Tuesday, November 11, 2025
Event-Driven Vision Summer School
Thursday, October 30, 2025
Foveon X3 sensor update
Some updates from Foveon in a new video interview posted on YouTube:
- Sigma is “still working on the development of the sensor” [17:00].
- Current status: The project is still in the “technology development” stage [17:11]. They have not yet started the design of the actual, final sensor [17:11].
- Focus: The team is currently working on the “design of the pixel architecture” [17:20].
- Delays: The project has been “a little bit delayed” [17:30] because as they test prototype wafers, they encounter “technical issues” [17:53].
- Development team: The sensor development is now being handled primarily by the Sigma Japan engineering team [18:02].
- Path forward: Mr. Yamaki mentions that the technical problems “have been narrowing down” [18:12]. Once the team is confident that the technology is ready, they will start the final sensor design and move toward production [18:23].
Tuesday, October 28, 2025
Paper on flexible SWIR detector
Saturday, October 25, 2025
33rd IS&T Color and Imaging Conference Oct 27-31
ST's new sensors for industrial automation, security, retail
Tuesday, October 21, 2025
[Video] Owl Thermal Imaging for Safer Streets
Smarter Cameras Imply Safer Streets? | Interview with Wade Appelman, Owl Autonomous Imaging
Pedestrian deaths at night are rising around the world — and traditional car sensors aren't enough to stop them. In this eye-opening interview, we speak with Wade Appelman, Chief Business Officer at Owl Autonomous Imaging, about how thermal imaging and AI are working together to change that.
We explore:
- Why pedestrian safety at night is now a global concern
- How thermal cameras and convolutional neural networks (CNNs) work in real-time to detect people in low light
- How these smart systems integrate with vehicle software using ROS
- The technology behind monocular vision and its use in autonomous driving
- How advanced camera sensors are built — from microbolometers to full-scale production
- Real-world testing results from Detroit and Las Vegas that show how thermal vision outperforms lidar, radar, and regular RGB cameras
Monday, October 20, 2025
Single-Photon Challenge image reconstruction competition is now open!
The Single-Photon Challenge announced yesterday (Oct 19) at ICCV 2025 is a first-of-its-kind benchmark and open competition for photon-level imaging and reconstruction.
The competition is now open! The submission deadline is April 1, 2026 (AOE) and winners will be announced in summer 2026.
The challenge provides access to single-photon datasets and a public leaderboard to benchmark algorithms for photon-efficient vision: https://SinglePhotonChallenge.com
For this image reconstruction challenge you will need to come up with a novel and creative ways to transform many single-photon camera frames into a single high quality image. This setting is very similar to traditional burst imaging but taken to its extreme limit. Instead of a few burst images you have access to a thousand, but the catch is that each input frame is extremely noisy.
There are thousands of dollars in prizes to win, thanks to the sponsors Ubicept and Singular Photonics.
Thursday, October 16, 2025
Samsung announces 0.5um pixel
https://semiconductor.samsung.com/image-sensor/mobile-image-sensor/isocell-hp5/
Specifications:
Effective Resolution
16,384 x 12,288 (200MP)
Pixel Size
0.5 μm
Optical Format
1/1.56"
Color Filter
Tetra²pixel RGB Bayer Pattern
Normal Frame Rate
7.5 fps @full, 30 fps @50MP, 90 fps @12.5MP
Video Frame Rate
30 fps @8K, 120 fps @4K, 480 fps @FHD (w/o AF)
Shutter Type
Electronic rolling shutter
ADC Accuracy
10-bit
Supply Voltage
2.2 V for analog, 1.8 V for I/O, 1.0 V for digital core supply
Operating Temperature
-20℃ to +85℃
Interface
4 lanes (4.5 Gbps per lane) D-PHY / 3 trios (4 Gsps per trio) C-PHY
Chroma
Tetra²pixel
Autofocus
Super QPD (PDAF)
HDR
Smart-ISO Pro (iDCG), Staggered HDR
Output Formats
RAW8, RAW10, RAW12, RAW14
Analog Gain
16x @full, 256x @12.5MP
Excerpt from Baidu news (translated with Google translate):
Samsung releases ISOCELL HP5, the world's first 0.5µm ultra-fine pixel 200 million image sensor
... Samsung officially released the new 200-megapixel image sensor ISOCELL HP5, which is expected to be the first telephoto camera of the OPPO Find X9 Pro mobile phone.
