliver high-fidelity captures of everything from nocturnal wildlife and natural nightscapes to high-security areas such as seaports, public infrastructure facilities, and national borders where "seeing the unseen" is a mission-critical requirement.

In response to increasing demands for excellent performance in near-total darkness, the MS-510 features a new Canon 1-inch Single-Photon Avalanche Diode (SPAD) sensor with the world’s highest number of pixels at approximately 3.2 million with improved Near-Infrared (NIR) sensitivity.

By leveraging this technology, the camera achieves a minimum subject illumination of 0.0006 lux, a significant improvement over the 0.001 lux of its predecessor. This allows for bright, full-color imaging in ultra-low-light environments where traditional cameras can fail. Furthermore, the MS-510 boasts improved NIR capabilities, providing a tactical advantage for night-mode operations and long-distance detection.

The MS-510 is not just a camera; it is a sophisticated tool for critical infrastructure monitoring and law enforcement. Key features include:

•  Broadcast-Grade Optics: Equipped with the broadcast industry standard B4 mount, the MS-510 has a built in magnifying optical system offering compatibility with Canon’s extensive lineup of 2/3-inch ultra-telephoto broadcast zoom lenses, enabling crystal-clear identification over vast distances.
•  Advanced Image Processing: Integrated Haze Compensation automatically reduces the interference of mist and haze while adjusting contrast, and Smart Shade Control corrects for highlights and shadows to maintain image integrity in challenging lighting conditions.
•  Customizable Imaging Profiles: Users can create up to 20 customized image quality settings or utilize Custom Picture Presets to prioritize wide dynamic range or maximum noise reduction depending on the environment.

Designed to fit into existing security ecosystems, the MS-510 shares common protocols with the MS-500, including NU, Pelco-D®, ONVIF®, and WebView. It offers versatile output options, including 3G/HD-SDI for high-quality video feeds and a LAN terminal for IP-based camera control and distribution.

Miscellaneous videos: Samsung vs. Sony; Eric Fossum interview; Eyeo webinar; Gpixel

Why Samsung Can't Beat Sony's Image Sensors:

Interview with Eric Fossum:

Eyeo webinar:

 China’s Newest Tech Billionaire Made His Fortune From Developing Image Sensor Chips For Robotics: 

 

Foveated imaging with optical folding

Jinwen Wei and Liangcai Cao, "Compact Neural Pancake Camera for High-Perceptual-Quality Foveated Imaging," ACS Photonics (2026).

Link: https://doi.org/10.1021/acsphotonics.6c00691 

Pancake catadioptric optics utilize optical folding to effectively reduce the optical-path thickness in virtual-reality display systems. However, limited optical throughput and optical degradation make image reconstruction for pancake cameras severely ill-posed, hindering broader imaging applications. In this article, we propose a neural pancake camera with adaptive-prior deconvolution, achieving compact, high-perceptual-quality imaging. By introducing latent-space projection, adaptive prior deconvolution alleviates the trade-off between pixel fidelity and perceptual quality and addresses the excessive smoothing inherent in conventional pixelwise optimization. The proposed neural pancake camera reduces the ratio of axial length to physical aperture diameter by 3.2 times compared with other flat cameras with high imaging quality. Experiments and ablation studies substantiate that the proposed adaptive prior deconvolution improves perceptual quality by 70%, as measured by CLIP-IQA, while also outperforming the state-of-the-art deep learning models on pixel-level fidelity. As a representative application of the proposed neural Pancake camera, this work further showcases bioinspired foveated imaging, highlighting its potential for bandwidth-efficient imaging in next-generation edge and portable devices. 

 

Figure 1. Pipeline of the proposed neural Pancake camera. (a) Conceptual illustration of the proposed compact Pancake camera scheme. (b) The inherent trade-off between perceptual quality and pixel-level quality of computational imaging. This work proposes adaptive prior deconvolution to promote the perceptual imaging quality of Pancake cameras while improving pixel fidelity. (c) Overview of the training process of the end-to-end adaptive prior deconvolution. The framework operates by optimizing the learnable deconvolution network while leveraging a latent natural-image manifold prior, anchoring the restoration output to the natural image manifold to reconcile the perceptual-pixel trade-off.

 

Figure 3. Quantitative evaluation and visualization of the adaptive-prior deconvolution. (a) Schematic illustration of the inference process based on the adaptive-manifold prior. (b) Quantitative performance profiles of averaged MUSIQ, SSIM, and PP-IQA across inference steps. (c) Visual comparisons demonstrating the effects of the low prior, the adaptively selected proper prior, and the over-prior.

 

 

Figure 4. Demonstration of neural Pancake camera-based foveated imaging. (a) Schematic illustration of foveated imaging in the human visual system. (b) Profiles of high-frequency content proportion and relative acuity versus field of view. (c) Comparison of reconstructed and raw-captured images across different fields of view. 

IISW 2027 call for papers available, abstracts due Dec 10, 2026

Link: https://imagesensors.org/CFP2027/fcfp2027.pdf

FIRST CALL FOR PAPERS ABSTRACTS DUE Dec 10, 2026
2027 International Image Sensor Workshop
The Westin Resort & Spa, Whistler, BC, Canada
June 13-17, 2027

The 2027 International Image Sensor Workshop (IISW) provides a biennial opportunity to present innovative work in the area of solid-state image sensors and share new results with the image sensor community. The event is intended for image sensor technologists; in order to encourage attendee interaction and a shared experience, attendance is limited, with strong acceptance preference given to workshop presenters. As is its tradition, the 2027 workshop will emphasize an open exchange of information among participants in an informal, secluded setting besides Whistler, BC, Canada.

The scope of the workshop includes all aspects of electronic image sensor design and development. In addition to regular oral and flash presentation papers, the workshop will include invited talks and announcement of International Image Sensors Society (IISS) Award winners.

Image Sensor Design and Performance
CMOS imagers, CCD imagers, SPAD sensors
New and disruptive architectures
Global shutter image sensors
Low noise readout circuitry, ADC designs
Single photon sensitivity sensors
High frame rate image sensors
High dynamic range sensors
Low voltage and low power imagers
High image quality; Low noise; High sensitivity
Improved color reproduction
Non-standard color patterns with special digital processing
Imaging system-on-a-chip, On-chip image processing
Event-based image sensors

Pixels and Image Sensor Device Physics
New devices and pixel structures
Advanced materials
Ultra miniaturized pixels development, testing, and characterization
New device physics and phenomena
Electron multiplication pixels
Techniques for increasing QE, well capacity, reducing
crosstalk, and improving angular response
Front side illuminated, back side illuminated, and
stacked pixels and pixel arrays
Pixel simulation: Optical and electrical simulation, 2D and
3D, CAD for design and simulation, improved models 

Application Specific Imagers
Image sensors and pixels for range sensing: TOF, RGBZ,
Structured light, Stereo imaging, etc.
Image sensors with enhanced spectral sensitivity (NIR, UV, IR)
Sensors for DSC, DSLR, mobile, digital video cameras and mirror-less cameras
Array imagers and sensors for multi-aperture imaging, computational imaging, and machine learning
Sensors for medical applications, microbiology, genome sequencing
High energy photon and particle sensors (X-ray, radiation)
Line arrays, TDI, Very large format imagers
Multi and hyperspectral imagers
Polarization sensitive imagers

Image sensor manufacturing and testing
New manufacturing techniques
Wafer-on-wafer and chip-on-wafer stacking technologies
Backside thinning
New characterization methods
Packaging and testing: reliability, yield, cost
Defects, noises, and leakage currents
Radiation damage and radiation hard imagers

On-chip optics
Advanced optical path, color filters, microlens, light guides
Nanotechnologies for Imaging
Wafer level cameras

Submission of abstracts:
An abstract should consist of a single page of maximum 500-words text with up to two pages of
illustrations (3 pages maximum), and include authors’ name(s) and affiliation, mailing address,
telephone and e-mail address.