... ISOCELL HP5 sensor is 1/1.56 inches in size, has an ultra-high resolution of 16384 x 12288, and compresses the unit pixel size to 0.5 microns. It is Samsung's first 200 million image sensor in the world equipped with 0.5µm ultra-micro pixels.
To overcome the challenges posed by small pixels, ISOCELL HP5 integrates multiple cutting-edge technologies. Among them, dual vertical transfer gate (D-VTG) and front deep trench isolation (FDTI) technologies work together to effectively increase the full well capacity of each pixel, or its ability to accommodate light signals.
Tuesday, October 14, 2025
Tower Semiconductor preprint on 2.2um global shutter pixel
Yokoyama et al. from Tower Semiconductor have posted a preprint titled "Charge Domain Type 2.2um BSI Global Shutter Pixel with Dual Depth DTI Produced by Thick-Film Epitaxial Process":
Abstract: We developed a 2.2um Backside Illuminated (BSI) Global Shutter (GS) pixel with true charge-domain Correlated Double Sampling (CDS). A thick-film epitaxial deep DTI (Deep Trench Isolation) process was implemented to enhance 1/PLS (Parasitic Light Sensitivity) using a dual depth DTI structure.
The thickness of the epitaxial substrate was 8.5 um. This structure was designed using optical simulation. By using a thick epitaxial substrate, it is possible to reduce the amount of light that reaches the memory node. Dual-depth DTI, which shallows the DTI depth on the readout side, makes it possible to read signals from the PD to the memory node smoothly. To achieve this structure, we developed a process for thick epitaxial substrate, and the dual-depth DTI can be fabricated with a single mask. This newly developed pixel represents the smallest ever charge-domain GS pixel to date. Despite its compact size, this pixel achieved high QE (83%) and 1/PLS of over 10,000. The pixel maintains 80% of its peak QE at ±15 degrees. 1/PLS is stable even when the F# is small.
Full paper: https://sciprofiles.com/publication/view/7ae02d55ce8f3721ebfc8c35fb871d97
Saturday, October 11, 2025
Conference List - April 2026
IEEE 23rd International Symposium on Biomedical Imaging - 8-11 April 2026 - London, UK - Website
SPIE Photonics Europe - 12-16 April 2026 - Strasbourg, France - Website
IEEE Silicon Photonics Conference - 13-15 April 2026 - Ottawa, Ontario, Canada - Website
IEEE Custom Integrated Circuits Conference - 19-22 April 2026 - Seattle, Washington, USA - Website
Compound Semiconductor International Conference - 20-22 April 2026 - Brussels. Belgium - Website
SPIE Defense + Security - 26-30 April 2026 - National Harbor, Maryland, USA - Website
If you know about additional local conferences, please add them as comments.
Return to Conference List index
Monday, October 06, 2025
Billion-pixel-resolution microscopy of curved surfaces
Friday, October 03, 2025
Webinar on metasurface optics design
Thursday, October 02, 2025
Article about Japan's TDK and Apple iPhone cameras
Original article here: https://gori.me/iphone/iphone-news/161745
(Translated using google translate)
TDK's TMR Sensor is the Secret to iPhone Cameras, Tim Cook Praises About Japanese Technology
TDK reveals thirty years of technology accumulation and manufacturing process that competitors cannot imitate at the first release of Apple Yokohama Technology Center
Apple CEO Tim Cook visited the Apple Yokohama Technology Center (YTC) in Tsunashima, Yokohama, during his visit to Japan. This is the first time that the facility has been opened to the public, and the reality of a state-of-the-art research and development center with about 6,000 square meters of lab space and a clean room has been revealed.
On the same day, YTC presented four of Apple's leading companies—TDK, AGC, Kyocera, and Sony Semiconductor Solutions— that support Apple’s innovation. Tim Cook told reporters, “Apple will never be happy with the situation. Continue to ask for something better. The same goes for Japanese companies. We will never be satisfied and will continue to develop with the aim of always further advancement,” he said, emphasizing the importance of collaborative relationships with Japanese companies.
The partnership between TDK and Apple began before the first iPod and has been in a long-term relationship for more than three decades. Today, almost all Apple products use TDK technology, and contribute to a wide range of fields, including batteries, pass filters, inductors, microphones, and various sensors.
It’s worth noting that TDK uses 100% renewable energy in all of its products it manufactures for Apple products. In the background of the beautiful photo shoot of the iPhone, which is usually used casually, and the ultra-compact part called the TMR sensor developed by TDK functions as a technology that all iPhone users benefit from.
TMR sensor stands for “Tunnel Magnetoresistance Sensor” and is an ultra-small sensor that detects changes in magnetic fields with extremely high sensitivity. It is so small that it contains fifty thousand wine glasses in a glass of wine, and it is a size that is almost invisible to the naked eye.
The principle of operation of this sensor applies quantum mechanical phenomena. To put it simply, it is a structure in which an ultra-thin insulator is sandwiched between two magnetic materials , and the electrical resistance changes dramatically due to changes in the external magnetic field. Compared to conventional Hall elements, the TMR sensor has reached about a hundred times the sensitivity of the TMR sensor, and it is characterized by extremely clear reactions such as "zero or one".
The experience of automatically focusing on the moment you launch the camera app on your iPhone and point the lens at the subject will be "natural" that many users feel on a daily basis. However, in this background, the TMR sensor accurately grasps the position of the lens in a thousandth of a second.
The specific mechanisms are as follows. When the lens moves back and forth, a small magnet moves with the lens. The TMR sensor detects the distance change with this magnet as a change in the magnetic field as a change in the magnetic field, and instantly grasps where the lens is now. The camera system makes appropriate focus adjustments by "detecting the position" rather than measuring the distance.
The TMR sensor, which was first used for autofocus applications on the iPhone X, has also been applied to the sensor shift image stabilization (OIS) from the iPhone 12 series. The minute movement due to the camera shake is also instantly detected, and the sensor itself is operated to correct it.
The latest iPhone 17 series also uses TMR sensors for the center stage function of the front camera, which detects the fine movement of the lens in real time with a sensitivity of 100 times more than general hall elements.
An easy example of an easy-to-understand TMR sensor is the joystick of the game controller. In the conventional joystick, a mechanical part called a "potension meter" is used, and the angle is detected by physical contact.
On the other hand, joysticks using TMR sensors operate non-contact , which greatly improves response speed and accuracy. In addition, since there is no mechanical wear, it also realizes durability that does not deteriorate in accuracy even if it is used for a long time.
The structure of the TMR sensor itself can be understood by the competitors when it is disassembled. However, it is very difficult to actually produce an equivalent product. The reason is TDK’s proprietary manufacturing process technology.
Semiconductor-based equipment is used for manufacturing, but it is not the equipment itself that is important. Combining multiple specialized technologies such as TMR deposition, magnetic material plating, and dry etching, the process of creating a unique layered structure that detects the magnetic field from which direction it detects the magnetic field from and which direction does it not perceives it is at the core.
Modern smartphones are becoming thinner, and many magnets are used inside. There may be concerns about whether the delicate TMR sensor will work properly in this environment.
TDK cooperates closely from the customer's design stage to propose optimal sensor placement and design . The influence of the magnetic field is rapidly weakened by simply securing 1cm of physical distance, so the interference problem can be solved with proper design. He visits Cupertino fourteen times a year, and his close work with Apple’s camera team is proof of that.
TDK has leveraged ninety years of expertise in magnetic materials to establish this process technology. The TMR sensors manufactured at the Asama Techno Plant in Japan also have a sustainable manufacturing system using 100% renewable energy.
The background of each photo that iPhone users casually take is the result of such a long-term accumulation of Japanese precision technology and technology. TMR sensors are by no means a prominent component, but they will continue to evolve as an important technology that supports the modern smartphone experience.
Wednesday, October 01, 2025
Sony announces IMX927 a 105MP global-shutter CIS
Product page: https://www.sony-semicon.com/en/products/is/industry/gs/imx927-937.html
Release page: https://www.sony-semicon.com/en/info/2025/2025092901.html
PetaPixel article: https://petapixel.com/2025/09/29/sonys-new-global-shutter-sensor-captures-105-megapixels-at-100fps/
Sony Semiconductor Solutions to Release the Industry-Leading Global Shutter CMOS Image Sensor for Industrial Use That Achieves Both Approximately 105-Effective-Megapixels and High-Speed 100 FPS Output
Delivering high-resolution and high-frame-rate imaging to contribute to diversified, advanced inspections
Atsugi, Japan — Sony Semiconductor Solutions Corporation (Sony) today announced the upcoming release of the IMX927 stacked CMOS sensor with back-illuminated pixel structure and global shutter. It is the industry-leading sensor that achieves both high-resolution of approximately 105-effective-megapixels and high-speed output at a maximum frame rate of 100 fps.