The deadline for abstract submission is 11:59pm, Thursday Dec 10th, 2026 (PST).
To submit an abstract, please go to: https://cmt3.research.microsoft.com/IISW2027
Above website should be open by Aug 1st, 2026.

The first time you visit the paper submission site, you'll need to click on "Create Account". Once you create and verify your account with your email address, you will be able to submit abstracts by logging in and clicking “Create New Submission”.

Please visit http://imagesensors.org/CFP2027 for complete instructions and any updates to the
abstract and paper submission procedures.

Abstracts will be considered on the basis of originality and quality. High quality papers on work in progress are also welcome. Abstracts will be reviewed confidentially by the Technical Program
Committee.

Key Dates
Authors will be notified of the acceptance of their abstract by February 12th, 2027.
Final-form 4-page paper submission date is March 20th, 2027.
Presentation material submission date is April 30th, 2027.

Location and format:
The IISW 2027 will be held at the Westin Resort & Spa in Whistler, British Columbia in Canada.

Registration, Workshop fee and Program:
The Workshop Program and registration details will be provided in the Final Announcement of the Workshop. 

Canon "twisted photodiode" paper (IISW2025 special issue)

In a paper titled "Design and Optimization of a Twisted Photodiode Pixel Structure for All-Directional Phase-Detection Autofocus CMOS Image Sensors" a team from Canon write:

To achieve an all-directional and high-speed, high-accuracy autofocus (AF) function, we propose a CMOS image sensor with a Twisted Photodiode (PD) structure. The developed 3D-stacked back-side illuminated (BSI) sensor employs the Twisted PD, which enables equivalent angular response characteristics in both the horizontal and vertical directions for the two PDs integrated within a single pixel, thereby realizing AF detection for all pixels and all directions. This paper describes the Twisted PD structure that enables all-directional AF and presents an analysis of charge transfer behavior in this unique 3D configuration. In this paper, “all-directional” refers to robustness with respect to subject direction.

This paper was published in the IISW2025 special issue of Sensors. 
Link: https://www.mdpi.com/1424-8220/26/6/1758

 

 

Miscellaneous 2026 market news: Omnivision, Canon, Oculi, Sony

Omnivision is listed on HKSE https://www.reuters.com/world/asia-pacific/chinas-omnivision-open-slightly-higher-hong-kong-trading-debut-2026-01-12/ 

Canon will manufacture image sensor image processing chips in 2nm process at Rapidus. https://asia.nikkei.com/business/tech/semiconductors/rapidus-adds-canon-as-first-major-domestic-customer-candidate-for-2nm-chips

 

Semiconductor Industry Veteran, Patrick Henry, Named CEO of Oculi https://www.prweb.com/releases/semiconductor-industry-veteran-patrick-henry-named-ceo-of-oculi-302739724.html 

 

Sony to get up to $380 million image sensor factory Japan subsidy https://www.reuters.com/world/asia-pacific/sony-get-up-380-million-image-sensor-factory-japan-subsidy-2026-04-17/ 

 

Emberion has officially become part of Exosens https://www.emberion.com/exosens-acquires-emberion/

[Updated June 30 to fix a mistake in the summary of the Canon/Rapidus news article.]

VISSA VISible detection for Space Applications open for abstract submissions

ESA, CNES, AIRBUS DEFENCE & SPACE, ISAE-SUPAERO, OHB, SODERN, and THALES ALENIA SPACE are pleased to invite you to:

VISSA: VISible detection for Space Applications, the 9th iteration of the workshop series known as “Space & Scientific CMOS Image Sensors”

Please find attached the CALL FOR ABSTRACTS for the workshop planned for 24 and 25 November at ESA-ESTEC, The Netherlands.

This is a very popular event and has become one of the main European technical exchanges on CMOS image sensors. The aim of this workshop is to focus on latest developments in advanced image sensors for scientific and space applications targeting wavelengths shorter than 1.1 μm.

The deadline for abstract submission is 4 September 2026.