The new sensor product is equipped with Pregius S™ global shutter technology made possible by Sony’s original pixel structure, ensuring high-quality imaging performance with distortion free imaging and minimal noise. By optimizing the sensor drive in pixel reading and A/D converter, it supports high-speed image data output. Introducing this high-resolution and high-frame-rate model into the product lineup will help improving productivity in industrial equipment domain, where recognition targets and inspection methods continue to diversify.
With the automation of factories progressing, the need for machine vision cameras that can capture a variety of objects at high speed and high resolution is growing in industrial equipment domain. With its proprietary back-illuminated pixel structure, Sony’s global shutter CMOS image sensors deliver high sensitivity and saturation capacity. Because they can capture moving subjects at high resolution without distortion, they are increasingly being used in a wide range of applications such as precision component recognition and foreign matter inspection. The new IMX927 features a high resolution of approximately 105 effective megapixels while delivering a high frame rate of up to 100 fps, helping shorten measurement and inspection times. It also shows promise in advanced measurement and inspection applications, for instance imaging larger objects in high resolution and three-dimensional inspection using multiple sets of image data.
Along with the IMX927, Sony will also release seven products with different image sizes and frame rates. It has also developed a new ceramic package with connector that is compatible with a series of all these products, which allows cameras to be designed with sensors removable from camera modules. This can contribute to streamlining camera assembly and sensor replacement. By expanding its global shutter product lineup, Sony is contributing to the advancement of industrial equipment, where recognition and inspection tasks continue to become ever more precise and diversified.
Main Features
■ Global shutter technology with Sony’s proprietary pixel structure for high-resolution and high-sensitivity imaging
The new sensor is equipped with Pregius S global shutter technology. The very small 2.74 μm hat use Sony’s proprietary back-illuminated pixels and stacked structure enable the approximately 105-effective-megapixels resolution in a compact size with a high level of sensitivity and saturation capacity. In addition to inspections of precision components such as semiconductors and flat-panel displays, which require a high degree of accuracy, this feature also enables the capture of larger objects with distortion free, high-resolution, low-noise images. Thereby machine vision cameras can achieve higher precision measurement and inspection processes in a wide range of applications.
■ Circuit structure enabling a highly efficient sensor drive that saves power and makes high-speed imaging possible
The new sensor employs a circuit structure that optimizes pixel reading and sensor drive in the A/D converter, which saves power and enables faster data processing. This design makes a high-speed frame rate of up to 100 fps possible, reducing the time to output image data for more efficiency in measurement and inspection tasks. It also shows promise for application in advanced inspections such as three-dimensional inspections, which use multiple image data sets.
■ New ceramic package with connector to streamline camera assembly and contribute to stable operation
Sony has also developed a new ceramic package with connector, which is compatible with a series of eight products including the IMX927, making it possible to combine or detach sensors from camera modules flexibly to design cameras. Using this package makes camera assembly easier and streamlines the process of replacing sensors to suit camera specifications. It also has a superior heat dissipation structure, which suppresses the impact of heat on camera performance, contributing to stable, long-term operation.
Friday, September 26, 2025
ISSW 2026 call for papers
Tuesday, September 16, 2025
Conference List - March 2026
If you know about additional local conferences, please add them as comments.
Return to Conference List index
Happening Today: Swiss Photonics Lunch Chat
Sunday, September 14, 2025
Job Postings - Week of 14 September 2025
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Amazon ASIC SoC Manager, Amazon Camera ASIC Team |
Sunnyvale, California, USA |
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GlobalFoundries Principal Engineer Device Engineering (FRCMOS): SPAD/CIS Development |
Singapore |
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Vital Chemicals IC Designer |
Cupertino, California, USA |
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Sony European Graduate Program - Image Sensor Designer |
Oslo, Norway |
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Qualcomm Camera AF/EIS Algorithm System Engineer |
Shanghai, China |
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Teledyne FLIR Sr. Principal ASIC/Analog Design Engineer |
Goleta, California, USA |
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HEPHY PHD STUDENT on semiconductor detector development and readout electronics |
Vienna, Austria |
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Fairchild Imaging Senior Quality Engineer |
San Jose, California, USA |
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Johannes Gutenberg University Particle Detectors for Future Experiments from Concept to Operation |
Mainz, Germany |
Friday, September 12, 2025
Image sensors workshop at IEEE Sensors 2025
Wednesday, September 10, 2025
International Image Sensor Workshop (IISW) 2025 proceedings available
Each article also got a DOI assigned for easy future references, just like all other papers published by IISS since 2007.
Thank you to the all the organizers and volunteers who made this workshop possible!
Monday, September 08, 2025
VoxelSensors Qualcomm collab
VoxelSensors to Advance Next-Generation Depth Sensing Technology with 10x Power Savings for XR Applications
VoxelSensors, a company developing novel intelligent sensing and data insights technology for Physical AI, today announced a collaboration with Qualcomm Technologies, Inc. to jointly optimize VoxelSensors’ sensing technology with Snapdragon® XR Platforms.
Brussels, Aug. 28, 2025 (GLOBE NEWSWIRE) -- VoxelSensors, a company developing novel intelligent sensing and data insights technology for Physical AI, today announced a collaboration with Qualcomm Technologies, Inc. to jointly optimize VoxelSensors’ sensing technology with Snapdragon® XR Platforms.
Technology & Industry Challenges
VoxelSensors has developed Single Photon Active Event Sensor (SPAES™) 3D sensing, a breakthrough technology that solves current critical depth sensing performance limitations for robotics and XR. The SPAES™ architecture addresses them by delivering 10x power savings and lower latency, maintaining robust performance across varied lighting conditions. This innovation is set to enable machines to understand both the physical world and human behavior from user’s point-of-view, advancing Physical AI.
Physical AI processes data from human perspectives to learn about the world around us, predict needs, create personalized agents, and adapt continuously through user-centered learning. This enables new and exciting applications previously unattainable. At the same time, Physical AI pushes the boundaries of operation to wider environments posing challenging conditions like variable lighting and power constraints.
VoxelSensors’ technology addresses both challenges by offering a technology that expands the operative limits of current day sensors, while collecting human point-of-view data to better train physical AI models. Overcoming these challenges will define the future of human-machine interaction.
Collaboration
VoxelSensors is working with Qualcomm Technologies to jointly optimize VoxelSensors’ SPAES™ 3D sensing technology with Snapdragon AR2 Gen 1 Platform, allowing a low-latency and flexible 3D active event data stream. The optimized solution will be available to select customers and partners by December 2025.
“We are pleased to collaborate with Qualcomm Technologies,” said Johannes Peeters, CEO of VoxelSensors. “After five years of developing our technology, we see our vision being realized through optimizations with Snapdragon XR Platforms. With our sensors that are ideally suited for next-generation 3D sensing and eye-tracking systems, and our inference engine for capturing users’ egocentric data, we see great potential in enabling truly personal AI agent interactions only available on XR devices.”
“For the XR industry to expand, Qualcomm Technologies is committed to enabling smaller, faster, and more power-efficient devices,” said Ziad Asghar, SVP & GM of XR at Qualcomm Technologies, Inc. “We see great potential for small, lightweight AR smart glasses that consumers can wear all day. VoxelSensors’ technology offers the potential to deliver higher performance rates with significantly lower power consumption, which is needed to achieve this vision.”
Market Impact and Future Outlook
As VoxelSensors continues to miniaturize their technology, the integration into commercial products is expected to significantly enhance the value proposition of next-generation XR offerings. Collaborating with Qualcomm Technologies, a leader in XR chipsets, emphasizes VoxelSensors’ commitment to fostering innovation to advance the entire XR ecosystem, bringing the industry closer to mainstream adoption of all-day wearable AR devices.
Friday, September 05, 2025
SMPTE awards Dr. Peter Centen
https://www.smpte.org/about/awards-programs/camera-winners
2025 - Dr. Peter G. M. Centen
For pioneering innovations in image sensor technology that transformed electronic cinematography and broadcast imaging. Over a career spanning more than four decades, Dr. Centen played a pivotal role in the industry’s transition from CCD to CMOS image sensors, serving as chief architect of the Xensium family that enabled HD, 4K, HDR, and HFR imaging. During the transitions from SD to HD, narrow-screen to widescreen, and film to digital cinematography, his development of Dynamic Pixel Management—a groundbreaking sub-pixel-control technology—allowed a single sensor to support multiple resolutions and aspect ratios, including ultra-wide formats (~2.4:1), without compromise. This innovation, first implemented in the Viper FilmStream camera, eliminated the need for format-specific imaging systems and laid the foundation for today’s flexible, high-performance camera designs.