Please send a short abstract on one A4 page maximum in word or pdf format giving the
title, the author name(s) and affiliation(s), and presenting the subject of your talk, to
matthew.soman@esa.int and valerian.lalucaa@cnes.fr 

Abstracts shall preferably address one or more of the following topics:
• Pixel design (high QE, FWC, MTF optimization, low lag, …)
• Electrical design (low noise amplifiers, shutter, CDS, high speed architectures, TDI, HDR, …)
• On-chip ADC or TDC (in pixel, column, …)
• On-chip processing (smart sensors, multiple gains, summation, corrections)
• Low-light detection (electron multiplication, avalanche photodiodes, quanta image sensors, …)
• Photon counting, Time resolving detectors (gated, time-correlated single-photon counting, …)
• Hyperspectral architectures
• Materials (thin film, optical layers, dopant, high-resistivity, amorphous Si, …)
• Processes (backside thinning, hybridization, 3D stacking, anti-reflection coating, …)
• Packaging
• Optical design (micro-lenses, trench isolation, filters, …)
• Large size devices (stitching, butting, …)
• High speed interfaces
• Focal plane architectures
• CMOS image sensors with recent space heritage showing in-flight performance 

Workshop format & official language
Oral presentations shall be requested for the workshop. The official workshop language is English.
 

Slide submission
After abstract acceptance notification, the authors will be requested to prepare their presentation in pdf
or Powerpoint file format, to be presented at the workshop. Authors will also be required to provide a
version to the organizing committee along with an authorization to make it available for Workshop
attendees, and on-line for the COMET members. No proceedings will be compiled and so no detailed
manuscript needs to be submitted.
 

Registration
Registration fee : Attendees: 120 Euro // students: 60 Euro
On-line registration link will be sent at registration opening.
 

Exhibition/Sponsorship:
Booths will be available during the workshop. If you are interested to exhibit, please contact the
organizing committee. 

Sony's new X-ray image sensor IMX711

Product overview page: https://www.sony-semicon.com/en/products/is/scientific/x-ray.html

The IMX711 is an X-ray image sensor that employs a direct conversion and integration type CMOS technology, in which X-rays and electron beams are detected directly.

It uses proprietary technology to achieve both high-speed capture and low noise performance, enabling the detection of weak single-photon signals, which is difficult with conventional integration type sensors.
This technology enables measurement with a wider dynamic range than conventional methods, offering from single-photon detection under low-flux conditions to stable and high-accuracy measurement in high-flux conditions.

The image sensor can capture energy, spatial, and temporal information simultaneously, which contributes to better measurement accuracy, measurement throughput, and flexible post-processing depending on the application and use casein advanced device inspection and scientific measurements such as materials science and life sciences.

 

400x400 pixel stacked CIS HDR sensor for AR/VR applications

In a June 2026 paper titled "A 400×400 3.24-μm 117-dB Dynamic Range Three-Layer Stacked Digital Pixel Sensor With Triple Quantization and Fixed Pattern Noise Correction" published in IEEE Trans. Electron Devices, a team from Brillnics, Meta, and SesameAI* write:

This article presents a 400×400 digital pixel sensor (DPS) with a 3.24 μm pixel pitch, fabricated using a 45/40/40 nm three-layer stacked process. The sensor achieves single-exposure high dynamic range (SEHDR) through overlapped triple quantization (3Q), fixed pattern noise correction (FPN-C), and black level correction (BLC). An on-chip image signal processor (ISP) is integrated to support defect pixel correction (DPC), SEHDR linearization, and gamma correction. Sparse transmission (ST) is incorporated to reduce transmitted data volume and, consequently, transmission power consumption. A wafer-level chip-scale package (WLCSP) with two redistribution layers (RDLs) is employed, resulting in a compact form factor of 2.47×1.85 mm^2. This work achieves a dynamic range (DR) of 117 dB while consuming 2.45 mW at 30 frames/s (fps), yielding a figure of merit (FoM) of 0.0046 e- rms  pJ, and is developed to meet the growing demands of augmented reality (AR) and virtual reality (VR) applications.

Full paper: https://doi.org/10.1109/TED.2026.3687537 

 

 

* Sesame AI (https://www.sesame.com/) is developing "conversational AI agents", with a smart glasses product slated for 2027.