The Camera Origination and Imaging Medal, established in 2012, recognizes significant technical achievements related to inventions or advances in imaging technology, including sensors, imaging processing electronics, and the overall embodiment and application of image capture devices.
Wednesday, September 03, 2025
Prophesee announces GenX320 starter kits for Raspberry Pi
Prophesee Brings Event-Based Vision to Raspberry Pi 5 with GenX320 Starter Kit
New starter kit provides developers efficient, cost-effective way to leverage low-power, high-speed neuromorphic vision for IoT, drones, robotics, security and surveillance—with one of the world’s most popular embedded development platforms
PARIS, Aug 26, 2025
Prophesee, the inventor and leader in event-based neuromorphic vision systems, today announces the launch of the GenX320 Starter Kit for Raspberry Pi® 5, making its breakthrough frameless sensing technology available to the Raspberry Pi developer community for the first time. Built around Prophesee’s ultra-compact, ultra-efficient GenX320 event-based vision sensor, the kit connects directly to the Raspberry Pi 5 camera connector to allow development of real-time applications that leverage the advantages of event-based vision for drones, robotics, industrial automation, surveillance, and more.
The kit enables efficient, cost-effective and easy-to-use access to develop solutions based on Prophesee’s advanced Metavision® event-based vision platform, through use of the company’s OpenEB, open-source core of its award-winning Metavision SDK. The Raspberry Pi ecosystem is one of the largest and most active hardware communities in the world, with more than 60 million units sold and millions of developers engaged across open-source and maker platforms.
Event-based vision is a paradigm shift from traditional frame-based approaches. It doesn’t capture entire images at once but instead detects changes in brightness, known as “events,” at each pixel. This makes sensors much faster (responding in microseconds), able to operate with much less data and processing power, and be more power-efficient than traditional sensors.
The kit is purpose-built to enable real-world, real-time applications where traditional frame-based vision struggles:
- Drones & Robotics: Obstacle avoidance, drone-to-drone tracking, real-time SLAM
- Industrial IoT: 3D scanning, defect detection, and predictive maintenance
- Surveillance & Safety: Intrusion detection, fall detection, and motion analytics
ABOUT THE KIT
The GenX320 Starter Kit is built around the Prophesee GenX320 sensor, the smallest and most power-efficient event-based vision sensor available. With a 320×320 resolution, >140 dB dynamic range, event rate equivalent to ~10,000 fps, and sub-millisecond latency, the sensor provides the performance needed for demanding real-time applications on an embedded platform.
Key Features:
- Compact event-based camera module with MIPI CSI-2 interface
- Native integration with Raspberry Pi 5 (board sold separately)
- Power-efficient operation (<50 mW sensor-only consumption)
- OpenEB support with Python and C++ APIs
Software Resources:
- Developers will be able to access drivers, data recording, replay and visualization tools on GitHub.
- Access to the Prophesee Knowledge Center, a centralized location for users to access various resources, including: a download repository, user guides, and FAQs; a community forum to share ideas; a support ticket system; and additional resources such as application notes, product manuals, training videos, and more than 200 academic papers.
AVAILABILITY
The Prophesee GenX320 Starter Kit for Raspberry Pi 5 is available for pre-order starting August 26, 2025, through Prophesee’s website and authorized distributors. For more information or to order, visit: www.prophesee.ai/event-based-starter-kit-genx320-raspberry-pi-5/
Monday, September 01, 2025
Galaxycore 50MP 0.61um CIS
Translated from Baidu news: https://baijiahao-baidu-com.translate.goog/s?id=1839605263838551524&wfr=spider&for=pc&_x_tr_sl=zh-CN&_x_tr_tl=de&_x_tr_hl=de&_x_tr_pto=wapp
GLOBAL HUI, August 5th | GalaxyCore (688728.SH) announced that it has recently achieved mass production and shipment of its 0.61-micron 50-megapixel image sensor product. This product, the world's first single-chip 0.61-micron pixel image sensor, is based on the company's unique Galaxy Cell 2.0 process platform and manufactured in the company's own wafer fab, significantly improving small-pixel performance. This product utilizes a 1/2.88 optical size, reducing the thickness of the camera module and making it widely applicable to smartphone rear-mounted main cameras, ultra-wide-angle cameras, and front-facing cameras. Furthermore, this product integrates single-frame high dynamic range (DAGHDR) technology, achieving wider dynamic range coverage in a single exposure, effectively addressing overexposure and underexposure issues in backlit scenes. It also supports PDAF phase autofocus, ensuring a fast and accurate shooting experience.
The company's 0.61-micron 50-megapixel image sensor has entered mass production and shipment, successfully entering the rear-mounted main camera market for branded mobile phones. This marks further market recognition of the company's innovative high-pixel single-chip integration technology and fully demonstrates the efficiency of its Fab-Lite model. To date, the company has achieved mass production of 0.7-micron 50-megapixel, 1.0-micron 50-megapixel, and 0.61-micron 50-megapixel image sensors based on single-chip integration technology. The company will subsequently leverage this technology platform to further enhance the performance of high-pixel products such as 32-megapixel and 50-megapixel, while also launching products with specifications exceeding 100 megapixels. This will continuously strengthen the company's core competitiveness, increase market share, and expand its leading position.
Friday, August 29, 2025
Canon 400MP CIS
Related post on the blog in January: https://image-sensors-world.blogspot.com/2025/01/canon-announces-410mp-full-frame-sensor.html
Canon has presented its new record image sensor with 410 megapixels to the public for the first time. The presentation took place at the P&I 2025 in China.
Spectacular engineering key data
- Resolution: 24.592 x 16,704 pixels, which corresponds to almost 200 times Full-HD and 12 x 8K.
- Sensor architecture : New, rearly lit stacked sensor with integrated signal processing.
- Data throughput : impressive read speed of 3,280 MP/s, which allows 8 frames/s in full resolution.
- Monochrome version : Uses 4-pixel binning for higher light sensitivity and allows 100 MP videos at 24 fps.
Target market: Industry instead of consumers
Canon does not position the LI8030SA for the mass market, but for highly specialized industries such as monitoring, medicine and machine vision. At P&I 2025, the sensor was presented behind glass, which is usually a clear signal that it is still in the development phase. Canon is already looking for expressions of interest, but the first models should not be intended for classic cameras. Nevertheless, the technology could also influence commercial Canon sensors in the future.
With the 410-MP sensor, Canon impressively shows where the journey can go. For hobby photographers, however, this sensor remains a distant dream. Most of us don't need such an exaggerated resolution anyway. In the professional sector, however, it opens up new dimensions.
Wednesday, August 27, 2025
Harvest Imaging 2025 Forum - Dec 8, 9 - Single-Photon Detection
Registration page: https://harvestimaging.com/forum_introduction_2025_coming.php
The Harvest Imaging forum will continue with a next edition scheduled for December 8 & 9, 2025, in Delft, the Netherlands. The basic intention of the Harvest Imaging forum is to have a scientific and technical in-depth discussion on one particular topic that is of great importance and value to the digital imaging community.
The 2025 Harvest Imaging forum will deal with a single topic and will have only one world-level expert as the speaker:
"SINGLE PHOTON DETECTION"
Prof. dr. Robert HENDERSON (Univ. of Edinburgh, UK)
Abstract:
Access to the ultrafast quantum statistics of light enabled by new solid-state single photon imaging technologies is revolutionizing camera technology.
The noise-free detection and precise localization of individual photons enables imaging of time itself (which directly enables depth perception) at unprecedented temporal and spatial resolutions. Such solid-state single photon imaging technologies now approach the sensitivity, timing resolution and dark noise of vacuum electrocathode approaches whilst providing robustness, low cost and high spatial resolution. Amongst these, CMOS single Photon Avalanche Diode (SPAD) arrays offer the unique capability to extract single photon statistics in high background conditions using massively parallel on-chip timing and digital computation.
This forum will highlight the modelling, device structures, characterisation methods and circuitry necessary to develop this new generation of SPAD imaging system. Recent advances in SPAD direct time of flight (dToF) and photon counting sensor design techniques optimized for low power, computation, and area will be reviewed.
The forum will focus primarily on the mainstream commercial applications of SPADs in low light imaging, depth imaging (RGB-Z) and LIDAR. Further examples will be drawn from emerging use cases in fluorescence microscopy, Raman spectroscopy, non-line-of-sight imaging, quantum optics and medical diagnostics (X-ray, PET). Future trends and prospects enabled by 3D-stacking technology will be considered.
Bio:
Robert K. Henderson is a Professor of Electronic Imaging in the School of Engineering at the University of Edinburgh. He obtained his PhD in 1990 from the University of Glasgow. From 1991, he was a research engineer at the Swiss Centre for Microelectronics, Neuchatel, Switzerland. In 1996, he was appointed senior VLSI engineer at VLSI Vision Ltd, Edinburgh, UK where he worked on the world’s first single chip video camera.
From 2000, as principal VLSI engineer in STMicroelectronics Imaging Division he developed image sensors for mobile phone applications. He joined University of Edinburgh in 2005, designing the first SPAD image sensors in nanometer CMOS technologies in the MegaFrame and SPADnet EU projects. This research activity led to the first volume SPAD time-of-flight products in 2013 in the form of STMicroelectronics FlightSense series, which perform an autofocus-assist now present in over 2 billion smartphones. He benefits from a long-term research partnership with STMicroelectronics in which he explores medical, scientific and high speed imaging applications of SPAD technology. In 2014, he was awarded a prestigious ERC advanced fellowship. He is an advisor to Ouster Automotive and a Fellow of the IEEE and the Royal Society of Edinburgh.
Monday, August 25, 2025
Sony 3-layer stacked sensor
Tranlated from baidu.com: https://baijiahao-baidu-com.translate.goog/s?id=1839758590887948034&wfr=spider&for=pc&_x_tr_sl=zh-CN&_x_tr_tl=de&_x_tr_hl=de&_x_tr_pto=wapp
In-depth: Sony's three-layer CIS changes the global sensor market
Source: AI Core World (Aug 7, 2025)
Sony is developing a three-layer image sensor
Sony Semiconductor Solutions (SSS) showcased a potentially groundbreaking three-layer image sensor design as part of a presentation to investors, the company's Imaging & Sensing Solutions (I&SS) division announced today. The design promises significant performance improvements.
Although Sony has used stacked sensors in several cameras, including its flagship a1 II, these sensors currently have a dual-layer structure. One layer is the photodiode layer responsible for capturing light, which contains all the light-sensitive pixels; the other layer is the transistor layer located below it, which is responsible for image processing tasks. Sony's core long-term goal is to introduce the crucial third layer in the image sensor stack. This essentially means an expansion of processing power and a leap in image quality.
When other conditions are equal, the stronger the processing power at the sensor level, the better the imaging effect will naturally be. Sony explains that increasing processing power at the sensor level will directly translate into improvements in several key performance areas: dynamic range, sensitivity, noise performance, power efficiency, readout speed, and resolution.
While adding sensor layers doesn't directly change the pixel resolution itself, it unlocks entirely new video recording modes by significantly improving the overall speed and performance of the sensor.
Image sensors remain a core pillar of Sony's strategy in diverse areas including mobile devices, automotive, industrial and cameras. Sony expects the camera-related sensor market to continue expanding at a compound annual growth rate of 9% by fiscal 2030, which indicates that Sony will continue to increase its investment in this field.
Next-generation sensor technology will become a driving force for differentiation
Sony is focusing on R&D in multi-layer sensor stack architectures and advanced process nodes to improve sensitivity, dynamic range, power efficiency and readout speed – cutting-edge technologies that will directly power future Alpha and FX camera series. To achieve these goals, Sony plans to invest a total of nearly 930 billion yen in capital expenditures between 2024 and 2026, about half of which will be dedicated to the research and development and production of advanced image sensor processes.
As outlined in its long-term strategy, Sony is going all out and investing in next-generation sensor technologies, including multi-layer stacked image sensors.
Sony's triple-stacked sensor, used in the Xperia 1 V and adopted by other mainstream smartphone models, significantly improves image quality. The architecture also supports multimodal sensing and on-chip artificial intelligence processing, marking a shift in the industry's focus from simply pursuing resolution to intelligent sensing. The breakthrough in 22nm logic stacking technology is committed to achieving ultra-low power consumption and expanded computing power, among which FDSOI technology is expected to be applied in the field of neuromorphic sensing.
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Also covered by PetaPixel: https://petapixel.com/2025/07/30/sonys-triple-layer-image-sensor-promises-huge-performance-gains/
Sony’s Triple-Layer Image Sensor Promises Huge Performance Gains


